A semiconductor apparatus includes a metal body in which a through hole is formed, a socket that covers the metal body without closing the through hole, a connection terminal connected to the metal body and exposed to an outside of the socket, a control board having a metal pattern and a circuit pattern, and a semiconductor chip having a control terminal connected to the circuit pattern via the through hole without being in contact with the metal body, the connection terminal being connected to the metal pattern.

Provided is a method of manufacturing a printed circuit board having test points in which test points and pads are formed on the printed circuit board and then are electrically connected to each other, so that it is possible to form the pads having a pitch interval smaller than that in the related art. This may contribute to miniaturization of the printed circuit board by mounting a connector smaller than that in the related art on the printed circuit board, and may enable the preformed test points to be used as they are even after the connector used is removed from the printed circuit board. Also provided is a printed circuit board manufactured thereby.

A circuit module includes a circuit board including an insulating layer, first and second signal conductors, a ground conductor, and a ground conductor layer; and an electronic component including first and second signal terminals and a first ground terminal. The ground conductor includes a first strip portion parallel to the first and second signal conductors. When a portion of the first signal conductor parallel to the second signal conductor and the first signal terminal are set as a first signal wiring line and a portion of the second signal conductor parallel to the first signal conductor and the second signal terminal are set as a second signal wiring line, the circuit board includes a first strip portion connection via conductor that connects the first strip portion and the ground conductor layer in a region where the first and second signal wiring lines are parallel to each other.

A printed circuit board and a power copper surface configuration method are provided. The method includes the following steps: configuring a first power supply component, a second power supply component, a power sink component, a convergence copper surface portion, a first grounding copper surface portion and a second grounding copper surface portion; determining whether currents of the first and second power supply components flow to the power sink component through the convergence copper surface portion; when the currents of the first and second power supply components flow to the power sink component through the convergence copper surface portion, determining whether the convergence copper surface portion conforms to a current balancing design of the printed circuit board according to at least one of first and second tolerable difference values and an average current. When the convergence copper surface portion conforms to the current balancing design, the method is ended.

An electronic device according to one embodiment includes a wiring substrate, the wiring substrate having a first wiring connected to a first external terminal and a second wiring connected to a second external terminal and extending along the first wiring. Additionally, the above electronic device has a semiconductor device mounted on the above wiring substrate and electrically connected to each of the first and second wirings. Further, the above electronic device has a capacitor mounted on the above wiring substrate and electrically connected to the semiconductor device via each of the above first and second wirings. Furthermore, a distance between the above semiconductor device and capacitor is shorter than a distance between each of the above first and second external terminals and the above capacitor.

An axial flow fan includes a fan frame and an impeller received in the fan frame. The fan frame includes a base shell and a flange being formed on the base shell. The base shell further includes an air inlet facing away from the flange. The flange includes a first air outlet. The flange further includes a second air outlet. Air flows through the second air outlet in a direction perpendicular to the air flowing through the first air outlet.

A solder component includes one or more terminal members each having a bending portion bending in a direction crossing a surface of a substrate and being connected to the surface of the substrate, and four or more substrate connection portions formed at end portions of the terminal members, three substrate connection portions out of the four or more substrate connection portions each having a width narrower than a width of the bending portion of the corresponding terminal member, when the solder component is disposed on the surface of the substrate, only the three substrate connection portions being in contact with the surface of the substrate, and no matter where a contact point contacting the surface of the substrate is provided on each substrate connection portion, a mass center of the solder component being located inside a triangle determined by three contact points of the three substrate connection portions.

A solder component includes one or more terminal members each having a bending portion bending in a direction crossing a surface of a substrate and being connected to the surface of the substrate, and four or more substrate connection portions formed at end portions of the terminal members, three substrate connection portions out of the four or more substrate connection portions each having a width narrower than a width of the bending portion of the corresponding terminal member, when the solder component is disposed on the surface of the substrate, only the three substrate connection portions being in contact with the surface of the substrate, and no matter where a contact point contacting the surface of the substrate is provided on each substrate connection portion, a mass center of the solder component being located inside a triangle determined by three contact points of the three substrate connection portions.

A component holding device for the fixed-position arrangement of an electric component on a circuit board, having a support side for receiving the electric component, wherein at least one pretensioning element and at least one first latching element for the fixed-position latching of the electric component are provided on the support side, and the at least one pretensioning element is designed to exert a pretensioning force on the electric component, which presses the electric component against the at least one first latching element, and having at least one second latching element on an underside lying opposite the support side, wherein the second latching element is designed to fix the component holding device in a predefined location in a fixed position on the circuit board.

An electronic device package includes a molded case and a plurality of leads. The molded case includes integrally formed side walls, end walls, and a top wall, the side walls, end walls and top wall defining an interior for receiving one or more electronic components. Each side wall includes a top portion, an intermediate portion, and a bottom portion. The top portion includes plate-like structure having first and second surfaces extending downward from the top wall. The intermediate portion includes a shelf structure having a shelf surface that extends from the first surface in a direction away from the interior, and a third surface extending downward from the shelf surface. The bottom portion extends downward from the intermediate portion. The leads are molded at least in part of the intermediate portion. Each lead has a first end portion exposed in the interior, and a second end portion extending along a bottom edge of the bottom portion.