A fuse element is a fuse element (1) including a flat plate-shaped blowout section (1e) with no through-hole disposed between a first terminal (20a) and a second terminal (20b), in which a width (1d) of the blowout section (1e) has a length equal to or greater than 80% of a width (2d) of each of joining portions joining the first terminal (20a) and the second terminal (20b) to the blowout section (1e). The width (1d) of the blowout section (1e) is preferably a length equal to or greater than 95% of the width (2d) of each of the joining portions.

A chip-type fuse includes a plated-shape fusible body (26). The fusible body (26) has internal electrodes (28 and 30) facing toward the center of the straight line from both ends of the straight line, respectively and has a fusible portion (32) formed between the internal electrodes (28 and 30) and integrated with them. The fusible body is housed into a casing (2). Protrusions (38 and 40) protrude from the parts of the both ends of the internal electrodes (28 and 30). The protrusions (38 and 40) are covered with plating layers (50 and 52).

A method of manufacturing a fuse includes stacking a base plate, an at least partially conductive fabric over the base plate and a cover layer over the fabric, each with an intervening bonding layer. At least one cavity is provided on both sides of the fabric, adjoining the fabric, between the respective edge regions. In addition, the fabric includes at least one first fiber which is electrically conductive and second fibers which are non-conductive and which have a lower melting temperature than the first fiber. The method further includes heating the stacked elements to a temperature below the melting temperature of the first fiber and above the melting temperature of the second fibers.

The present invention provides a substrate surface-mounted fuse that uses a replacement fuse to enable an electric circuit to be electrically connected simply and immediately even when a fuse part melts. A substrate surface-mounted fuse 100 mounted on the surface of a substrate 300 comprises: a housing 110; a fuse part 120 that is disposed in the housing 110; and a terminal part 130 that is coupled to both ends of the fuse part 120 and exposed to the outside of the housing 110, wherein a portion of the terminal part 130 is provided with a fixed section 134 for fixing to the surface of the substrate 300 and is provided with an attachment part 140 enabling attachment of a terminal part 230 of a replacement fuse 200.

A surface-mountable thin-film fuse component is disclosed that may include a substrate having a top surface, a first end, and a second end that is spaced apart from the first end in a longitudinal direction. The thin-film component may include a fuse layer formed over the top surface of the substrate. The fuse layer may include a thin-film fuse track. An external terminal may be disposed along the first end of the substrate and electrically connected with the thin-film fuse track. The external terminal may include a compliant layer comprising a conductive polymeric composition.

A fuse resistor includes a substrate, an insulation layer, a fuse element, a protection layer, a first electrode, and a second electrode. The insulation layer covers a surface of the substrate. The fuse element is disposed on a portion of the insulation layer. The fuse element includes a first electrode portion, a melting portion, and a second electrode portion, in which the first electrode portion and the second electrode portion are respectively connected to two opposite ends of the melting portion. The protection layer covers the fuse element and the insulation layer, in which the protection layer has a concave located on the melting portion. The first electrode is electrically connected to the first electrode portion. The second electrode is electrically connected to the second electrode portion.

A surface mount device chip fuse including a dielectric substrate, electrically conductive first and second upper terminals disposed on a top surface of the dielectric substrate and defining a gap therebetween, a fusible element formed of solder disposed on the top surface of the dielectric substrate, within the gap, bridging the first and second upper terminals, and electrically conductive first and second lower terminals disposed on a bottom surface of the dielectric substrate and electrically connected to the first and second upper terminals, respectively, wherein a material of the dielectric substrate exhibits a de-wetting characteristic relative to the solder from which the fusible element is formed.

An airtight surface mount fuse with a cavity has a housing, a conductive fuse, a cover and an encapsulant. The housing has an opening and an airtight inner space. The fusible element has a part disposed inside of the airtight inner space and another part exposed from the opening. The cover is configured to fit into the opening. The encapsulant encapsulates the housing, the cover and a segment of the exposing part of the fusible element. The other segment of the fusible element is exposed from the encapsulant. The inner space of the housing is encapsulated by the encapsulant and becomes airtight. The fusible element is disposed inside of the airtight inner space to prevent the hazard occurring from arc spark interacting with flammable gases when a fusible body of the fusible element is fused. It also ensures the fusible body is affected by the external environment.

A protective element includes: at least two electrode portions (main electrodes) supported by an insulating support (insulating substrate); a fuse element that connects the electrode portions; and an operating flux provided on the fuse element. The operating flux has, on a surface thereof, a coating layer that covers the operating flux to prevent the operating flux from flowing.

The invention relates to a conducting track fuse (1) for an electrical or electronic device, comprising: a first and a second connection region (2a, 2b); a nonlinearly extending burn-out region (3), which is arranged between the first and second connection regions (2a, 2b); and a covering element (15), which has at least two side walls (9) and a covering face (8), which covering element is arranged over the first and second connection regions (2a, 2b) and over the burn-out region (3), the burn-out region (3) and the covering element (5) being arranged relative to each other in such a way that the area of the covering face (8) covers the burn-out region (3) and a cavity (7) is formed between the burn-out region (3) and the covering face (8) as a result of the height of the side walls (9).