There is provided a loudspeaker apparatus having: a first unit arranged to propagate sound in a first frequency range; and a second unit arranged to propagate sound in a second frequency range that is higher than the first frequency range. The first unit includes a sound-radiating member and the second unit is mounted to the sound-radiating member of the first unit. The first unit and the second unit are driven by separate audio channels and/or the sound-radiating member of the first unit is planar.

The embodiment of the present disclosure may disclose an acoustic device. The acoustic device may comprise a piezoelectric component, an electrode, and a vibration component. The piezoelectric component may generate vibration under an action of a driving voltage, the electrode may provide the driving voltage for the piezoelectric component, and the vibration component may be physically connected to the piezoelectric component to receive the vibration and generate sound. The piezoelectric component may include a substrate and a piezoelectric layer, the piezoelectric layer may be covered on a surface of the substrate, the electrode may be covered on a surface of the piezoelectric layer, and the coverage area of the electrode on the surface of the piezoelectric layer may be less than an area of the surface of the substrate covered with the piezoelectric layer. In the present disclosure, the modal actuator of the piezoelectric component may be formed through the electrode designing, so that the piezoelectric component may output a specific modal shape, and improves the acoustic characteristics of the acoustic device. Compared with the modal control system composed of different mechanical structures added in a specific region, the present disclosure realizes the modal control of the piezoelectric component through the electrode design, which may simplify the structure of the acoustic device.

A cooling system including a heat spreader, an active cooling element, and a base is described. The heat spreader is in thermal communication with a heat-generating structure mounted on a substrate. The heat spreader over hangs the heat-generating structure. The active cooling element is in thermal communication with the heat spreader. The base supports the heat spreader and transfers a load from the heat spreader to the substrate such that a bending of the heat spreader does not exceed ten degrees.

A micro-valve includes an orifice plate including a first surface and a second surface, and an orifice extending from the first surface to the second surface. The micro-valve also includes a spacing member disposed on the first surface and offset from the orifice, a valve seat disposed on the first surface. The valve seat defines an opening in fluid communication with the orifice in a flow direction. The micro-valve also includes an actuating beam disposed on the spacing member extending from the spacing member toward the orifice, the actuating beam being moveable between an open position and a closed position. The micro-valve also includes a sealing member affixed to an end portion of the actuating beam. In a closed position, a sealing surface of the sealing member contacts the valve seat to close the micro-valve.

A bioFET device includes a semiconductor substrate having a first surface and an opposite, parallel second surface and a plurality of bioFET sensors on the semiconductor substrate. Each of the bioFET sensors includes a gate formed on the first surface of the semiconductor substrate and a channel region formed within the semiconductor substrate beneath the gate and between source/drain (S/D) regions in the semiconductor substrate. The channel region includes a portion of the second surface of the semiconductor substrate. An isolation layer is disposed on the second surface of the semiconductor substrate. The isolation layer has an opening positioned over the channel region of more than one bioFET sensor of the plurality of bioFET sensors. An interface layer is disposed on the channel region of the more than one bioFET sensor in the opening.

A ferroelectric material includes a mixed crystal having AlN and at least one nitride of a transition metal. The proportion of the nitride of the transition metal is selected such that a direction of an initial or spontaneous polarity of the ferroelectric material is switchable by applying a switchover voltage. The switchover voltage is below a breakdown voltage of the ferroelectric material.

A bioFET device includes a semiconductor substrate having a first surface and an opposite, parallel second surface and a plurality of bioFET sensors on the semiconductor substrate. Each of the bioFET sensors includes a gate formed on the first surface of the semiconductor substrate and a channel region formed within the semiconductor substrate beneath the gate and between source/drain (S/D) regions in the semiconductor substrate. The channel region includes a portion of the second surface of the semiconductor substrate. An isolation layer is disposed on the second surface of the semiconductor substrate. The isolation layer has an opening positioned over the channel region of more than one bioFET sensor of the plurality of bioFET sensors. An interface layer is disposed on the channel region of the more than one bioFET sensor in the opening.

Aspects include piezoelectric acoustic transducers and systems for acoustic transduction. In some aspects, an acoustic transducer is structured with a silicon substrate having a top surface and a bottom surface, where the top surface has a first portion and an edge along the first portion associated with an acoustic aperture. The transducer has a first silicon oxide layer disposed over the first portion of the top surface of the silicon substrate, a polysilicon layer disposed over the first silicon oxide layer, and a second silicon oxide layer disposed over the polysilicon layer. A cantilevered beam comprising a fixed end, a deflection end, a top surface, and a bottom surface, has a first portion of the bottom surface at the fixed end disposed over the second silicon oxide layer, where a second portion of the bottom surface at the deflection end is formed over the acoustic aperture. In some aspects. transducer elements are reconfigurable between parallel and serial configurations depending on a system operating mode.

A micromirror array comprises a substrate, a plurality of minors for reflecting incident light and, for each mirror (20) of the plurality of minors, at least one piezoelectric actuator (21) for displacing the minor, wherein the at least one piezoelectric actuator is connected to the substrate. The micromirror array further comprises one or more pillars (24) connecting the minor to the at least one piezoelectric actuator. Also disclosed is a method of forming such a micromirror array. The micromirror array may be used in a programmable illuminator. The programmable illuminator may be used in a lithographic apparatus and/or in an inspection apparatus.

A piezoelectric device that includes a sintered body in which a first conductor portion and a second conductor portion are disposed on both principal surfaces of a piezoelectric ceramic base body. The first conductor portion includes conductive films having a predetermined pattern. An insulating film is formed on the principal surface of the piezoelectric ceramic base body on which the conductive films are disposed such that portions of the conductive films are exposed therethrough. The insulating film has a malleability equal to or greater than that of the conductive films.