A method of assembly a dual stage actuated suspension includes either applying an adhesive to a microactuator motor and then B-staging the adhesive, or applying an adhesive that has already been B-staged such as in film adhesive form to the microactuator then assembling the microactuator into a suspension and then finishing the adhesive cure. The adhesive can be applied to bulk piezoelectric material, with the adhesive being B-staged either before or after it is applied to the bulk piezoelectric material, and the piezoelectric material then singulated into a number of individual piezoelectric microactuators. The method allows greater control over how much adhesive is used, and greater control over spread of that adhesive and control over potential contamination, than traditional liquid epoxy dispense methods.

An ultrasonic transducer includes a piezoelectric element that extends in a predetermined direction; a first electrode formed on a first surface of the piezoelectric element, in parallel with the direction, the first electrode including: a first portion for inputting an electrical signal to the piezoelectric element, and a first connection portion formed continuously with the first portion and intersecting the direction, wherein a first wiring is electrically connected to the first connection portion; and a second electrode disposed on a second surface, oppose to the first surface, of the piezoelectric element and spaced apart from the first electrode in the piezoelectric element, the second electrode including: a second portion for inputting an electric signal to the piezoelectric element, and a second connection portion formed continuously with the second portion, wherein a second wiring is electrically connected to the second connection portion and collectively arranged with the first wiring.

An acoustic wave resonator includes: a piezoelectric substrate; a pair of comb-shaped electrodes that is located on the piezoelectric substrate and excites an acoustic wave, each of the pair of comb-shaped electrodes including a plurality of electrode fingers; and a polycrystalline substrate that is located at an opposite side of the piezoelectric substrate from a surface on which the pair of comb-shaped electrodes is located, an average particle size of the polycrystalline substrate being equal to or less than 66 times an average pitch of the plurality of electrode fingers.

According to an embodiment, a liquid ejecting head chip includes an actuator plate and an in-channel electrode. In the actuator plate, a plurality of channels are arranged at a distance in an X-direction. Each of the channels includes an extension portion and a raise-and-cut portion. The extension portion extends in a Z-direction. The raise-and-cut portion continues from the extension portion toward one side of the Z-direction and has a groove depth which is gradually reduced toward the one side of the Z-direction. The in-channel electrode is formed on an inner surface of each of the channels, with a plating film.

Methods of manufacturing an electronic device formed in a cavity may include providing a first substrate having a first side wall including a first metal formed along a periphery on a bottom surface thereof and surrounding an electronic circuit disposed on the bottom surface, providing a second substrate having a second side wall including a second metal and a third metal formed along a periphery on a top surface thereof, aligning the first substrate with the second substrate with the first side wall opposing and contacting the second side wall to internally define a cavity between the bottom surface of the first substrate, the top surface of the second substrate, the first side wall ,and the second side wall, and heating and bonding the first substrate and the second substrate by transient liquid phase bonding.

The present invention provides a piezoelectric element manufacturing method. The manufacturing method is a method of manufacturing a piezoelectric element comprising a piezoelectric body composite in which a piezoelectric body configured from a Pb-based piezoelectric material and a resin are alternately arranged, and comprises a step of etching, using an etching liquid, a plurality of parallel piezoelectric body segments formed by dicing. The etching liquid comprises a liquid which contains 0.1 to 20 mass % of hexafluorosilicic acid.

A piezoelectric element easily and surely forms polymer coatings on peripheral end faces of the piezoelectric element without deteriorating a yield of the piezoelectric element. The piezoelectric element is manufactured by a method including steps of cutting a piezoelectric element out from a base piezoelectric material plate so that peripheral end faces are formed to define a peripheral shape of the piezoelectric element, and forming polymer coatings on at least objective areas of the peripheral end faces of the piezoelectric element by vapor deposition polymerization.

According to an embodiment, a liquid ejecting head chip includes an actuator plate, a cover plate, a common electrode, and a connection wiring. In the actuator plate, a plurality of discharge channels and a plurality of non-discharge channels which extend in a Z-direction are alternately arranged at a distance in an X-direction. The cover plate is stacked on an AP-side-Y-direction inner side surface, so as to close the plurality of discharge channels and the plurality of non-discharge channels. The common electrode is formed on an inner surface of each of the discharge channels. The connection wiring is divided so as to be formed in at least 3 or more places in the X-direction on the cover plate, and the common electrode connects the connection wiring to the flexible substrate.

A method for producing a plurality of piezoelectric ultrasound transducer elements, the method comprising providing or depositing a piezoelectric material on at least part of a surface of a sheet of substrate to form a layered member; and forming the one or more piezoelectric ultrasound transducer elements from the layered member.

The present invention provides: a piezoelectric substrate which includes a first piezoelectric body having an elongated shape and helically wound in one direction, and which does not include a core material, in which the first piezoelectric body includes a helical chiral polymer (A) having an optical activity; in which the length direction of the first piezoelectric body is substantially parallel to the main direction of orientation of the helical chiral polymer (A) included in the first piezoelectric body; and in which the first piezoelectric body has a degree of orientation F, as measured by X-ray diffraction according to the following Equation (a), within the range of 0.5 or more but less than 1.0:

degree of orientation F=(180)/180(a)

(in which represents the half-value width of the peak derived from the orientation).