A method for fabricating an array of front ends for an array of packaged electronic components that each comprise: an electrical element packaged within a package comprising a front part of a package comprising an inner section with a cavity therein opposite the resonator defined by the raised frame and an outer section sealing said cavity; and a back part of the package comprising a back cavity in an inner back section, and an outer back section sealing the cavity, said back package further comprising a first and a second via through the back end around said at least one back cavity for coupling to front and back electrodes of the electronic component; the vias terminating in external contact pads that are coupleable in a ‘flip chip’ configuration to a circuit board; the method comprising the stages of: i. Obtaining a carrier substrate having an active membrane layer attached thereto by its rear surface, with a front electrode on the front surface of the active membrane layer; ii. Obtaining an inner front end section; iii. Attaching the inner front end section to the exposed front surface of the front electrode; iv. Detaching the carrier substrate from the rear surface of the active membrane layer; v. Optionally thinning the inner front section; vi. Processing the rear surface by removing material to create an array of at least one island of active membrane on at least one island of front electrode; vii. Creating an array of at least one front cavity by selectively removing at least outer layer of the inner front end section, such that there is one cavity opposite each island of membrane on the front side of the front electrode on the opposite side to the island of active membrane; viii. Applying an outer front end section to the inner front end section and bonding the outer front end section to an outer surface of the inner front end section such that the outer front end section spans across and seals the at least one cavity of the array of front cavities.

A transducer includes a base, beams, and a coupler. The beams each include a piezoelectric layer, a first electrode layer, and a second electrode layer. The coupler is fitted in slits between adjacent beams to define a connection between the beams. The coupler extends from an upper portion of the base into each of the slits without a break. A Young's modulus of the material of the coupler is lower than a Young's modulus of the material of the piezoelectric layer. A maximum thickness of the coupler in the upper portion of the base in the direction of the central axis of the base is greater than a thickness of each of the beams.

Aspects of the embodiments are directed to systems and devices that include a piezo-electric element comprising a top-side electrode and a bottom-side electrode; a metal contact pad electrically connected to the bottom-side electrode; an electrode electrically connected to the top-side electrode; and an encasement encasing the piezo-electric element. The piezo-electric element can be prepared to include steps and metallization for use in one or more types of packaging.

An ultrasound system, probe and method are provided. The ultrasound system includes a transducer with piezoelectric transducer elements polarized in a poling direction. A bipolar transmit circuit is configured to generate a transmit signal having first and second polarity segments. The first and second polarity segments have corresponding first and second peak amplitudes. A bias generator is configured to generate a bias signal in a direction of the poling direction. The bias signal is combined with the transmit signal to form a biased transmit signal that is shifted in the direction of the poling direction and still includes both of positive and negative voltages over a transmit cycle.

A crystal vibration element that includes a crystal piece that has a prescribed crystal orientation, and a first direction and a second direction in a plan view thereof; and excitation electrodes that are respectively provided on front and rear surfaces of the crystal piece in order to excite a thickness shear vibration in the crystal piece upon application of an alternating electric field. A vibration distribution of the crystal piece has a vibration region that extends in a band-like shape in the second direction of the crystal piece and non-vibration regions that are adjacent to opposed sides of the vibration region in the first direction of the crystal piece.

Disclosed in an ultrasonic probe for obtaining an ultrasonic image. The ultrasonic probe includes piezoelectric elements forming a plurality of rows arranged to form a pair along a lateral direction, a kerf formed between the piezoelectric elements along the lateral direction, a first circuit layer disposed below the piezoelectric elements, a second circuit layer disposed to be spaced apart from a lower side of the first circuit layer and including a plurality of wires extending along the rows, the second circuit layer being provided with a first region in selectively contact with the piezoelectric elements and a second region disposed at opposite ends of the first region and folded without being in contact with the piezoelectric elements, and a first connection part to electrically connect the first circuit layer and the second circuit layer, wherein the first region is, when the plurality of wires extending along one row of the pair of rows extends from the first region to the second region, provided such that the plurality of wires is distributed to the other adjacent row.

An elastic wave device includes a piezoelectric layer including a first main surface and a second main surface facing the first main surface, an acoustically reflective layer stacked on the first main surface of the piezoelectric layer, an excitation electrode disposed on the piezoelectric layer, and a support layer. The acoustically reflective layer overlaps at least the excitation electrode in a plan view of the piezoelectric layer from the side of the second main surface. The support layer surrounds the acoustically reflective layer in a plan view of the piezoelectric layer from the side of the second main surface.

A light scanning apparatus includes a mirror supporting portion having a mirror on a front surface, an actuator configured to driving the mirror supporting portion, a fixed frame disposed around the mirror supporting portion and the actuator, and at least one rib disposed on a back surface side of the mirror supporting portion or the actuator, wherein the rib includes a straight portion and a contact portion having a width wider than a width of the straight portion.

A crystal vibration element that includes a crystal piece that has a prescribed crystal orientation, and a first direction and a second direction in a plan view thereof; and excitation electrodes that are respectively provided on front and rear surfaces of the crystal piece in order to excite a thickness shear vibration in the crystal piece upon application of an alternating electric field. A vibration distribution of the crystal piece has a vibration region that extends in a band-like shape in the second direction of the crystal piece and non-vibration regions that are adjacent to opposed sides of the vibration region in the first direction of the crystal piece.

A thin-profile ultrasonic sensor includes a piezoelectric material layer having a first surface and a second surface, a plurality of thin film transistors (TFTs) on the first surface, and an electrode layer on the second surface. The first surface and the second surface are on opposite sides facing away from each other. The piezoelectric material layer is configured as a substrate to support the plurality of TFTs, no other substrate being required. The piezoelectric material layer is configured to transmit and receive ultrasonic signals.