A light source module includes a light-emitting device having an upper surface and a lower surface and including: at least one light-emitting element and a plurality of conductive regions on the upper surface of the light-emitting device; a mounting substrate having an upper surface on which a lower surface side of the light-emitting device is located, the mounting substrate including conductive patterns on the upper surface of the mounting substrate, each conductive pattern including a device-side connecting portion and an external side connecting portion; and a plurality of conductive members each having a first end bonded to a respective one of the device-side connecting portion and a second end opposite to the first end, the second end being in contact with a respective one of the conductive region by elasticity to electrically connect the respective one of the conductive regions and a respective one of the conductive patterns.

A power control module includes a power device having a first side and a second side opposite from the first. The power control module includes a printed wiring board (PWB) spaced apart from the first side of the power device. The PWB is electrically connected to the power device. A heat sink plate is soldered to a second side of the transistor for heat dissipation from the transistor. The PWB and/or the heat sink plate includes an access hole defined therein to allow for access to the transistor during assembly. A method of assembling a power control module includes soldering at least one lead of a power device to a printed wiring board (PWB), pushing the power device toward a heat sink plate, and soldering the power device to the heat sink plate.

Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.

To eliminate signal loss and sources of signal attenuation, a connection methodology is utilized which enables high-speed signals to be directly communicated from particular integrated circuits housed on a printed circuit board, to other locations within a system. More specifically, a signal escape strategy directly connects a high-speed cable to a point on the circuit board which is very close to the integrated circuit itself. A back-side connection methodology is utilized so that electrical signals pass directly from the integrated circuit through a via, to a connection point on the backside of the circuit board. To accommodate this connection, a specially designed interposer and related paddle cards are utilized so the high-speed communication cable can be easily attached.

Disclosed is an circuit board module for a display device having a rigid-flex circuit board structure which is capable of improving spatial efficiency of a mother board, and simplifying a structure of the mother board, a method for manufacturing the same, and a display device, wherein a rigid-flex printed circuit board, a rigid printed circuit board, and a flexible printed circuit cable are respectively manufactured on the different mother boards, separately, and then combined with one another, whereby it is possible to realize the more-improved spatial efficiency of the mother board in comparison to a case of manufacturing the rigid-flex printed circuit board, the rigid printed circuit board, and the flexible printed circuit cable on one mother board.

A stem has a stem body that has a first surface to be placed on a flexible substrate, a second surface opposite to the first surface, and a through hole passing through the first surface and the second surface, a cylindrical body that is fitted into the through hole of the stem body, and a lead that is inserted into the cylindrical body and fixed to the cylindrical body with a fixing member and that has an end portion protruding from the first surface of the stem body. The cylindrical body has a protrusion that protrudes toward the flexible substrate from the first surface of the stem body and surrounds an outer circumferential surface of the end portion of the lead.

Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.

A soldering fastening element and a method for mounting the soldering fastening element are introduced. The soldering fastening element is soldered to a first circuit board so as for a second board to be coupled thereto. The soldering fastening element includes a body soldered to the first circuit board, a head for fastening the second board in place, and a neck which connects the body and the head. When in use, the soldering fastening element is contained in a carrier, taken out of the carrier with an automated tool, transferred to the first circuit board, and heated through a solder layer on the first circuit board such that the body gets soldered to the first circuit board to form a module member. Therefore, the second board gets coupled to the first circuit board through the head and neck.

An electronic module includes a printed circuit board (PCB) element, a base with a first electrically conductive contact element, and an electronic component with a second electrically conductive contact element. The base is fastened on and electrically connected to the PCB element. The electronic component is electrically connected to the base by an electric contact region between the first and second contact elements. A first portion of the first contact element protrudes from the base on a first side of the base facing away from the PCB element. The first portion of the first contact element and/or a second portion of the second contact element has a resilient configuration such that the electronic component is mechanically fastened to the base by a spring force between the first and second contact elements. The electronic module in one embodiment is configured for a transmission controller or an electric vehicle.

Trace transfer techniques can be used to couple touch electrodes to touch sensing circuitry with a reduced border region around a touch sensor panel. Touch electrodes on a first side of the substrate can be routed to a bond pad region on the second side of the substrate via a trace transfer technique to enable single-sided bonding of a double-sided touch sensor panel. Trace transfer techniques can also be used to couple conductive traces on a first side of the substrate to a flex circuit oriented perpendicular to or otherwise not parallel to the first side of the substrate. Orienting the flex circuit in this way can allow the flex circuit to connect to touch circuitry with reduced bending as compared with the amount of bending of the flex circuit when oriented substantially parallel to the substrate.