An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.

A socket configured to electrically connect a first electric component and a second electric component, the socket including: a base part including a top surface and a bottom surface; a contact pin provided to extend through the base part and including a pin lower end exposed from the bottom surface; and an abutment part provided in the base part, and including an abutment lower end, the abutment lower end being exposed from the bottom surface to abut on the second electric component and configured to be movable in a vertical direction, the abutment part being configured such that the abutment lower end abuts on the second electric component approaching, in a process of attaching the second electric component, the base part from below to adjust a posture of the base part with respect to the second electric component.

A circuit board and an electronic apparatus using the same are provided. The circuit board includes an integrated-circuit (IC) device arrangement region and an electronic device arrangement region. The circuit board includes a first external wiring layer and an inner wiring layer. The first external wiring layer includes a plurality of first signal traces and a ground extending portion that extend from the IC device arrangement region to the electronic device arrangement region. The inner wiring layer includes a ground portion and an inner signal trace. The ground portion defines an opening region, and the inner signal trace is located in the opening region and extends from a position under the IC device arrangement region to another position under the electronic device region. The ground extending portion and the opening region overlap with each other in a thickness direction of the circuit board.

An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.

A method includes stacking a first layer of insulating material having one or more passages on a substrate. A deformable conductive material is deposited in at least one of the passages in the first insulating layer. A second layer of insulating material is stacked on the first layer of insulating material. The second layer of insulating material at least partially encloses the deformable conductive material in the at least one passage in the first layer of insulating material, and unitizing the first and second layers in a unitizing operation

A socket configured to electrically connect a first electric component and a second electric component, the socket including: a base part including a top surface and a bottom surface; a contact pin provided to extend through the base part and including a pin lower end exposed from the bottom surface; and an abutment part provided in the base part, and including an abutment lower end, the abutment lower end being exposed from the bottom surface to abut on the second electric component and configured to be movable in a vertical direction, the abutment part being configured such that the abutment lower end abuts on the second electric component approaching, in a process of attaching the second electric component, the base part from below to adjust a posture of the base part with respect to the second electric component.

An IC assembly including an exposed pad integrated circuit (“IC”) package having a thermal pad with a top surface and a bottom surface and with at least one peripheral surface portion extending transversely of and continuous with the bottom surface. The bottom surface and the at least one peripheral surface are exposed through a layer of mold compound. Also, methods of making an exposed pad integrated circuit (“IC”) package assembly. One method includes optically inspecting a solder bond bonding a thermal pad of an exposed pad IC package to a printed circuit board. Another method includes wave soldering an exposed pad of an IC package to a printed circuit board.

A semiconductor device including: a semiconductor chip; a plurality of insulating substrates mounted with the semiconductor chip; a printed circuit board facing the plurality of insulating substrates; and a conductive member for electrically connecting the plurality of insulating substrates and the printed circuit board is provided. The printed circuit board has a first through part arranged between the plurality of insulating substrates being adjacent to each other in a top view, and a second through part different from the first through part in shape in the top view.

A heat sink device including a body and at least one main cold plate in contact with the at least one casing of an electronic device, the electronic device furthermore being provided with at least two pins for connecting to a printed circuit board and generating heat when it is activated. At least one secondary cold plate is in contact with the printed circuit board in the vicinity of the connecting pins.