A surface mount (SMD) diode taking a runner as the body and a manufacturing method thereof are described. An elongated runner groove is adopted to cure and package groups of diode chips arranged side by side and corresponding copper pins thereon, with the utilization rate of epoxy resin up to 90% or more. The use cost of epoxy resin is thus reduced, and environmental pollution is also reduced.

A resin molded substrate has at least a pair of terminal through holes for allowing lead terminals of a cylindrical capacitor to be inserted through, and at least one protrusion for supporting a side of a bottom portion of the capacitor so as to space from a front surface of the substrate the side of the bottom portion of the capacitor having the lead terminals inserted through the terminal through holes. The pair of lead terminals at the bottom portion are inserted through the terminal through holes of the resin molded substrate, whereby the capacitor is mounted in an upright state with a solder, so that the protrusion spaces the side of the bottom portion from the front surface of the resin molded substrate.

Disclosed is a ceramic electronic component having external electrodes on each of opposed end portions of a rectangular parallelepiped component body. A first direction dimension, a second direction dimension and a third direction dimension of the component body satisfy a condition of second direction dimension>first direction dimension>third direction dimension. The external electrodes are of a five-face type having a first face portion, a second face portion, a third face portion, a fourth face portion and a fifth face portion. At least one edge of the fourth face portion and the fifth face portion of the external electrode has a recess portion recessed from the edge toward the first face portion. Both side portions in the third direction of the recess portion are covering portions which cover ridge portions of the two faces in the second direction of the component body.

An embodiment of an electronic system comprises a main board, and a modular capacitor subassembly mechanically and electrically coupled to the main board, wherein the modular capacitor subassembly provides backup power for the main board, and wherein the main board is adapted for use in at least two housing form factors. Other embodiments are disclosed and claimed.

Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.

According to one embodiment, a semiconductor storage device includes a housing, a first board, a heat generating component, an electronic component, and a thermal-conductive sheet. The housing has a first vent hole. The first board is accommodated in the housing. The heat generating component is mounted on the first board. The electronic component is disposed between the heat generating component and the first vent hole. The thermal-conductive sheet is provided to extend over the heat generating component and the electronic component, or provided to extend from a region positioned on a rear side of the heat generating component on the first board to the electronic component.

A mounting structure for mounting an electrolytic capacitor on a printed circuit board (PCB) of an airbag electronic control unit (ECU) includes a cap for receiving a lead end of the capacitor. The cap includes openings for receiving electrical leads of the capacitor. The cap supports electrical connectors, which electrically contact the electrical leads when a lead end of the capacitor is installed in the cap. The electrical connectors include portions for interfacing with the PCB to electrically connect the electrical connectors to the PCB. The cap also includes a vent that provides fluid communication from inside the cap to outside the cap. The vent is configured to vent dielectric liquids and gases discharged from the lead end of the capacitor during thermal cycles and/or charging cycles of the capacitor.

A circuit wire crossing structure, comprising a substrate with a supporting surface, an electrical circuit disposed on the supporting surface of the substrate, with the electrical circuit comprising, two lateral wires with one of the wires having a first terminal and a second terminal and another one of the lateral wires having a second terminal, wherein the first terminal and the second terminal are spaced apart from each other, and a central wire, disposed between and apart from the first terminal and the second terminal, and an electronic component arranged above the supporting surface and two terminals of the electronic component connecting with the first terminal and the second terminal, wherein the electronic component has an insulating shell facing the central wire, and an orthographic projection of the electronic component to the supporting surface extends across an orthographic projection of the central wire to the supporting surface.

A printed circuit board includes a first chip component, a second chip component, and a printed wiring board. The first chip component and the second chip component each has a length L2 in the longitudinal direction. A relationship of 0.894L2/L11.120 is satisfied, where L1 represents a length of the first opening in the longitudinal direction. A relationship of 0.894L2/L41.120 is satisfied, where length L4 represents a length of the second opening in the longitudinal direction. A relationship of 0.183L.sub.OW/L.sub.iA0.309 is satisfied, where L.sub.iA represents a length of the first land in the longitudinal direction, and L.sub.OA represents a thickness of solder on an end surface of the first electrode. A relationship of 0.183L.sub.OB/L.sub.iB0.309 is satisfied, where L.sub.iB represents a length of the second land in the longitudinal direction, and L.sub.OB represents a thickness of solder on an end surface of the second electrode.

A method of providing power input to a flexible printed circuit. The method involves the step of bisecting a flexible printed circuit into a first conductive area adapted for power input and a second conductive area adapted for ground connection. In accordance with this teaching, power input is provided to electrical components attached to the flexible printed circuit via first conductive area and second conductive area, rather than through individual control lines.