A method for forming a circuit pattern on a surface of a 3D structure includes: forming a first insulation layer on the surface of the 3D structure; forming a conductive pattern on the first insulation layer; forming a second insulation layer on the conductive pattern except for a circuit element mounting region; and mounting one or more circuit elements on the circuit element mounting region.

Readily manufactured structures for sealing or encapsulating devices in system-in-a-package modules, such that the modules are easily assembled, have a low-profile, and are space efficient. One example may provide readily manufactured covers for SIP modules. These modules may be easily assembled by attaching the cover to a top side of a substrate. These SIP modules may have a low-profile, for example when their height is reduced using one or more recesses in a bottom surface of a top of the recess, where the one or more recesses are arranged to accept one or more components. These SIP modules may be made space efficient by placing an edge of a cover near an edge of the substrate and connecting the plating of the cover using side plating on, or vias through, the substrate.

The present disclosure provides a circuit board assembly and a display device. The circuit board assembly comprises a circuit board main body printed with a ground line which is grounded, and an electronic component and an electrostatic shielding cover defined on a side of the circuit board main body. The electrostatic shield cover covers the electronic component and electrically connects with the ground line.

An electromagnetic shield is adapted to be mounted on a circuit board and to shield electromagnetic radiation produced by an electronic component. The electromagnetic shield includes a cover unit and a conductive surrounding wall. The cover unit includes a metallic main body having an abutment portion adapted to be connected to the electronic component. The conductive surrounding wall is connected to the cover unit, is adapted to abut tightly against the circuit board, and is adapted to cooperate with the main body and the circuit board to define an electromagnetic shielding space that encloses the electronic component.

There is provided a circuit board including a laminated structure, a plurality of dielectric layers and a plurality of conductive layers. A connector and a circuit to which a signal is input via the connector are attached to a first conductive layer arranged on an outermost side of the circuit board. The first conductive layer includes a space between a first area in which the first conductive layer and an exterior of the connector are electrically connected and a second area in which the first conductive layer and the circuit are electrically connected, and at least one conductive layer different from the first conductive layer does not have a space between an area in which the at least one conductive layer is electrically connected to the first area and an area in which the at least one conductive layer is electrically connected to the second area.

An electromagnetic interference shielding structure is provided. The electromagnetic interference shielding structure includes a shield pad and a shield can. The shield pad is configured to surround at least one circuit element mounted on a printed circuit board, and to be grounded to a ground pad formed on a printed circuit board. The shield can include an upper plate, and a sidewall extending from the upper plate and partly embedded in the shield pad.

A circuit board according to an embodiment includes an insulating portion; and a pattern portion disposed on the insulating portion, wherein the insulating portion includes: a first insulating region, and a second insulating region disposed outside the first insulating region and spaced apart from the first insulating region with a separation region therebetween; wherein the pattern portion includes: a first pattern portion for signal transmission; and a second pattern portion including a dummy pattern separated from the first pattern portion, wherein the first pattern portion includes: a first terminal portion disposed on the first insulating region; a second terminal portion disposed on the second insulating region; and a connection portion disposed on the separation region and connecting between the first terminal portion and the second terminal portion, wherein the second pattern portion includes: a second-first pattern portion disposed on the first insulating region; and a second-second pattern portion disposed on the second insulating region and separated from the second-first pattern portion.

The invention relates to an electronic assembly (1) comprising a printed circuit board (4), an electronic module (2) fixed on a first side (5) of the printed circuit board (4), a casing (3) having a thermally conductive wall (9), fastening means (18) configured to keep the printed circuit board (4) at a distance from the thermally conductive wall (9) inside the casing (3), a housing (7) extending from an inner side (19) of the thermally conductive wall (9), and a cooling module (8) placed in the housing (7) so as to be thermally coupled to both the thermally conductive wall (9) and the electronic module (2), the housing (7) being configured to restrain the movements of the cooling module (8) in any direction parallel to the thermally conductive wall (9).

A surface-mounted integrated circuit (IC) package is disclosed that has unwanted flux removed from surface-mounted IC. A bottom termination component (BTC) includes lands and a thermal pad. The lands provide an electrical connection from the BTC and the thermal pad provides heat transfer from the BTC. The thermal pad includes vias that are configured to remove flux generated from solder applied to the surface-mounted IC as the surface-mounted IC is assembled. A printed circuit board (PCB) is mounted to the BTC and is electrically connected to the BTC via the lands and receives heat transfer from the BTC via the thermal pad and includes a reservoir. The reservoir is configured to pull flux positioned between the lands into the reservoir as the flux is generated from the solder applied to the surface-mounted IC as the BTC is mounted to the PCB and as the surface-mounted IC is assembled.

A circuit board includes an insulating portion and a pattern portion on the insulating portion. The insulating portion includes a first insulating region and a second insulating region outside the first insulating region and spaced apart from the first insulating region with a separation region therebetween. The pattern portion includes a first pattern portion for signal transmission and a second pattern portion including a dummy pattern separated from the first pattern portion. The first pattern portion includes a first terminal portion on the first insulating region, a second terminal portion on the second insulating region, and a connection portion on the separation region and connecting between the first terminal portion and the second terminal portion. The second pattern portion includes a second-first pattern portion on the first insulating region and a second-second pattern portion on the second insulating region and separated from the second-first pattern portion.