A device that includes a substrate; a die couple to the substrate, a frame located between the die and the substrate, wherein the frame is further located along a periphery of the die; a solder interconnect coupled to the frame and the substrate; and a sealed cavity located between the die and the substrate, wherein a wall of the sealed cavity is formed by the solder interconnect and the frame. The frame may be configured to be coupled to ground.

A liquid discharge head includes a nozzle to discharge a liquid, an individual chamber communicating with the nozzle, a supply channel communicating with the individual chamber to supply the liquid to the individual chamber, and a discharge channel communicating with the individual chamber to discharge the liquid in the individual chamber. A fluid resistance of the supply channel is greater than a fluid resistance of the discharge channel.

Ultrasound transducer assemblies and associated systems and method are disclosed herein. In one embodiment, an ultrasound transducer assembly includes at least one matching layer overlies a transducer layer. A plurality of kerfs extends at least into the matching layer. In some aspects, the kerfs are at least partially filled with a filler material that includes microballoons and/or microspheres.

A method of manufacturing surface acoustic wave device chips includes grinding a reverse side of a wafer with a surface acoustic wave device formed in each area demarcated by a plurality of crossing projected dicing lines on a face side of the wafer; before or after grinding, applying a laser beam to the reverse side of the wafer such that the laser beam is focused at a position within the wafer, the position being closer to the face side of the wafer than a position corresponding to a reverse side of each of the surface acoustic wave device chips to be produced from the wafer, thereby forming a modified layer for diffusing an acoustic wave; and after grinding and applying the laser beam, dividing the wafer along the projected dicing lines into a plurality of the surface acoustic wave device chips.

There is provided a SAW filter manufacturing method for manufacturing a SAW filter from a piezoelectric substrate having planned dividing lines set on a top surface of the piezoelectric substrate, and having a device including comb-shaped electrodes in regions demarcated by the planned dividing lines. The method includes a structure forming step of forming a structure having projections and depressions on an undersurface side of the piezoelectric substrate by irradiating the piezoelectric substrate with a laser beam of a wavelength absorbable by the piezoelectric substrate from the undersurface side of the piezoelectric substrate, and a dividing step of dividing the piezoelectric substrate along the planned dividing lines after the structure forming step.

A fingerprint identification device includes a substrate, a piezoelectric layer, a conductive layer, and a planar layer. The piezoelectric layer is disposed on the substrate. The conductive layer is disposed on the piezoelectric layer, and the conductive layer has a rugged microstructure on an upper surface of the conductive layer. The planar layer is disposed on the conductive layer, and a bottom of the planar layer fills the rugged microstructure of the conductive layer.

A very small piezoelectric sensor capable of being mass produced includes a core, a piezoelectric layer on a surface of the core; and a conductive layer on a surface of the piezoelectric layer away from the core. The core is flexible and threadlike, the core is a first electrode of the piezoelectric sensor, and the conductive layer is a second electrode of the piezoelectric sensor. An array of such sensors allows the skin of a robot for example to simulate the sensitivity of hair-covered human skin. A method for making the piezoelectric sensor and an electronic device using the piezoelectric sensor are also disclosed.

An acoustic wave device includes a piezoelectric substrate including a support substrate and a piezoelectric layer on the support substrate, the piezoelectric substrate including a first principal surface on the piezoelectric layer side, and a second principal surface on the support substrate side, an IDT electrode on the first principal surface, a support layer on the support substrate, a cover on the support layer, a through-via electrode provided through the support substrate and electrically connected to the IDT electrode, a first wiring electrode on the second principal surface of the piezoelectric substrate and electrically connected to the through-via electrode, and a protective film on the second principal surface to cover at least a portion of the first wiring electrode. The protective film is provided on an inner side of the support layer when viewed in a direction normal or substantially normal to the second principal surface.

Disclosed herein are a piezoelectric element, a method of manufacturing the piezoelectric element, a touchpad including the piezoelectric element, and a method of operating the touchpad, wherein the piezoelectric element has a shape of an N-hedron and includes N polygonal unit piezoelectric films forming N faces of the N-hedron, and the touchpad includes: a first piezoelectric element having a shape of an N-hedron; a pad body having a first installation groove detachably supporting the first piezoelectric element; and a signal processer receiving and processing a first signal generated by the first piezoelectric element in response to a first external force, wherein N unit signals are generated by N unit piezoelectric films forming N faces of the first piezoelectric element in response to one external force.

Disclosed herein are a piezoelectric element, a method of manufacturing the piezoelectric element, a touchpad including the piezoelectric element, and a method of operating the touchpad, wherein the piezoelectric element has a shape of an N-hedron and includes N polygonal unit piezoelectric films forming N faces of the N-hedron, and the touchpad includes: a first piezoelectric element having a shape of an N-hedron; a pad body having a first installation groove detachably supporting the first piezoelectric element; and a signal processer receiving and processing a first signal generated by the first piezoelectric element in response to a first external force, wherein N unit signals are generated by N unit piezoelectric films forming N faces of the first piezoelectric element in response to one external force.