Patent classifications
H10K50/818
DUAL BANK STRUCTURE FOR IMPROVED EXTRACTION FROM AN EMISSIVE LAYER
A light-emitting structure includes a substrate, a sub-pixel stack over a surface of the substrate, and a bank including a first bank portion and a second bank portion. The sub-pixel stack has an emissive stack including an emissive layer between a first transport layer and a second transport layer, a first electrode layer coupled to the first transport layer, and a second electrode layer coupled to the second transport layer. The second bank portion is between the first bank portion and the sub-pixel stack, and the bank surrounding at least the emissive stack and the first electrode layer forms an interior space above the sub-pixel stack.
Display substrate and preparation method thereof, and display panel
A display substrate and a preparation method thereof, and a display panel are provided. The display substrate includes at least one first sub-pixel and at least one second sub-pixel, the first sub-pixel and the second sub-pixel have different display directions, the first sub-pixel includes a first light-emitting element, the second sub-pixel includes a second light-emitting element, each of the first light-emitting element and the second light-emitting element has a light-emitting structure, the light-emitting structure includes a first reflective layer, a light emitting layer and a second reflective layer which are sequentially stacked, the second reflective layer is located on a light emergent side of the display substrate, and an area of the first reflective layer is larger than an area of the second reflective layer.
Display device including a semi-transmissive layer
A display device which exhibits light with high color purity is provided. A display device with low power consumption is provided. An embodiment is a display device which includes a first pixel electrode, a second pixel electrode, a light-emitting layer, a common electrode, a first protective layer, and a semi-transmissive layer. The light-emitting layer includes a first region positioned over the first pixel electrode and a second region positioned over the second pixel electrode. The common electrode is positioned over the light-emitting layer. The first protective layer is positioned over the common electrode. The semi-transmissive layer is positioned over the first protective layer. Reflectivity with respect to visible light of the semi-transmissive layer is higher than reflectivity with respect to visible light of the common electrode. The semi-transmissive layer does not overlap with the first region and overlaps with the second region. For example, the semi-transmissive layer may include an opening in a position overlapping with the first region.
Organic light emitting display device including reflection structure
An organic light emitting display device includes: light emitting diodes respectively located in first to third sub-pixels on a substrate and respectively emitting red, green and blue color lights output upward through emission regions of the first to third sub-pixels; and a reflection structure located in a non-emission region surrounded by the first to third sub-pixels and including reflection side surfaces which are inclined and respectively face the emission regions of the first to third sub-pixels, wherein the reflection side surface reflects a light incident thereon from the corresponding emission region upward.
Organic light-emitting diode display device and manufacturing method thereof
Provided is an organic light-emitting diode display device (100) in which an anode electrode (134) extends to cover sides of a reflective metal (131) below the anode electrode (134).
ELECTROLUMINESCENT DEVICE HAVING LIGHT TRANSMITTING REGION OF NON-THROUGH-HOLE STRUCTURE
An electroluminescent device including a lower substrate; a lower structure including an inorganic multilayer; and an upper encapsulation structure, in which the lower structure includes a display region inside an outline of the inorganic multilayer, and a light transmitting region having a non-through-hole structure having at least a portion surrounded by the display region; the lower structure has an inorganic surface portion surrounding the display and light transmitting regions, the upper encapsulation structure has an inorganic lower surface forming an inorganic-inorganic encapsulation contact region; the electroluminescent device does not have a hole formed through both the lower substrate and the lower structure, a portion of the upper encapsulation structure corresponding to the light transmitting region is not removed, and a portion of the pixel definition layer, the portion corresponding to the light transmitting region, is not present.
Display Substrate and Preparation Method Thereof, and Display Apparatus
Provided is a display substrate, including: a substrate, and multiple light-emitting units and multiple light-detecting units located on a substrate. At least one light-emitting unit includes a light-emitting element and a pixel driving circuit coupled with the light-emitting element, and at least one light-detecting unit includes an optical sensing element and a light-emitting detection circuit coupled with an optical sensing element; an optical sensing element is located on one side of a light-emitting detection circuit and a pixel driving circuit away from a substrate and between a light-emitting element and a substrate; the light-emitting element emits light from a side away from the substrate, and a light transmittance region is provided on one side of the light-emitting element facing the optical sensing element.
DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREOF AND DISPLAY APPARATUS
The present disclosure provides a display substrate, a manufacturing method thereof and a display apparatus, belongs to the field of display technology, and can solve the problems such as low optical densities of currently available anti-reflection layers and difficulties in the alignment of an anti-reflection layer with a reflective anode. The display substrate according to the present disclosure has a pixel region and a non-pixel region, and includes a base substrate and a reflective anode on the base substrate, and further includes an anti-reflection layer on the reflective anode and configured to correspond to the non-pixel region; the anti-reflection layer includes a transparent polymer layer and a light-absorbing material; a surface of the transparent polymer layer away from the base substrate is provided with a plurality of micro-pores; and the plurality of micro-pores are filled with the light-absorbing material.
METHOD FOR FORMING AN ISOLATION STRUCTURE HAVING MULTIPLE THICKNESSES TO MITIGATE DAMAGE TO A DISPLAY DEVICE
In some embodiments, the present disclosure relates to a method of forming a display device, comprising: forming a first reflector electrode and a second reflector electrode over an interconnect structure, wherein the first reflector electrode is laterally separated from the second reflector electrode; depositing a first isolation layer over the first and second reflector electrodes; forming a first masking layer directly overlying the first reflector electrode; depositing a second isolation layer over the first isolation layer and over the first masking layer; forming a second masking layer over the second isolation layer and directly overlying the second reflector electrode; performing a first removal process to remove portions of the first and second isolation layers that do not directly underlie the first or second masking layers; and performing a second removal process to remove the first and second masking layers.
HARD MASK LAYER BELOW VIA STRUCTURE IN DISPLAY DEVICE
In some embodiments, the present disclosure relates to a display device that includes a reflector electrode coupled to an interconnect structure. An isolation structure is disposed over the reflector electrode, and a transparent electrode is disposed over the isolation structure. Further, an optical emitter structure is disposed over the transparent electrode. A via structure extends from a top surface of the isolation structure to the reflector electrode and comprises an outer portion that directly overlies the top surface of the isolation structure. A hard mask layer is arranged directly between the top surface of the isolation structure and the outer portion of the via structure.