A piezoelectric element body has a first principal surface and a second principal surface. A pair of first electrodes is disposed on the first principal surface. The vibrating body includes a metal plate, an insulating layer, and a pair of second electrodes. The metal plate has a third principal surface and a fourth principal surface. The insulating layer is disposed on the third principal surface. The pair of second electrodes is disposed on the insulating layer. The piezoelectric element and the vibrating body are disposed in such a manner that the first principal surface and the third principal surface oppose each other via the insulating layer. The pair of second electrodes physically contacts the respective first electrodes. The second electrodes are exposed from the piezoelectric element and are separated from all of edges of the insulating layer, when viewed from a direction orthogonal to the third principal surface.

Provided are a piezoelectric element and an electroacoustic transducer, which can be made thinner while ensuring piezoelectric characteristics in a piezoelectric element. The piezoelectric element includes a common electrode layer, a first piezoelectric layer which consists of a polymer-based piezoelectric composite material containing piezoelectric particles in a matrix containing a polymer material and is provided on one surface of the common electrode layer, a first electrode layer which is provided on a surface of the first piezoelectric layer on a side opposite to the common electrode layer, a first protective layer which is provided on a surface of the first electrode layer on a side opposite to the first piezoelectric layer, a second piezoelectric layer which consists of a polymer-based piezoelectric composite material containing piezoelectric particles in a matrix containing a polymer material and is provided on the other surface of the common electrode layer, a second electrode layer which is provided on a surface of the second piezoelectric layer on a side opposite to the common electrode layer, and a second protective layer which is provided on a surface of the second electrode layer on a side opposite to the second piezoelectric layer.

The present invention provides for a modified virus, such as a recombinant M13 phage, which in an array, such as a film, is capable of producing piezoelectricity. The modified virus comprises a coat protein can displays a negatively charged amino acid sequence. The present invention provides for a device comprising a piezoelectric element comprising a suitable virus, such as the modified virus, a first surface and a second surface, wherein the first surface is in contact with a first electrode and the second surface is in contact with a second electrode, wherein when pressure is applied to the film, the film is capable of generating an electric current. The present invention provides for a method of making the device, and a method for generating electricity using the device.

Methods to utilize piezoelectric materials as a gate dielectric in RBTs in an IC device to generate and sense higher frequency signals with high Qs and resulting devices are disclosed. Embodiments include forming, on an upper surface of a semiconductor layer, RBTs comprising even multiples of sensing RBTs and driving RBTs, each RBT including a piezoelectric gate dielectric layer, a gate, and a dielectric spacer on opposite sides of the piezoelectric gate dielectric layer and gate, wherein at least one pair of sensing RBTs is directly between two groups of driving RBTs; forming metal layers, separated by interlayer dielectric layers, above the RBTs; and forming vias through a dielectric layer above the RBTs connecting the RBTs to a metal layer.

A driver includes a piezoelectric sheet, a fixing frame, a moving frame, and a control circuit. The piezoelectric sheet includes a first piezoelectric body portion which bends in a first direction, a second piezoelectric body portion which bends in a second direction that intersects at right angles with the first direction, and a connection portion which connects the first and second piezoelectric body portions. The fixing frame is fixed to the connection portion. The moving frame is supported on the first and second piezoelectric body portions. The control circuit applies voltage signals to the first and second piezoelectric body portions to bend the first and second piezoelectric body portions and which moves the moving frame in one of the first direction and the second direction or in a composite direction of the first direction and the second direction.

An actuator device and a manufacturing method for the actuator device with which an outer electrode electrically connected to an inner electrode can be reliably formed even when using a film made of an electrostrictive material. An actuator device includes a plurality of stacked electrostrictive films each of which is made of an electrostrictive material and includes inner electrodes formed on one surface or both surfaces of the film. Lead electrodes are formed to be led out respectively from the inner electrodes toward the outside of the electrostrictive film 31. At least one cut portion is formed in each of the lead electrodes, and conductive ink is applied to the cut portion. The conductive ink reaches, from the cut portions, the lead electrodes formed on the electrostrictive film.

Methods to utilize piezoelectric materials as a gate dielectric in RBTs in an IC device to generate and sense higher frequency signals with high Qs and resulting devices are disclosed. Embodiments include forming, on an upper surface of a semiconductor layer, RBTs comprising even multiples of sensing RBTs and driving RBTs, each RBT including a piezoelectric gate dielectric layer, a gate, and a dielectric spacer on opposite sides of the piezoelectric gate dielectric layer and gate, wherein at least one pair of sensing RBTs is directly between two groups of driving RBTs; forming metal layers, separated by interlayer dielectric layers, above the RBTs; and forming vias through a dielectric layer above the RBTs connecting the RBTs to a metal layer.

A piezoelectric module includes an element substrate that includes a plurality of piezoelectric bodies (piezoelectric elements) arranged in an array, and a plurality of connection electrodes (lower connection electrode and upper connection electrode) that are connected to the piezoelectric body (piezoelectric element) and are drawn between the piezoelectric body (piezoelectric element) and an adjacent piezoelectric body (piezoelectric element), an input and output circuit that is provided on one surface side of the element substrate and independently inputs and outputs a signal from and to each of the connection electrodes (lower connection electrode and upper connection electrode), and columnar electrodes (first through electrode and second through electrode) each of which is provided between each of the connection electrodes (lower connection electrode and upper connection electrode) and the input and output circuit and connects each of the connection electrodes (lower connection electrode and upper connection electrode) and the input and output circuit to each other.

The present disclosure provides a piezoelectric element, a piezoelectric vibrator, and a manufacturing method thereof, and an electronic device, and the present disclosure relates to the field of piezoelectric technologies. In the present disclosure, the piezoelectric element is provided with a first electrode and a second electrode positioned on the first electrode. The second electrode is provided with an opening where the first electrode is exposed. A piezoelectric structure is further arranged in the piezoelectric element. The piezoelectric structure includes a first piezoelectric portion and a second piezoelectric portion arranged around the first piezoelectric portion. The first piezoelectric portion is arranged in the opening and is in contact with the first electrode, the second piezoelectric portion is arranged on a side of the second electrode away from the first electrode, and the second piezoelectric portion has orientation.

A sensor device and an electronic apparatus by which downsizing and a reduction in costs can be achieved is provided. A sensor device according to an embodiment of the present technology includes a sensor element and a semiconductor element. The semiconductor element includes a first surface, a second surface, and a via-hole. The first surface includes a first terminal on which the sensor element is mounted and is an inactive surface. The second surface includes a second terminal for external connection and is an active surface. The via-hole electrically connects the first surface and the second surface to each other.