The present disclosure has been conceived to solve such a problem, and it is an object of the present disclosure to provide a semiconductor device enabling reduction in cost. A semiconductor device according to the present disclosure includes: a base plate; an insulating substrate disposed over the base plate; a semiconductor chip disposed over the insulating substrate; a first resin case and a second resin case attached to the base plate to enclose the insulating substrate and the semiconductor chip, and fitted together; and a sealing material to seal the insulating substrate and the semiconductor chip, wherein the first resin case and the second resin case are formed of resin materials having different comparative tracking indices.

A device includes a substrate with a die over the substrate. A molding compound surrounds the die and includes a structural interface formed along a peripheral region of the molding compound.

The present disclosure provides a measurement method including providing a base, a device disposed on the base, and a lid disposed over the base and the device; irradiating a top surface of the device through an opening of the lid to obtain a first focal plane associated with a top surface of the device; irradiating the lid at the lower end of the opening to obtain a second focal plane associated with the lid at the lower end of the opening; and deriving a distance between the top surface of the device and an interior surface of the lid facing the top surface of the device based on a difference between a level of the first focal plane and a level of the second focal plane. The present disclosure also provides a package structure for the measurement.

Each of a plurality of terminals has a first portion and a second portion being a connection target for a semiconductor element. A manufacturing method of a housing includes a first step arranging, for a lower mold provided with a plurality of holes each of which is a target into which the first portion is inserted, a nest having a third portion covering at least one of the holes, a second step arranging, for the lower mold with the nest being arranged therein, the plurality of terminals by inserting the first portion into the hole not covered by the third portion, a third step arranging an upper mold on the lower mold with the nest and the plurality of terminals being arranged therein, and a fourth step, which is executed after the third step, obtaining the housing by performing resin molding using the lower mold and the upper mold.

A method of packaging an RF transistor device includes attaching one or more electronic devices to a carrier substrate, applying an encapsulant over at least one of the one or more electronic devices, and providing a protective structure on the carrier substrate over the one or more electronic devices. A packaged RF transistor device includes a carrier substrate, one or more electronic devices attached to the carrier substrate, an encapsulant material over at least one of the one or more electronic devices and extending onto the carrier substrate, and a protective structure on the carrier substrate over the one or more electronic devices and the encapsulant material.

A power module can include a casing mounted to a baseplate that contains a substrate with circuitry. The circuitry can include pins for coupling signals to/from the circuitry. These pins can extend through a cover portion of the casing so that an electronic substrate, such as a printed circuit board (PCB) can be press-fit onto the pins. When press-fit, the electronic substrate is supported and positioned by support pillars that extend from the base plate to above the cover portion of the casing. If the pins and the support pillars have different coefficients of thermal expansion, damage to connection points between the pins and the circuitry may occur. Here, a power module is disclosed that has thermally matched pins and support pillars so that when the system is thermally cycled over a range of temperatures, the connection points are not damaged by forces induced by thermal expansion.

A power module which inhibits disjoin between a sealing resin and an adhesive. The power module includes: an insulative substrate having a semiconductor element mounted on the top surface; a base plate joined to the rear surface of the insulative substrate; a case member with the base plate, that surrounds the insulative substrate, the case member having a bottom surface whose inner periphery portion side being in contact with a top surface of the base plate, the bottom surface being provided with an angled surface whose distance to the top surface of the base plate increases toward an outer periphery side of the base plate; an adhesive member filled between the base plate and the angled surface to adhere the base plate and the case member; and a filling member filled in a region bounded by the base plate and the case member.

The method manufactures a hermetic sealing lid member used for an electronic component housing package including an electronic component arrangement member on which an electronic component is arranged. The method includes forming a clad material in which a silver brazing layer that contains Ag and Cu and a first Fe layer arranged on the silver brazing layer and made of Fe or an Fe alloy are bonded to each other by roll-bonding a silver brazing plate that contains Ag and Cu and a first Fe plate made of Fe or an Fe alloy to each other and performing first heat treatment for diffusion annealing; softening the clad material by performing second heat treatment; and forming the hermetic sealing lid member in a box shape including a recess portion by bending the softened clad material.

A flat plate frame is formed, which is flat plate-shaped, which has an opening penetrating its front and rear surfaces and groove terminal patterns formed on its front surface, and which contains a semi-cured thermosetting resin. Then, an insulating substrate is disposed on the rear surface so as to cover the opening of the flat plate frame, external connection terminals are disposed on the terminal patterns, and heating is carried out. As a result, a terminal package to which the insulating substrate and external connection terminals are firmly joined is produced using the flat plate frame. The external connection terminals included in the terminal package are reliably and firmly joined to the terminal package. Therefore, the external connection terminals are not displaced when wires are bonded to the external connection terminals.

Several embodiments of the present technology are described with reference to a semiconductor die assembly and processes for manufacturing the assembly. In some embodiments of the present technology, a semiconductor die assembly includes a stack of semiconductor dies attached to a thermal transfer structure (also known as a “heat spreader,” “lid,” or “thermal lid”). The thermal transfer structure conducts heat away from the stack of semiconductor dies. Additionally, the assembly can include molded walls fabricated with molding material to support the thermal transfer structure.