A high breaking capacity chip fuse including a bottom insulative layer, a first intermediate insulative layer, a second intermediate insulative layer, and a top insulative layer disposed in a stacked arrangement in the aforementioned order, a fusible element disposed between the first and second intermediate insulative layers and extending between electrically conductive first and second terminals at opposing longitudinal ends of the bottom insulative layer, the first intermediate insulative layer, the second intermediate insulative layer, and the top insulative layer, wherein the first and second intermediate insulative layers are formed of porous ceramic.

A fuse includes a body, a first conductive terminal coupled with a first end of the body, and a second conductive terminal coupled with a second end of the body. The body, the first conductive terminal, and the second conductive terminal define an exterior of the fuse. The fuse also includes an interruption assembly including a fusible element. The fusible element includes carbon fiber, is disposed on a conductive path between the first conductive terminal and the second conductive terminal, and is configured to break when a current through the fusible element exceeds a predetermined current.

A fuse includes a body, a first conductive terminal coupled with a first end of the body, and a second conductive terminal coupled with a second end of the body. The body, the first conductive terminal, and the second conductive terminal define an exterior of the fuse. The fuse also includes an interruption assembly including a fusible element. The fusible element includes carbon fiber, is disposed on a conductive path between the first conductive terminal and the second conductive terminal, and is configured to break when a current through the fusible element exceeds a predetermined current.

A three phase surge protection device is disclosed. In an embodiment a device include a stack comprising a first varistor, a second varistor and a third varistor, wherein the varistors are electrically connected to form a circuit and a first thermal disconnect configured to interrupt the circuit when a temperature of the first thermal disconnect exceeds a predefined temperature.

A chip type fuse excellent in resistance to climate conditions, where the fuse is able to operate stably under high temperature and high humidity environments. The fuse includes an insulative substrate; an under-glass layer formed on the insulative substrate; a fuse element formed on the under-glass layer; a pair of electrodes formed at both end sides of the fuse element; and an over-glass layer covering at least a fusing section of the fuse element; wherein the fuse element includes a layer where a first metal layer and a second metal layer are piled up, and a barrier layer consisting of a third metal layer, which covers the first metal layer and the second metal layer with a width that is wider than the width of the first metal layer and the second metal layer. The third metal layer overwraps the second metal layer and the first metal layer.

A chip type fuse excellent in resistance to climate conditions, where the fuse is able to operate stably under high temperature and high humidity environments. The fuse includes an insulative substrate; an under-glass layer formed on the insulative substrate; a fuse element formed on the under-glass layer; a pair of electrodes formed at both end sides of the fuse element; and an over-glass layer covering at least a fusing section of the fuse element; wherein the fuse element includes a layer where a first metal layer and a second metal layer are piled up, and a barrier layer consisting of a third metal layer, which covers the first metal layer and the second metal layer with a width that is wider than the width of the first metal layer and the second metal layer. The third metal layer overwraps the second metal layer and the first metal layer.

It is an object of the invention to provide an electric wire having an excellent electrical conductivity in use of the high melting point metal and being able to surely cut off by fusing the conductive material itself at a temperature lower than the melting point of the high melting point metal, even where heat is generated from flowing overcurrent in the electrical circuit. The electric wire of the invention has a feature including a conductive material formed of a first conductive member made of a low melting point metal, and a second conductive member made of a high melting point metal, which are provided adjacent to each other, wherein the conductive material is fused by erosion of the high melting point metal according to melting of the low melting point metal.

It is an object of the invention to provide an electric wire having an excellent electrical conductivity in use of the high melting point metal and being able to surely cut off by fusing the conductive material itself at a temperature lower than the melting point of the high melting point metal, even where heat is generated from flowing overcurrent in the electrical circuit. The electric wire of the invention has a feature including a conductive material formed of a first conductive member made of a low melting point metal, and a second conductive member made of a high melting point metal, which are provided adjacent to each other, wherein the conductive material is fused by erosion of the high melting point metal according to melting of the low melting point metal.

A method for manufacturing a chip fuse, comprises: a liquid film forming step for forming a liquid film of dispersion liquid having metal nanoparticles dispersed therein on a principal surface of a substrate; a fuse film forming step for forming a fuse film on the principal surface by irradiating the liquid film with laser light; and a first terminal forming step for forming first terminals that each connects to the fuse film on each of both end sides in a longitudinal direction of the fuse film on the principal surface.

A fuse device and a fuse element having excellent rapid blowout properties and excellent insulation properties after blowout even in a size-reduced fuse device are provided. A fuse element constitutes a current path of a fuse device and blows out due to self-generated heat when a rating-exceeding current flows, a length W in a width direction perpendicular to a conduction direction being greater than a total length L in the conduction direction in the fuse element. In particular, the fuse element includes a low melting point metal layer and a high melting point metal layer, the low melting point metal layer eroding the high melting point metal layer when current flows to cause blowout.