A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic electronic component are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body comprising dielectric layers and internal electrodes, the internal electrodes having at least one of the dielectric layers interposed therebetween; and first and second external electrodes disposed on first and second end portions of the first ceramic body. The ceramic electronic component includes a second ceramic body coupled to a lower portion of the multilayer ceramic capacitor and made of ceramic; and first and second terminal electrodes disposed on first and second end portions of the second ceramic body and connected to the first and second external electrodes, and the multilayer ceramic capacitor and the ceramic electronic component have different lengths.

According to an embodiment of the present disclosure, since the electronic components are fixed on the PCB by the clamp, post processing, such as soldering or application of an adhesive, may be not needed. Also, since the PCB can be spaced from the adjacent configurations by the clamp, the efficient layout of the PCB is possible, resulting in an improvement of productivity of the PCB. In accordance with an aspect of the present disclosure, there is provided a clamp comprises a fixing part configured to surround at least one part of the outer surface of an electronic component, a connection part extending from the fixing part, and penetrating a Printed Circuit Board (PCB), an interference part provided in at least one of the fixing part or the connection part, and configured to be interfered by the PCB and a spacing part protruding from at least one of the connection part or the fixing part.

Resistive switching memory architectures disclosed herein are capable of achieving fast read/write times and, particularly in the case of multi-bank parallel processing, executing many read or write operations per second. Because resistive switching memory is not guaranteed to be error free, resistive memory controllers can be programmed for error management when paired with such memory architectures. To reduce error management overhead, a dedicated error pin is provided to mitigate or avoid the need for a status read in conjunction with each read or write operation issued to a memory device. A status read can be implemented in response to an error signal on the dedicated error pin, but otherwise can be avoided.

A ceramic electronic component includes an electronic component body and portions of first and second metal terminals covered with an outer resin material. The first metal terminal includes, connected in order, a first terminal joint portion, a first extension portion extending in a direction toward a mounting surface, and a first mount portion extending toward a side opposite to the electronic component body. The second metal terminal includes, connected in order, a second terminal joint portion, a second extension portion extending in the direction toward the mounting surface, and a second mount portion extending toward a side opposite to the electronic component body. The first and second mount portions respectively include first and second protrusions protruding toward the mounting surface. The outer resin material includes a protruding portion protruding toward the mounting surface.

A display device includes: a display panel including a first curved portion that is curved; and a drive circuit board on which a circuit for driving the display panel is formed. The drive circuit board includes a second curved portion that is curved following the first curved portion, and each of a plurality of components including one of a resistor and a capacitor and mounted on the second curved portion is mounted on the drive circuit board so that a crosswise direction of the component in plan view, which is a direction perpendicular to an alignment direction of a plurality of electrodes of the component, follows a curving direction of the second curved portion.

An electronic assembly that includes a substrate having an aperture which extends through the substrate. The electronic assembly further includes a gull wing electronic package that includes leads which are solder mounted to the substrate such that the gull wing electronic package is within the aperture in the substrate, wherein the aperture is concentric with an exterior of the gull wing electronic package.

Embodiments are generally directed to vertically embedded passive components. An embodiment of a device includes a semiconductor die; and a package coupled with the semiconductor die. The package includes one or more passive components connected with the semiconductor die, the one or more passive components being embedded vertically in the package substrate, each of the passive components including a first terminal and a second terminal. A first passive component is embedded in a through hole drilled in the package, the first terminal of the first passive component being connected to the semiconductor die by a via through an upper buildup layer on the package.

A light engine for a tube lamp has a substrate defining a longitudinal direction, having at least three conductive traces extending in the longitudinal direction. At least two of the conductive traces are divided into a plurality of trace sections. The light engine further includes a plurality of semiconductor light emitting elements, each light emitting element having two electric terminals and being arranged perpendicular to the longitudinal direction and electrically connected with a first electric terminal to one of the conductive traces and with a second electric terminal to another one of the conductive traces.

A stacked output structure of a capacitive power supply for welding equipment, having a plurality of capacitors to be connected in parallel, two electrodes of each capacitor are respectively provided with a pin including a long pin and a short pin; at least two PCB bus plates placed in stack are provided above the capacitor is provided. A lower PCB bus plate is connected with the short pin; and a pass-through hole is provided, at a position corresponds to the long pin, on the lower PCB bus plate. The long pin passes through the pass-through hole in the lower PCB bus plate and is connected with an upper PCB bus plate. There is a gap between the long pin and an inner wall of the pass-through hole.

What is described is a mounting aid for mounting electrical components, in particular electrolytic capacitors or chokes, on a printed circuit board, said mounting aid comprising a body, which has compartments for receiving the electrical components, wherein the compartments have a base with openings for the insertion of connection wires of the electrical components, and metal parts fastened to the body, which metal parts each form at least one contact pin on the underside of the body and each from a busbar for connection to electrical components in a plurality of compartments of the body.