A method of manufacturing a semiconductor device includes forming a three-dimensional (3D) structure on a substrate, forming an adsorption control layer to cover an upper portion of the 3D structure, and forming a material layer on the adsorption control layer and on a lower portion of the 3D structure that is not covered by the adsorption control layer, wherein a minimum thickness of the material layer on the adsorption control layer is less than a maximum thickness of the material layer on the lower portion of the 3D structure.

A Group III-Nitride quantum well laser including a distributed Bragg reflector (DBR). In some embodiments, the DBR includes Scandium. In some embodiments, the DBR includes Al.sub.1-xSc.sub.xN, which may have 0<x≤0.45.

Photonic devices having a photonic waveguiding layer, and a cladding layer, disposed on the photonic waveguiding layer, and where the cladding section is a material comprising Scandium. The cladding layer may include a material comprising Al.sub.1-xSc.sub.xN material where 0<x≤0.45.

Exemplary semiconductor structures may include a silicon-containing substrate. The structures may include a first layer of a first metal nitride overlying the silicon-containing substrate. The structures may include a second layer of a second metal nitride overlying the first layer of the first metal nitride. The structures may include a gallium nitride structure overlying the layer of the metal nitride.

The invention is a special designed pattern heterogeneous substrate, which is epitaxially deposited on a heterogeneous substrate by two step growth, and a thermal cycle annealing is added to reduce the lattice mismatch between the layers and the difference in thermal expansion coefficient, thereby obtaining a better stress. The quality of the semiconductor epitaxial layer is improved, and the present invention can easily grasp the timing of stress release when the semiconductor is grown on the heterogeneous substrate, avoid cracks in the semiconductor epitaxial layer, and form a crack free zone in the middle of the semiconductor epitaxial layer.

Provided are a conductive structure and a method of controlling a work function of metal. The conductive structure includes a conductive material layer including metal and a work function control layer for controlling a work function of the conductive structure by being bonded to the conductive material layer. The work function control layer includes a two-dimensional material with a defect.

A method of forming a silicon film on a substrate having a fine pattern includes performing surface treatment with an adhesion promoter on the substrate having the fine pattern, forming a coating film by applying a silane polymer solution to the substrate on which the surface treatment has been performed, and heating the coating film.

A method of producing an epitaxial silicon wafer includes irradiating a surface of a silicon wafer with a beam of cluster ions containing SiH.sub.x ions (at least one of the integers 1 to 3 is selected as x of the SiH.sub.x ions) and C.sub.2H.sub.y ions (at least one of the integers 2 to 5 is selected as y of the C.sub.2H.sub.y ions) to form a modified layer that is located in a surface layer portion of the silicon wafer and that contains as a solid solution of the constituent elements of the cluster ion beam, and further includes forming a silicon epitaxial layer on the modified layer of the silicon wafer. The dose of the SiH.sub.x ions is 1.5×10.sup.14 ions/cm.sup.2 or more.

A two-dimensional electronic component includes a substrate; an artificial two-dimensional (2D) material disposed on the substrate; and a first metallic electrode disposed on the artificial 2D material. The artificial 2D material includes a layered atomic structure including a middle atomic layer, a lower atomic layer disposed on a lower surface of the middle atomic layer, and an upper atomic layer disposed on an upper surface of the middle atomic layer respectively. The upper atomic layer and the first metallic electrode are attracted together at a junction therebetween by metallic bonding.

A method for atomically manipulating an artificial two-dimensional material includes providing a first artificial two-dimensional (2D) material having a layered atomic structure; placing the first artificial 2D material in a vacuumed reactive chamber; using plasma to remove an atomic layer on one surface of the first artificial 2D material to expose unsaturated compounds; introducing heterogeneous atoms into the vacuumed reactive chamber, the heterogeneous atoms being different from atoms on the other surface of the first artificial 2D material; and binding the heterogeneous atoms with the unsaturated compounds to form a second artificial 2D material having two heterogeneous junctions.