An electronic device comprising: a substrate having a curved surface, a printed circuit board, and plural flexible wiring substrates, each of two of the plural flexible substrates has a terminal portion that is connected to the curved surface, the printed circuit board has a cutout between the two flexible wiring substrates.

An object has a first conductor structure, an electronic unit, a second conductor structure galvanically isolated from the first conductor structure and/or from the electronic unit but coupleable electrically thereto, and a carrier structure with a first pliable carrier layer having a first carrier layer region and with a second carrier layer region. The carrier structure is a layer stack in a base surface region including at least part of the carrier structure base surface and includes at least the first and second carrier layer regions. At least part of the conductor structures is in the base surface region. The first conductor structure and/or the electronic unit is joined with the first carrier layer region. The second conductor structure is joined with the second carrier layer region and coupleable electrically to the first conductor structure and/or the electronic unit by a layer stack surface region outside the electronic unit.

A chip on film for a display device, the chip on film includes: a base substrate; a lead wire disposed on the base substrate; and a driving chip connected to the lead wire, wherein the lead wire includes: a first lead part having a first thickness; and a second lead part disposed between the first lead part and the driving chip and having a second thickness greater than the first thickness, the second lead part being connected to the driving chip. The first lead part and the second lead part include a same material.

A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

A flip chip interconnection including a circuit board is disclosed. The circuit board includes a substrate, inner leads, a T-shaped circuit line and a dummy pattern. The inner leads, the T-shaped circuit line and the dummy pattern are located on an inner bonding area of the substrate. The T-shaped circuit line includes a main segment, a branch segment and a connection segment that is connected to the main segment and the branch segment. The main segment and the branch segment are extended along a lateral direction and a longitudinal direction, respectively. The dummy pattern is located between the connection segment and the inner leads.

A film type package includes: a base film having first and second sides; a driver integrated circuit mounted on the base film; first connection pads disposed on a first area of the base film that is adjacent to the first side of the base film, and configured to be connected to a first external circuit; second connection pads disposed on a second area of the base film that is adjacent to the second side of the base film, and configured to be connected to a second external circuit; first signal lines disposed on the base film, and connecting the driver integrated circuit and the first connection pads; second signal lines disposed on the base film, and connecting the driver integrated circuit and the second connection pads; and a plurality of test lines extending from the driver integrated circuit to the first side of the base film.

Performance of a display apparatus is improved. The display apparatus includes: a substrate having a side surface (first side surface); a backlight unit (light supply portion) having a side surface (second side surface); a flexible wiring board having a wiring electrically connected to a terminal (first terminal) and having an insulating film with flexibility covering the wiring; and a double-sided tape. The flexible wiring board is bonded to the side surface of the backlight unit through the double-sided tape.

Provided is a method of manufacturing a curved display device, wherein a tape automated bonding (TAB) tape, which includes a base film, a driving chip formed at an upper portion of the base film, a plurality of one-side outer leads formed to bond an output terminal of the driving chip and a terminal of a liquid crystal display (LCD) substrate by an outer lead bonding (OLB) method, and a plurality of the other-side outer leads formed to bond an input terminal of the driving chip and a terminal of a printed circuit board, is designed so that from the end of the OLB bonding part to the part at which the film begins to bend is greater than or equal to the longitudinal length (E) of the driving chip ((4F−D/2)≥E).

An electronic device comprising: a substrate having a curved surface, a printed circuit board, and plural flexible wiring substrates, each of two of the plural flexible substrates has a terminal portion that is connected to the curved surface, the printed circuit board has a cutout between the two flexible wiring substrates.

A flexible circuit board and display device including the same are disclosed. In one aspect, the flexible circuit board includes a base film including a bending area and a plurality of signal wires formed over the bending area of the base film. At least one through-hole is defined in the base film.