Patent classifications
H10N30/088
Multi-layer piezoelectric ceramic component and piezoelectric device
A multi-layer piezoelectric ceramic component includes: a piezoelectric ceramic body having a cuboid shape having upper and lower surfaces facing in a thickness direction, first and second end surfaces facing in a length direction, and a pair of side surfaces facing in a width direction; first internal electrodes formed in the piezoelectric ceramic body and drawn to the first end surface; second internal electrodes formed in the piezoelectric ceramic body and drawn to the second end surface; a first terminal electrode formed on the first end surface; and a second terminal electrode formed on the second end surface, the first and second internal electrodes each having a width equal to a distance between the pair of side surfaces, at least one of the pair of side surfaces including a groove extending in non-parallel with the length direction.
Method of Manufacturing Piezoelectric Microactuators Having Wrap-Around Electrodes
A method of manufacturing a piezoelectric microactuator having a wrap-around electrode includes forming a piezoelectric element having a large central electrode on a top face, and having a wrap-around electrode that includes the bottom face, two opposing ends of the device, and two opposing end portions of the top face. The device is then cut through the middle, separating the device into two separate piezoelectric microactuators each having a wrap-around electrode.
Piezoelectric substrate, piezoelectric woven fabric, piezoelectric knitted fabric, piezoelectric device, force sensor, and actuator
The present invention provides: a piezoelectric substrate which includes a first piezoelectric body having an elongated shape and helically wound in one direction, and which does not include a core material, in which the first piezoelectric body includes a helical chiral polymer (A) having an optical activity; in which the length direction of the first piezoelectric body is substantially parallel to the main direction of orientation of the helical chiral polymer (A) included in the first piezoelectric body; and in which the first piezoelectric body has a degree of orientation F, as measured by X-ray diffraction according to the following Equation (a), within the range of 0.5 or more but less than 1.0:
degree of orientation F=(180°−α)/180° (a)
(in which α represents the half-value width of the peak derived from the orientation).
Piezoelectric substrate, piezoelectric woven fabric, piezoelectric knitted fabric, piezoelectric device, force sensor, and actuator
The present invention provides: a piezoelectric substrate which includes a first piezoelectric body having an elongated shape and helically wound in one direction, and which does not include a core material, in which the first piezoelectric body includes a helical chiral polymer (A) having an optical activity; in which the length direction of the first piezoelectric body is substantially parallel to the main direction of orientation of the helical chiral polymer (A) included in the first piezoelectric body; and in which the first piezoelectric body has a degree of orientation F, as measured by X-ray diffraction according to the following Equation (a), within the range of 0.5 or more but less than 1.0:
degree of orientation F=(180°−α)/180° (a)
(in which α represents the half-value width of the peak derived from the orientation).
Ultrasonic probe and manufacturing method thereof
An ultrasonic probe of an embodiment includes a vibrator, an acoustic matching layer, and a back layer. The vibrator includes a plurality of vibrating elements arranged in a first direction. The acoustic matching layer is formed on a living body side of the vibrator. The back layer is formed on a back side of the vibrator opposite the living body side. The plurality of vibrating elements are formed by being divided by first grooves passing through the vibrator and the back layer. Second grooves passing through the vibrating elements and penetrating into the back layer are provided in each of the vibrating elements. A penetration depth of the second grooves in a second direction in the back layer is less than a width of the second grooves in the first direction in the vibrating elements.
Method of manufacturing piezoelectric microactuators having wrap-around electrodes
A method of manufacturing a piezoelectric microactuator having a wrap-around electrode includes forming a piezoelectric element having a large central electrode on a top face, and having a wrap-around electrode that includes the bottom face, two opposing ends of the device, and two opposing end portions of the top face. The device is then cut through the middle, separating the device into two separate piezoelectric microactuators each having a wrap-around electrode.
METHODS FOR FORMING AN INVASIVE DEPLOYABLE DEVICE
Various methods and systems are provided for a transducer for a deployable catheter. In one example, a method for forming the transducer includes coupling an acoustic stack to a shape memory material while in a planar configuration to form a transducer and exposing the shape memory material to a curling stimulus to adjust the transducer to a curved configuration.
Elongated plate-form piezoelectric body and production method therefor, layered body and production method therefor, fabric, garment, and biological information acquisition device
Provided is: an elongated plate-form piezoelectric body, which contains an optically active helical chiral polymer (A) having a weight-average molecular weight of from 50,000 to 1,000,000 and has an elongated plate shape having a thickness of from 0.001 mm to 0.2 mm, a width of from 0.1 mm to 30 mm and a width-to-thickness ratio of 2 or higher, and in which the lengthwise direction and the main orientation direction of the helical chiral polymer (A) are substantially parallel to each other; the crystallinity measured by a DSC method is from 20% to 80%; and the birefringence is from 0.01 to 0.03.
Method for Manufacturing Ferroelectric Film Deposition Substrate and Ferroelectric Film Deposition Substrate
A method for manufacturing a piezoelectric film deposition substrate (100) according to this present invention includes forming a piezoelectric film (3) on or above the lower electrode (2) with the mask (5) being attached on or above the lower electrode; forming an upper electrode (4) on the piezoelectric film with the mask being attached on or above the lower electrode; forming a the lower-electrode-exposed part (2a) by detaching the mask from the lower electrode; and subjecting the piezoelectric film to polarization by applying a voltage between the lower-electrode-exposed part and the upper electrode.
Method for Manufacturing Ferroelectric Film Deposition Substrate and Ferroelectric Film Deposition Substrate
A method for manufacturing a piezoelectric film deposition substrate (100) according to this present invention includes forming a piezoelectric film (3) on or above the lower electrode (2) with the mask (5) being attached on or above the lower electrode; forming an upper electrode (4) on the piezoelectric film with the mask being attached on or above the lower electrode; forming a the lower-electrode-exposed part (2a) by detaching the mask from the lower electrode; and subjecting the piezoelectric film to polarization by applying a voltage between the lower-electrode-exposed part and the upper electrode.