A piezoelectric element including a piezoelectric layer having a perovskite structure including lead, zirconium, and titanium, and an electrode provided on the piezoelectric layer is provided. In the piezoelectric layer, in a range of 50 nm or smaller from an interface between the piezoelectric layer and the electrode in a thickness direction, a ratio c/a of a lattice spacing a in a direction perpendicular to the thickness direction and a lattice spacing c in the thickness direction satisfies 0.986?c/a?1.014.

A wire-free multilayer biomorph device is provided where the layers are bonded without use of adhesive. The device includes a plurality of stacked perforated metal plates with interposed transductive assembly layers. The perforated metal plates and transductive assembly layers are bonded by a conductive metal ink that is subject to a thermal cycle process. Electrical connection of the perforated metal plates and transductive assembly are realized through structural connectors thru-connectors thereby obviating the need for wiring.

An ultrasonic module and a manufacturing method for ultrasonic module are provided. The ultrasonic module includes a substrate, a composite layer, and a covering layer. The substrate has an upper surface. The composite layer has a top surface, a bottom surface, and a recessed surface recessed toward the bottom surface. The bottom surface is on the upper surface of the substrate. One or more space is formed between the recessed surface and the upper surface. The composite layer has one or more first groove extending from the top surface toward the recessed surface. The first groove separates the composite layer into a circuit structure and an ultrasonic structure connected to the circuit structure. The covering layer is assembled on the top surface of the composite layer.

The present disclosure provides a sensor comprising: a sensing assembly, the sensing assembly including a sensing piezoelectric layer and a sensing electrode layer; a frequency adjustment assembly, the frequency adjustment assembly being physically connected to the sensing assembly, and being deformed under the action of an electrical signal to deform the sensing piezoelectric layer, thereby changing a resonance frequency of the sensing assembly; and a substrate, the substrate being configured carry the sensing assembly and the frequency adjustment assembly.

A diaphragm actuator has a first frame part and a second frame part, between which at least two diaphragm layers are disposed in a stacked manner and formed as electro-active polymer layers. Furthermore, a method for producing a diaphragm actuator is described.

A piezoelectric element includes a piezoelectric body, an external electrode, and an internal electrode. The piezoelectric body includes first and second main surfaces opposing each other. The external electrode is disposed on the first main surface and has a first polarity. The internal electrode is disposed in the piezoelectric body to oppose the external electrode in a direction in which the first main surface and the second main surface oppose each other and has a second polarity different from the first polarity. A region from the internal electrode to the external electrode in the piezoelectric body is a polarizing region, and a region from the internal electrode to the second main surface in the piezoelectric body is a non-polarizing region.

A button device includes a piezoelectric element which includes a piezoelectric body with one surface on which a first external electrode and a second external electrode are formed and a plate with one surface attached to the other surface of the piezoelectric body, a supporting plate disposed on the one surface of the piezoelectric body, a cover disposed on the other surface of the plate, a first spacer provided between an edge portion of the one surface of the plate and the supporting plate, a second spacer provided between at least a part of an edge portion of the other surface of the plate and the cover to provide a separation space between the plate and the cover, and a dot provided in the separation space to transfer an external force to the piezoelectric element or to transfer a vibration of the piezoelectric element to the cover.

A dual resonator chip, includes a kilohertz frequency resonator in the chip and a megahertz frequency resonator in the same chip, wherein the kilohertz frequency resonator and the megahertz frequency resonator are MEMS resonators.

A vibrating device includes a piezoelectric element, a wiring board electrically connected with the piezoelectric element, and a diaphragm including a metal. The piezoelectric element and the wiring board are bonded to the diaphragm. The piezoelectric element includes a piezoelectric element body, a plurality of internal electrodes, and a plurality of external electrodes. The piezoelectric element body has a first principal plane and a second principal plane opposed to each other. The plurality of internal electrodes is disposed in the piezoelectric element body. The internal electrodes are opposed to each other in a direction in which the first principal plane and the second principal plane are opposed. The plurality of external electrodes is disposed on the first principal plane, and is electrically connected with corresponding internal electrodes, of the plurality of internal electrodes. The wiring board has a resin film and a plurality of conductors.

A vibrating device includes a diaphragm, a piezoelectric element, and a wiring board. The piezoelectric element and the wiring board are bonded to a first principal plane of the diaphragm. The wiring board is electrically connected with the piezoelectric element. The piezoelectric element includes a piezoelectric element body, a plurality of internal electrodes, and a plurality of external electrodes. The piezoelectric element body has a second principal plane, a third principal plane, and a side surface. The third principal plane and the side surface are bonded to the first principal plane. The wiring board has a resin film, a plurality of conductors, and a coating film. The coating film is disposed on the plurality of conductors in such a way as to cover the plurality of conductors. One end portions of the plurality of conductors are exposed from the coating film and electrically connected with corresponding external electrodes.