An electronic fuse (e-fuse) module may be formed in copper interconnect in an integrated circuit device. A pair of e-fuse terminals may be formed by forming a pair of spaced-apart e-fuse terminal structures (e.g., copper damascene structures) and forming a conductive barrier region on each e-fuse terminal structure. The barrier regions may be formed by displacement plating a conductive barrier layer, e.g., comprising CoWP, CoWB, Pd, CoP, Ni, Co, or Ni—Co alloy, on each e-fuse terminal structure. An e-fuse element, e.g., comprising NiCr, TiW, TiWN, or Al, may be formed on the barrier regions of the pair of e-fuse terminals to define a conductive path between the pair of e-fuse terminal structures through the e-fuse element and through the barrier region on each e-fuse terminal structure. The barrier regions may protect the e-fuse terminal structures (e.g., copper structures) from corrosion and/or diffusion.

An electrical fuse assembly includes electrically conductive first and second electrodes, and a bimetallic fuse element. The bimetallic fuse element electrically connects the first and second electrodes. The bimetallic fuse element is configured to disintegrate, and thereby disconnect the first electrode from the second electrode, in response to a current exceeding a prescribed trigger current of the bimetallic fuse element for at least a prescribed duration.

An electrical fuse assembly includes electrically conductive first and second electrodes, and a bimetallic fuse element. The bimetallic fuse element electrically connects the first and second electrodes. The bimetallic fuse element is configured to disintegrate, and thereby disconnect the first electrode from the second electrode, in response to a current exceeding a prescribed trigger current of the bimetallic fuse element for at least a prescribed duration.

A flexible printed circuit board (FPCB) including a pattern circuit layer. The pattern circuit layer has a pattern fuse embedded therein, and the pattern fuse includes a first conductive wire made of a metal and having a spiral structure, and a second conductive wire made of a metal and having a spiral structure. The first conductive wire and the second conductive wire have a double helix structure.

Systems, apparatuses, and methods are described for thermal fuse circuit breakers. The thermal fuses described herein may be disposed in a connector, so that, should an overheating condition occur, for example, due to an arc discharge across or inside of the connector, the heat of the arc discharge melts a portion of the fuse, thereby preventing a potentially catastrophic event, such as fire, or damage to a component which may be more expensive than the thermal fuse itself.

Some embodiments include a fuse having a tungsten-containing structure directly contacting an electrically conductive structure. The electrically conductive structure may be a titanium-containing structure. An interface between the tungsten-containing structure and the electrically conductive structure is configured to rupture when current through the interface exceeds a predetermined level. Some embodiments include a method of forming and using a fuse. The fuse is formed to have a tungsten-containing structure directly contacting an electrically conductive structure. An interface between the tungsten-containing structure and the electrically conductive structure is configured to rupture when current through the interface exceeds a predetermined level. Current exceeding the predetermined level is passed through the interface to rupture the interface.

Some embodiments include a fuse having a tungsten-containing structure directly contacting an electrically conductive structure. The electrically conductive structure may be a titanium-containing structure. An interface between the tungsten-containing structure and the electrically conductive structure is configured to rupture when current through the interface exceeds a predetermined level. Some embodiments include a method of forming and using a fuse. The fuse is formed to have a tungsten-containing structure directly contacting an electrically conductive structure. An interface between the tungsten-containing structure and the electrically conductive structure is configured to rupture when current through the interface exceeds a predetermined level. Current exceeding the predetermined level is passed through the interface to rupture the interface.

A thermal cutoff at least includes a current-carrying fusible element having two ends connected to a first electrode and a second electrode. The current-carrying fusible element is provided in a closed cavity bounded by a housing having an opening at one end, a cover plate, and a sealant. The thermal cutoff further includes a first lead wire and a second lead wire each wrapped by an insulating sheath. One end of the first lead wire and one end of the second lead wire are electrically connected to the first electrode and the second electrode. The sealant is filled in the opening of the housing, covers an electrical joint between the first lead wire and a first electrode plate and an end of the first lead wire, and also covers an electrical joint between a second electrode plate and the second lead wire and an end of the second lead wire.

A thermal cutoff at least includes a current-carrying fusible element having two ends connected to a first electrode and a second electrode. The current-carrying fusible element is provided in a closed cavity bounded by a housing having an opening at one end, a cover plate, and a sealant. The thermal cutoff further includes a first lead wire and a second lead wire each wrapped by an insulating sheath. One end of the first lead wire and one end of the second lead wire are electrically connected to the first electrode and the second electrode. The sealant is filled in the opening of the housing, covers an electrical joint between the first lead wire and a first electrode plate and an end of the first lead wire, and also covers an electrical joint between a second electrode plate and the second lead wire and an end of the second lead wire.

A high breaking capacity chip fuse including a bottom insulative layer, a first intermediate insulative layer, a second intermediate insulative layer, and a top insulative layer disposed in a stacked arrangement in the aforementioned order, a fusible element disposed between the first and second intermediate insulative layers and extending between electrically conductive first and second terminals at opposing longitudinal ends of the bottom insulative layer, the first intermediate insulative layer, the second intermediate insulative layer, and the top insulative layer, wherein the first and second intermediate insulative layers are formed of porous ceramic.