A method includes forming a release film over a carrier, attaching a device over the release film through a die-attach film, encapsulating the device in an encapsulating material, performing a planarization on the encapsulating material to expose the device, detaching the device and the encapsulating material from the carrier, etching the die-attach film to expose a back surface of the device, and applying a thermal conductive material on the back surface of the device.

A package structure and a manufacturing method for the same are provided. The package structure includes a circuit, a mold sealing layer, a conductive metal board, and a conductive layer. The circuit board includes a substrate and a first electronic element disposed on the substrate. The mold sealing layer is disposed on the substrate and covers the first electronic element. The mold sealing layer has a top surface, a bottom surface corresponding to the top surface, and a side surface connected between the top surface and the bottom surface. The conductive metal board is disposed on the top surface and adjacent to the first electronic element. The conductive layer is disposed on the side surface and electrically connected to the conductive metal board. The conductive metal board and the conductive layer are each an independent component.

Among two main surfaces of a heat dissipation member, one main surface is curved to be convex in an outward direction and the other convex in an inward direction. When a straight line passing through both endpoints P.sub.1 and P.sub.2 of the curve is l.sub.1, a point at which a distance to l.sub.1 on the curve is maximum is P.sub.max, an intersection point between l.sub.1 and a perpendicular drawn from P.sub.max to l.sub.1 is P.sub.3, a middle point of a line segment P.sub.1P.sub.3 is P.sub.4, an intersection point between the curve and a straight line that passes through P.sub.4 and is perpendicular to l.sub.1 is P.sub.mid, a length of the line segment P.sub.1P.sub.3 is L, a length of a line segment P.sub.3P.sub.max is H, and a length of a line segment P.sub.4P.sub.max is h, (2 h/L)/(H/L) is 1.1 or more.

There is provided an inexpensive metal/ceramic bonding substrate which has a metal circuit plate of aluminum or an aluminum alloy bonded directly to a ceramic substrate and which can prevent a large difference in level from being caused on portions corresponding to the grain boundaries of aluminum or the aluminum alloy even if heat cycles are repeatedly applied to the metal/ceramic bonding substrate, and a method for producing the same. In the preferred embodiment of a metal/ceramic bonding substrate, one side of a ceramic substrate 12 is bonded directly to a metal base plate 10 of aluminum or an aluminum alloy, and the other side of the ceramic substrate 12 is bonded directly to one side of a first metal plate 14 (for circuit pattern) of aluminum or the aluminum alloy, the other side of first metal plate 14 being bonded directly to one side of a graphite sheet 16, and the other side of the graphite sheet 16 being bonded directly to a second metal plate (for circuit pattern) 18 of aluminum or the aluminum alloy.

A heat transfer member reinforcement structure includes a main body. The main body has a first side, a second side and a reinforcement member. The reinforcement member is selectively disposed between the first and second sides or inlaid in a sink formed on the first side. The reinforcement member is connected with the main body to enhance the structural strength of the main body.

Electronic device package on package (POP) technology is disclosed. A POP can comprise a first electronic device package including a heat source. The POP can also comprise a second electronic device package disposed on the first electronic device package. The second electronic device package can include a substrate having a heat transfer portion proximate the heat source that facilitates heat transfer from the heat source through a thickness of the substrate. The substrate can also have an electronic component portion at least partially about the heat transfer portion that facilitates electrical communication. In addition, the POP can comprise an electronic component operably coupled to the electronic component portion.

A chip package unit includes: a base material; at least one chip, disposed on the base material; a package material, enclosing the base material and the chip; and at least one heat dissipation paste curing layer, formed by curing the heat dissipation paste, on a top side of the package material or a back side of the chip in a printed pattern.

Methods and systems for creating cold plates are disclosed. For example, in one example method for manufacturing a cold plate made of a thermally-conductive plastic includes performing a first injection-molding process using the thermally-conductive plastic to produce a first unitary body, the first unitary body including one or more elongated sections forming a unitary body, performing a second injection-molding process using the thermally-conductive plastic to produce a second unitary body, the second unitary body incorporating the first unitary body so as to cover a majority of the first unitary body and form a respective coolant pipe body corresponding to each elongated section, and performing a machining process on the second unitary body so as to create a conduit in each respective coolant pipe body suitable for a fluid to pass through to create respective coolant pipes.

An electronic device includes a first part, and a circuit plate including a circuit substrate, a plating film made of a plating material and being disposed on a front surface of the substrate. The plating film includes a first part region on which the first part is disposed via a first solder, and a liquid-repellent region extending along a periphery side of the first part region in a surface layer of the plating film, and having a liquid repellency greater than a liquid repellency of the plating film. The liquid-repellent region includes a resist region. The plating film includes a remaining portion between the liquid-repellent region and the front surface of the circuit substrate in a thickness direction of the plating film orthogonal to the front surface. The remaining portion is made of the plating material and is free of the oxidized plating material.

A semiconductor device includes a circuit substrate, a semiconductor package, and a package frame. The semiconductor package is disposed on the circuit substrate. The package frame is disposed over the circuit substrate. The package frame encircles the semiconductor package. The semiconductor package has a first surface facing the circuit substrate and a second surface opposite to the first surface. The package frame leaves exposed at least a portion of the second surface of the semiconductor package. The package frame forms a cavity, which cavity encircles the semiconductor package.