A surface-mounted integrated circuit (IC) package is disclosed that has unwanted flux removed from surface-mounted IC. A bottom termination component (BTC) includes lands and a thermal pad. The lands provide an electrical connection from the BTC and the thermal pad provides heat transfer from the BTC. The thermal pad includes vias that are configured to remove flux generated from solder applied to the surface-mounted IC as the surface-mounted IC is assembled. A printed circuit board (PCB) is mourned to the BTC and is electrically connected to the BTC via the lands and receives heat transfer from the BTC via the thermal pad and includes a reservoir. The reservoir is configured to pull flux positioned between the lands into the reservoir as the flux is generated from the solder applied to the surface-mounted IC as the BTC is mounted to the PCB and as the surface-mounted IC is assembled.

A component carrier includes a first level stack of first plural of electrically conductive layer structures and/or first electrically insulating layer structures; a first component aligned within a first through hole cut out in the first level stack such that one of an upper or a lower surface of the first component is substantially flush with an respective upper or a lower surface of the first level stack second electrically conductive layer structures and/or second electrically insulating layer structures attached onto the upper and the lower surface of the first level stack thereby covering the first component at the upper and the lower surface of the first component and pressed to form a second level stack. A second component is aligned within a second through hole cut out in the second level stack such that one of upper or a lower surface of the second component is substantially flush with an upper or a lower surface of the second level stack.

The present disclosure provides an integrated circuit comprising a main body and pins. The main body has a top and a bottom. The pins comprise upper pins placed on the top of the main body, and lower pins placed on the bottom of the main body.

Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and an aperture extending at least partially into the module material. The computer modules can also include a microelectronic package carried by the module substrate. The microelectronic package includes a semiconductor die carried by a package substrate. At least a portion of the semiconductor die extends into the substrate material via the aperture.

A hard disk drive flexure assembly includes a base layer, a conductive layer, a plurality of electrical pads over the conductive layer, and a sidewall layer including sidewalls on each side of and extending higher than a corresponding electrical pad. Pre-solder bumps are formed between the sidewalls and over each pad. Use of sidewalls prevents the pre-solder bumps from undesirably bridging to an adjacent electrical pad and forming a short circuit, which might otherwise cause head-gimbal assembly (HGA) manufacturing failures and consequent increased cost. These techniques are especially relevant with narrow, high-density, small pitch electrical pads.

A surface-mounted integrated circuit (IC) package is disclosed that has unwanted flux removed from surface-mounted IC. A bottom termination component (BTC) includes lands and a thermal pad. The lands provide an electrical connection from the BTC and the thermal pad provides heat transfer from the BTC. The thermal pad includes vias that are configured to remove flux generated from solder applied to the surface-mounted IC as the surface-mounted IC is assembled. A printed circuit board (PCB) is mounted to the BTC and is electrically connected to the BTC via the lands and receives heat transfer from the BTC via the thermal pad and includes a reservoir. The reservoir is configured to pull flux positioned between the lands into the reservoir as the flux is generated from the solder applied to the surface-mounted IC as the BTC is mounted to the PCB and as the surface-mounted IC is assembled.

A number of different sealed interfaces for power modules are described. In one example, a sealed interface includes a printed circuit board including a contact pad for power conduction to a bus bar of the printed circuit board, a semiconductor module including at least one power transistor, a terminal pin electrically coupled to the power module, and a housing for the power module. The housing includes an open terminal aperture that extends through the housing. The printed circuit board is seated upon the open terminal aperture, to close and seal the open terminal aperture, with the contact pad positioned within the open terminal aperture. The terminal pin contacts the contact pad of the printed circuit board within the open terminal aperture, and the open terminal aperture comprises a transitional feature to abate electric field intensity around an interface between the open terminal aperture and the printed circuit board.

Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and an aperture extending at least partially into the module material. The computer modules can also include a microelectronic package carried by the module substrate. The microelectronic package includes a semiconductor die carried by a package substrate. At least a portion of the semiconductor die extends into the substrate material via the aperture.

A printed-wiring board has a land group with which a terminal group of a semiconductor package has been joined, a first conductor pattern arranged in a mounting area where the semiconductor package is mounted and joined with a heat radiation plate of the semiconductor package, a second conductor pattern, at least a part of which is arranged on the outside of the mounting area, and a third conductor pattern which connects the first and second conductor patterns. The land group includes a first land adjacent to the third conductor pattern and a second land which is not adjacent to the third conductor pattern, and the first land is formed in a shape different from that of the second land so as to be away from the third conductor pattern.

Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and an aperture extending at least partially into the module material. The computer modules can also include a microelectronic package carried by the module substrate. The microelectronic package includes a semiconductor die carried by a package substrate. At least a portion of the semiconductor die extends into the substrate material via the aperture.