A circuit board includes a first electronic component and a circuit substrate. The first electrode component includes two electrodes. The circuit substrate includes an inner substrate and an outer substrate formed on the inner substrate. The inner substrate defines a receiving cavity, and the first electronic component received in the receiving cavity. Each electrode faces an inner sidewall of the receiving cavity. The inner substrate includes a first insulating layer and a blocking layer embedded in the first insulating layer, an end of the blocking layer exposed from the inner sidewall. The outer substrate defines two through holes. Each through hole passes through a portion of the first insulating layer connected to the inner sidewall and exposes the blocking layer. A top end of each of the two electrodes facing the outer substrate is partially received in one through hole.

To allow attachment of electrolytic capacitors and other relatively large electrical circuit devices to a PCB while meeting size limitations, The PCB can include a full-through opening within which the device can be located. Along one edge of the opening, the PCB includes half-through cuts with a conductive lining extending from the opening, where the pins of the capacitor or other device can rest and form electrical connections. In addition to pins extending radially from one end of the capacitor or other device, the device includes a notch extending from the opposing end. Along the edge of the PCB opening opposing the half-through cuts for the pins, the PCB includes a half-though cut for the device's notch to rest, thereby providing mounting stability.

In an embodiment an electric component includes an electric element with an underside and a lead at the underside and a cooling element comprising an underside, wherein the cooling element is arranged below the electric element, and wherein the cooling element is a heat bridge configured to conduct heat from the underside of the electric element to the underside of the cooling element and/or from the lead to the underside of the cooling element.

A semiconductor component package utilizing a cavity substrate is disclosed. The package effectively connects terminals of the semiconductor component to substrate pads on the semiconductor surface within the cavity using a solder preform. The solder preform is configured to fit the semiconductor component within a preform cavity. The solder preform is positioned over the pads on the cavity substrate and reflowed, forming interconnections between the semiconductor component terminals and the substrate pads. In addition, solder fillets are formed surrounding the semiconductor terminal to advantageously increase the strength of the interconnections, providing a more reliable semiconductor component package.

The present disclosure provides a circuit board assembly, relating to the field of electronic devices, the circuit board assembly includes: a circuit board; a chip, fixedly connected to the circuit board; a current-carrying component, fixedly connected to the circuit board; a heat dissipation component, fixedly connected to the chip and the current-carrying component. The heat dissipation component of this circuit board assembly has a larger connection area, which improves the connection reliability of the heat dissipation component.

A multi-layer printed circuit board includes a substrate having a first side and a second side opposite the first side, a central via pad disposed on the first side and having a plurality of central-extensions extending outwardly therefrom, a first via pad disposed on the first side and having at least one first-extension extending outwardly therefrom, a second via pad disposed on the first side and having at least one first-extension extending outwardly therefrom, wherein each central-extension has a first-connection-edge, wherein each first-extension has a second-connection-edge, wherein a first first-connection edge of a first central-extension faces a second-connection-edge of the first via pad, and a line perpendicular to the first first-connection edge and to the second-connection-edge of the first via pad forms an angle with a via-to-via axis line between the central via pad and the first via pad, and the angle is greater than a predetermined threshold angle.

A semiconductor storage device including a board, an electronic component, and a holder. The board has a region with an opening. The electronic component includes a component body disposed in the opening and a lead protruding from the component body and connected to the board. The holder is disposed in the opening and supports the component body. The region includes first and second edges on either side of the opening, the first and second edges extending along a first direction and separated from each other in a second direction crossing the first direction. The holder includes a holder body at least partially formed in an annular shape and into which the component body is inserted, a first groove extending along the first direction and engaged with the first edge, and a second groove extending along the first direction and engaged with the second edge.