A resin molded substrate has at least a pair of terminal through holes for allowing lead terminals of a cylindrical capacitor to be inserted through, and at least one protrusion for supporting a side of a bottom portion of the capacitor so as to space from a front surface of the substrate the side of the bottom portion of the capacitor having the lead terminals inserted through the terminal through holes. The pair of lead terminals at the bottom portion are inserted through the terminal through holes of the resin molded substrate, whereby the capacitor is mounted in an upright state with a solder, so that the protrusion spaces the side of the bottom portion from the front surface of the resin molded substrate.

An electronic assembly that includes a substrate having an aperture which extends through the substrate. The electronic assembly further includes a gull wing electronic package that includes leads which are solder mounted to the substrate such that the gull wing electronic package is within the aperture in the substrate, wherein the aperture is concentric with an exterior of the gull wing electronic package.

A contacting arrangement between an electrical component and a circuit carrier, the component being connected to a connection element formed as a part separate from the component, and the connection element being electroconductively contacted directly with the circuit carrier via at least one press-fit connection.

Disclosed is a ceramic electronic component having external electrodes on each of opposed end portions of a rectangular parallelepiped component body. A first direction dimension, a second direction dimension and a third direction dimension of the component body satisfy a condition of second direction dimension >first direction dimension >third direction dimension. The external electrodes are of a five-face type having a first face portion, a second face portion, a third face portion, a fourth face portion and a fifth face portion. At least one edge of the fourth face portion and the fifth face portion of the external electrode has a recess portion recessed from the edge toward the first face portion. Both side portions in the third direction of the recess portion are covering portions which cover ridge portions of the two faces in the second direction of the component body

A ceramic electronic component includes an electronic component body and portions of first and second metal terminals covered with an outer resin material. The first metal terminal includes, connected in order, a first terminal joint portion, a first extension portion extending in a direction toward a mounting surface, and a first mount portion extending toward a side opposite to the electronic component body. The second metal terminal includes, connected in order, a second terminal joint portion, a second extension portion extending in the direction toward the mounting surface, and a second mount portion extending toward a side opposite to the electronic component body. The first and second mount portions respectively include first and second protrusions protruding toward the mounting surface. The outer resin material includes a protruding portion protruding toward the mounting surface.

An electronics assembly is provided herein. The electronics assembly includes an inverter storage unit provided in a housing. An electronics module supplies power to an electric motor. The electronics module is integrated with the inverter storage unit. One or more capacitors is disposed within the electronics module. A heating device is thermally coupled with and disposed externally of the one or more capacitors.

Cache memory for resistive switching memory modules is provided herein. The cache memory can reside on a separate DIMM from the resistive switching memory, in some embodiments, or can share a common DIMM with the resistive switching memory. Cache management protocols are provided to service read and write policies for managing interaction of data between the cache memory and the resistive switching memory. In various embodiments, memory controllers are optimized for physical characteristics of resistive switching memory, and cache management protocols can be implemented to take advantage of these characteristics.

A surface mount (SMD) diode taking a runner as the body and a manufacturing method thereof are described. An elongated runner groove is adopted to cure and package groups of diode chips arranged side by side and corresponding copper pins thereon, with the utilization rate of epoxy resin up to 90% or more. The use cost of epoxy resin is thus reduced, and environmental pollution is also reduced.

A method of providing power input to a flexible printed circuit. The method involves the step of bisecting a flexible printed circuit into a first conductive area adapted for power input and a second conductive area adapted for ground connection. In accordance with this teaching, power input is provided to electrical components attached to the flexible printed circuit via first conductive area and second conductive area, rather than through individual control lines.

Embodiments include a method of stress testing an electronics package with components that include a visual indicator. In an embodiment, the method comprises populating a plurality of components on an electronics package. In an embodiment, the plurality of components each comprise a visual indicator that is responsive to heat. In an embodiment, the method further comprises stress testing the electronics package and categorizing the plurality of components based on the visual indicators. In an embodiment, the method may further comprise modifying the plurality of components.