Patent classifications
H10K10/464
Nanoparticles
The present invention relates to nanoparticles of π-conjugated polymers. The present invention also relates to an aqueous composition comprising these polymeric nanoparticles, to processes for making the nanoparticles, and to the use of these nanoparticles in the fabrication of electronic devices and components.
Semiconductor devices
A device including a stack of layers defining a first conductor pattern at a first level of the stack and one or more semiconductor channels in respective regions, connecting a pair of parts of the first conductor pattern, and capacitively coupled via a dielectric to a coupling conductor of a second conductor pattern at a second level of the stack. The stack includes at least two insulator patterns over which the first level or second level conductor patterns is formed. A first insulator pattern occupies one or more semiconductor channel regions to provide the dielectric. The second insulator pattern defines one or more windows in the one or more semiconductor channel regions through which the second conductor pattern contacts the first insulator pattern other than via the second insulator pattern. The second insulator pattern overlaps the first insulator pattern outside the one or more semiconductor channel regions.
METHODS OF GRAPHENE GROWTH AND RELATED STRUCTURES
A method and structure for providing uniform, large-area graphene by way of a transfer-free, direct-growth process. In some embodiments, a SAM is used as a carbon source for direct graphene synthesis on a substrate. For example, a SAM is formed on an insulating surface, and a metal layer is formed over the SAM. The metal layer may serve as a catalytic metal, whereby the SAM is converted to graphene following an annealing process. The SAM is deposited using a VPD process (e.g., an ALD process and/or an MLD process). In some embodiments, a CNT having a controlled diameter may be formed on the surface of a nanorod by appropriately tuning the geometry of the nanorod. Additionally, in some embodiments, a curved graphene transistor may be formed over a curved oxide surface, thereby providing a band gap in a channel region of the graphene transistor.
METHOD FOR FORMING NANOSTRUCTURE AND FIELD EFFECT TRANSISTOR DEVICE ON A SUBSTRATE
A method for forming a nanostructure array and a field effect transistor device on a substrate are provided. The method for forming the nanostructure array includes: providing a template solution comprising template nanostructures; depositing at least one template nanostructure onto the substrate by contacting the template solution with the substrate; and forming on the substrate at least one fixation structure each intersecting with all or a portion of the at least one template nanostructure to fix all or a portion of the at least one template nanostructure on the substrate.
METHOD OF MANUFACTURING A FIELD EFFECT TRANSISTOR USING CARBON NANOTUBES AND A FIELD EFFECT TRANSISTOR
In a method of forming a gate-all-around field effect transistor (GAA FET), a bottom support layer is formed over a substrate and a first group of carbon nanotubes (CNTs) are disposed over the bottom support layer. A first support layer is formed over the first group of CNTs and the bottom support layer such that the first group of CNTs are embedded in the first support layer. A second group of carbon nanotubes (CNTs) are disposed over the first support layer. A second support layer is formed over the second group of CNTs and the first support layer such that the second group of CNTs are embedded in the second support layer. A fin structure is formed by patterning at least the first support layer and the second support layer.
Patterning devices using fluorinated compounds
A method for producing a spatially patterned structure includes forming a layer of a material on at least a portion of a substructure of the spatially patterned structure, forming a barrier layer of a fluorinated material on the layer of material to provide an intermediate structure, and exposing the intermediate structure to at least one of a second material or radiation to cause at least one of a chemical change or a structural change to at least a portion of the intermediate structure. The barrier layer substantially protects the layer of the material from chemical and structural changes during the exposing. Substructures are produced according to this method.
COMPOSITION CONTAINING ORGANIC SEMICONDUCTOR, SOLUTION FOR FORMING ORGANIC SEMICONDUCTOR LAYER, ORGANIC SEMICONDUCTOR LAYER, AND ORGANIC THIN FILM TRANSISTOR
Provided are (i) a solution for forming an organic semiconductor layer which solution has an excellent coating property, (ii) an organic semiconductor which is produced with use of the solution and which has high heat resistance, (iii) a layer which contains the organic semiconductor, and (iv) an organic thin film transistor which exhibits high electrical properties. A composition containing: an organic semiconductor; and a polymer (1) having at least one unit selected from the group consisting of units represented by formulae (1-a), (1-b), and (1-c). A composition containing the organic semiconductor, the polymer (1), and an organic solvent can be suitably used as a solution for forming an organic semiconductor layer.
Field effect transistor
A heterocyclic compound represented by formula (1) and a field effect transistor having a semiconductor layer comprising the compound. (In the formula, X.sup.1 and X.sup.2 each independently represents a sulfur atom or a selenium atom, and R.sup.1 and R.sup.2 each independently represents a C.sub.5-16 alkyl.) ##STR00001##
Organic semiconductor compositions
The present invention relates to organic copolymers and organic semiconducting compositions comprising these materials, including layers and devices comprising such organic semiconductor compositions. The invention is also concerned with methods of preparing such organic semiconductor compositions and layers and uses thereof. The invention has application in the field of printed electronics and is particularly useful as the semiconducting material for use in formulations for organic thin film-transistor (OFET) backplanes for displays, integrated circuits, organic light emitting diodes (OLEDs), photodetectors, organic photovoltaic (OPV) cells, sensors, memory elements and logic circuits.
Organic thin-film transistor and method for manufacturing same
An organic thin-film transistor including: a gate electrode, an organic semiconductor layer, a gate insulating layer, a source electrode, and a drain electrode on a substrate, in which the organic semiconductor layer includes an organic semiconductor and a resin (C) having one or more groups selected from the group consisting of a group having fluorine atoms, a group having silicon atoms, an alkyl group having one or more carbon atoms or having two or more carbon atoms in a case of forming an alkoxycarbonyl group, a cycloalkyl group, an aralkyl group, an aryloxycarbonyl group, an aromatic ring group substituted with at least one alkyl group, and an aromatic ring group substituted with at least one cycloalkyl group; and a method for manufacturing an organic thin-film transistor including: applying a coating solution which contains the organic semiconductor and the resin (C) and causing the resin (C) to be unevenly distributed.