A fingerprint identification device includes a substrate, a piezoelectric layer, a conductive layer, and a planar layer. The piezoelectric layer is disposed on the substrate. The conductive layer is disposed on the piezoelectric layer, and the conductive layer has a rugged microstructure on an upper surface of the conductive layer. The planar layer is disposed on the conductive layer, and a bottom of the planar layer fills the rugged microstructure of the conductive layer.

Even with the occurrence of misalignment of inner electrodes in a ceramic collective board, a multilayer electronic component is made in which inner electrodes are disposed at suitable positions. Disclosed herein are descriptions of a first-stage ceramic collective board and a second-stage ceramic collective board used for manufacturing a multilayer electronic component. The present disclosure further describes a manufacturing method for the second-stage ceramic collective board and a manufacturing method for a multilayer electronic component.

Even with the occurrence of misalignment of inner electrodes in a ceramic collective board, a multilayer electronic component is made in which inner electrodes are disposed at suitable positions. Disclosed herein are descriptions of a first-stage ceramic collective board and a second-stage ceramic collective board used for manufacturing a multilayer electronic component. The present disclosure further describes a manufacturing method for the second-stage ceramic collective board and a manufacturing method for a multilayer electronic component.

A method of manufacturing an array transducer arrangement, an array transducer arrangement for use in a high temperature environment, a method of manufacturing an array transducer arrangement for use in a high temperature environment, apparatus for selectively emitting ultrasonic waves in a high temperature environment, a method of producing a porous backing layer for a high temperature array transducer arrangement, and a backing layer for an array transducer arrangement are disclosed. The method of manufacturing an array transducer arrangement comprises: providing a piezoelectric layer; arranging a backing layer on a first face of the piezoelectric layer; and cutting a plurality of primary kerfs through the piezoelectric layer and into the backing layer to provide a plurality of piezoelectric elements; whereby the primary kerfs define a pitch of the plurality of piezoelectric elements.

A method of manufacturing an array transducer arrangement, an array transducer arrangement for use in a high temperature environment, a method of manufacturing an array transducer arrangement for use in a high temperature environment, apparatus for selectively emitting ultrasonic waves in a high temperature environment, a method of producing a porous backing layer for a high temperature array transducer arrangement, and a backing layer for an array transducer arrangement are disclosed. The method of manufacturing an array transducer arrangement comprises: providing a piezoelectric layer; arranging a backing layer on a first face of the piezoelectric layer; and cutting a plurality of primary kerfs through the piezoelectric layer and into the backing layer to provide a plurality of piezoelectric elements; whereby the primary kerfs define a pitch of the plurality of piezoelectric elements.

Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer can be formed over a substrate of bulk acoustic wave components such that streets are exposed. The bulk acoustic wave components can be plasma diced along the exposed streets to thereby singulate the bulk acoustic wave components

Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer can be formed over a substrate of bulk acoustic wave components such that streets are exposed. The bulk acoustic wave components can be plasma diced along the exposed streets to thereby singulate the bulk acoustic wave components

Ultrasound transducer assemblies and associated systems and method are disclosed herein. In one embodiment, an ultrasound transducer assembly includes at least one matching layer overlies a transducer layer. A plurality of kerfs extends at least into the matching layer. In some aspects, the kerfs are at least partially filled with a filler material that includes microballoons and/or microspheres.

Ultrasound transducer assemblies and associated systems and method are disclosed herein. In one embodiment, an ultrasound transducer assembly includes at least one matching layer overlies a transducer layer. A plurality of kerfs extends at least into the matching layer. In some aspects, the kerfs are at least partially filled with a filler material that includes microballoons and/or microspheres.

Various methods and systems are provided for forming a flexible circuit. In one example, a method includes forming a flexible circuit comprising a plurality of contact pads arranged into a plurality of rows, each contact pad of a given row electrically coupled to one another via electrical traces and each contact pad including a via, electroplating the flexible circuit, including electroplating each via, with at least a first material, and upon confirming connectivity of each via, cutting at least some of the electrical traces at least partially.