H01F1/38

SOFT MAGNETIC ALLOY AND MAGNETIC COMPONENT

A soft magnetic alloy which includes nanocrystal parts and amorphous parts is provided. The nanocrystal parts include Fe(Si) as a main component, and include at least one of elements selected from B, P, C, Ti, Zr, Hf, Nb, Ta, Mo, V, W, Cr, Al, Mn, Zn, and Cu as a sub-component. When a total content ratio of the sub-component in the nanocrystal parts is set as (at %), and a total content ratio of the sub-components of the nanocrystal parts included in the amorphous parts is set as (at %), 0.01(/)0.40, and a crystallinity degree is 5% or more and 70% or less.

SOFT MAGNETIC ALLOY AND MAGNETIC COMPONENT

A soft magnetic alloy which includes nanocrystal parts and amorphous parts is provided. The nanocrystal parts include Fe(Si) as a main component, and include at least one of elements selected from B, P, C, Ti, Zr, Hf, Nb, Ta, Mo, V, W, Cr, Al, Mn, Zn, and Cu as a sub-component. When a total content ratio of the sub-component in the nanocrystal parts is set as (at %), and a total content ratio of the sub-components of the nanocrystal parts included in the amorphous parts is set as (at %), 0.01(/)0.40, and a crystallinity degree is 5% or more and 70% or less.

Method for manufacturing dust core and dust core

A method for manufacturing a dust core, includes: applying energy to a surface of a soft magnetic powder coated with an insulating body containing a compound having an aluminum-oxygen bond; exposing the soft magnetic powder to an atmosphere having a dew point of ?30? C. or higher and 15? C. or lower under an atmospheric pressure; and forming a molded product by pressing the soft magnetic powder at 20 MPa or more and 400 MPa or less.

Method for manufacturing dust core and dust core

A method for manufacturing a dust core, includes: applying energy to a surface of a soft magnetic powder coated with an insulating body containing a compound having an aluminum-oxygen bond; exposing the soft magnetic powder to an atmosphere having a dew point of ?30? C. or higher and 15? C. or lower under an atmospheric pressure; and forming a molded product by pressing the soft magnetic powder at 20 MPa or more and 400 MPa or less.

MAGNETIC MATERIAL, ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING MAGNETIC MATERIAL
20180374619 · 2018-12-27 ·

A magnetic material includes a soft magnetic metal grain containing Fe, and a multilayer oxide film covering the surfaces of the soft magnetic metal grain. The multilayer oxide film has a first oxide layer of crystalline nature containing Fe, and a second oxide layer of amorphous nature containing Si. In an embodiment, the silicon oxide film of amorphous nature is formed by dripping, divided into multiple sessions, a treatment solution containing TEOS (tetraethoxy silane), ethanol, and water into a mixed solution containing the soft magnetic metal grain, ethanol, and ammonia water, to mix the solutions.

MAGNETIC MATERIAL, ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING MAGNETIC MATERIAL
20180374619 · 2018-12-27 ·

A magnetic material includes a soft magnetic metal grain containing Fe, and a multilayer oxide film covering the surfaces of the soft magnetic metal grain. The multilayer oxide film has a first oxide layer of crystalline nature containing Fe, and a second oxide layer of amorphous nature containing Si. In an embodiment, the silicon oxide film of amorphous nature is formed by dripping, divided into multiple sessions, a treatment solution containing TEOS (tetraethoxy silane), ethanol, and water into a mixed solution containing the soft magnetic metal grain, ethanol, and ammonia water, to mix the solutions.

Electromagnetic Interference Shielding and Thermal Management of Electronic Devices Using Thermomagnetic Composites

Composite materials for simultaneous thermal management and electromagnetic interference screening of radiofrequency-based electronic systems are provided. The materials contain a phase change material and one or more electrically and thermally conductive filler particles. The materials provide a passive system for thermal management and EMI shielding that is lightweight, does not contain moving parts, and does not require an external power supply.

Electromagnetic Interference Shielding and Thermal Management of Electronic Devices Using Thermomagnetic Composites

Composite materials for simultaneous thermal management and electromagnetic interference screening of radiofrequency-based electronic systems are provided. The materials contain a phase change material and one or more electrically and thermally conductive filler particles. The materials provide a passive system for thermal management and EMI shielding that is lightweight, does not contain moving parts, and does not require an external power supply.

Amorphous Alloy Soft Magnetic Powder, Dust Core, Magnetic Element, And Electronic Device
20260117355 · 2026-04-30 ·

An amorphous alloy soft magnetic powder includes: impurities; and a composition represented by a composition formula Fe.sub.a(Si.sub.1-xB.sub.x).sub.bC.sub.cS.sub.d represented by an atomic ratio, where a is 100bcd. In addition, b, c, d, and x are 16.0b22.0, 0<c4.0, 0.001d0.080, and 0.5x0.9. In a volume-based cumulative particle size distribution obtained using a laser diffraction type particle size distribution measurement device, when D50 is a particle diameter at which a cumulative frequency is 50% from a small diameter side, the particle diameter D50 is 22.0 m or more and 32.0 m or less, hollow particles are contained, and a number ratio of the hollow particles is 3% or more and 22% or less.

Amorphous Alloy Soft Magnetic Powder, Dust Core, Magnetic Element, And Electronic Device
20260117355 · 2026-04-30 ·

An amorphous alloy soft magnetic powder includes: impurities; and a composition represented by a composition formula Fe.sub.a(Si.sub.1-xB.sub.x).sub.bC.sub.cS.sub.d represented by an atomic ratio, where a is 100bcd. In addition, b, c, d, and x are 16.0b22.0, 0<c4.0, 0.001d0.080, and 0.5x0.9. In a volume-based cumulative particle size distribution obtained using a laser diffraction type particle size distribution measurement device, when D50 is a particle diameter at which a cumulative frequency is 50% from a small diameter side, the particle diameter D50 is 22.0 m or more and 32.0 m or less, hollow particles are contained, and a number ratio of the hollow particles is 3% or more and 22% or less.