A nonvolatile memory device according to an embodiment includes a substrate having an upper surface, a gate line structure disposed over the substrate, a gate dielectric layer covering one sidewall surface of the gate line structure and disposed over the substrate, a channel layer disposed to cover the gate dielectric layer and disposed over the substrate, a bit line structure and a resistance change structure to contact different portions of the channel layer over the substrate, and a source line structure disposed in the resistance change structure. The gate line structure includes at least one gate electrode layer pattern and interlayer insulation layer pattern that are alternately stacked along a first direction perpendicular to the substrate, and extends in a second direction perpendicular to the first direction.

A memory device includes a memory cell and a first select transistor. The memory cell includes a variable resistance memory region, a first semiconductor layer being in contact with the variable resistance memory region, a first insulating layer being in contact with the first semiconductor layer, and a first voltage application electrode being in contact with the first insulating layer. The first select transistor includes a second semiconductor layer, a second insulating layer being in contact with the second semiconductor layer, and a second voltage application electrode extending in the second direction and being in contact with the second insulating layer.

Disclosed is a synaptic device, a reservoir computing device using the synaptic device, and a reservoir computing method using the reservoir computing device. The synaptic device includes a substrate and a plurality of units cells on the substrate, wherein the unit cells each include a channel layer and a first electrode and second electrode intersecting the channel layer, wherein the first electrode and the second electrode are spaced apart from each other, and define a gap region exposing a portion of the channel layer, and the channel layer includes a 2-dimensional semiconductor material or a 2-dimensional ferroelectric material.

Provided are a semiconductor device and a semiconductor apparatus. The semiconductor device may include a first electrode; a second electrode spaced apart from the first electrode; and a selection device layer including a chalcogen compound layer between the first electrode and the second electrode and a metal oxide doped in the chalcogen compound layer. In the semiconductor device, by doping the metal oxide, an off-current value (leakage current value) of the selection device layer may be reduced, and static switching characteristics may be implemented.

A nonvolatile memory device according to an embodiment includes a substrate, a resistance change layer disposed over the substrate, a gate insulation layer disposed on the resistance change layer, a gate electrode layer disposed on the gate insulation layer, and a first electrode pattern layer and a second electrode pattern layer that are disposed respectively over the substrate and disposed to contact a different portion of the resistance change layer.

A semiconductor memory device has a first wiring extending in a first direction and a second wiring extending in a second direction. The first and second wirings are spaced from each other in a third direction. The second wiring has a first recess facing the first wiring. A resistance change memory element is connected between the first and second wirings. A conductive layer is between the resistance change memory element and the second wiring and includes a first protrusion facing the second wiring. A switching portion is between the conductive layer and the second wiring and includes a second recess facing the conductive layer and a second protrusion facing the second wiring. The first protrusion is in the second recess. The second protrusion is in the first recess. The switching portion is configured to switch conductivity state according to voltage between the first wiring and the second wiring.

An electronic device includes a base element, a source electrode layer and a drain electrode layer disposed to be spaced apart from each other on the base element, a channel layer disposed between the source electrode layer and the drain electrode layer on the base element that accommodates metal ions, a metal ion conduction layer disposed on the channel layer, and a gate electrode layer disposed on the metal ion conduction layer. The channel layer includes a plurality of unit films and channel spaces between the plurality of unit films. The plurality of unit films are arranged to be parallel to a direction substantially perpendicular to a surface of the base element.

A memory device is provided. The memory device includes a ReRAM memory element, and a PCM memory element that is electrically connected in parallel with the ReRAM memory element.

A semiconductor memory structure includes a memory cell, an encapsulation layer over a sidewall of the memory cell, and a nucleation layer between the sidewall of the memory cell and the encapsulation layer. The memory cell includes a top electrode, a bottom electrode and a data-storage element sandwiched between the bottom electrode and the top electrode. The nucleation layer includes metal oxide.

The present disclosure includes apparatuses and methods for material implication operations in memory with reduced program voltages. An example apparatus can include an array of memory cells that further includes a first memory cell coupled to a first access line and to a first one of a plurality of second access lines and a second memory cell coupled to the first access line and to a second one of the plurality of second access lines. The circuitry can be configured to apply, across the second memory cell, a first voltage differential having a first polarity and a first magnitude. The first voltage differential reduces, if the second memory cell is programmed to a first data state, a magnitude of a drifted threshold voltage for programming the second memory cell to a second data state. The circuitry is further configured to apply, subsequent to the application of the first voltage differential, a first signal to the first access line. The circuitry is further configured to, while the first signal is being applied to the first access line, apply, subsequent to the application of the first voltage differential, a second voltage differential having a second polarity and the first magnitude across the first memory cell and apply a third voltage differential having the second polarity across the second memory cell. A material implication operation is performed as a result of the first, second, and third voltage differentials applied across the first and the second memory cells with a result of the material implication operation being stored on the second memory cell.