A substrate treatment apparatus includes: a substrate holding unit; a rotator for rotating the substrate holding unit; a first liquid nozzle for supplying a rinsing liquid; a second liquid nozzle for supplying a low surface tension liquid; a heater; a lifting mechanism for relatively moving up and down the heater between a contact position allowing the heater to be brought into contact with the lower surface of the substrate and a separation position allowing the heater to be separated from the substrate; a gas nozzle provided in an upper surface of the heater to suck the substrate; a suction pump for sucking an atmosphere above the heater through the gas nozzle; a gas supply source for supplying an inert gas toward above the heater through the gas nozzle; and a controller for selectively performing suction of the atmosphere or supply of the inert gas, through the gas nozzle.

Aspects of the disclosure provided herein generally relate to a fluid flow network configured to cool subsystems of a substrate processing system. Aspects of the disclosure provide a fluid flow network and method that adjusts the flow of the cooling fluid through each subsystem of the substrate processing system. The methods described herein can include maintaining a flow rate of the cooling fluid through each subsystem over a range of cooling fluid pressures. The methods described herein can further include configuring the fluid flow network to equalize a flow rate of the cooling fluid through similar subsystems such that the flow rate through each subsystem is similar without adjustment.

Exemplary substrate processing systems may include a chamber body defining a transfer region. The systems may include a first lid plate seated on the chamber body along a first surface of the first lid plate. The first lid plate may define a plurality of apertures through the first lid plate. The systems may include a plurality of lid stacks equal to a number of apertures of the plurality of apertures. The plurality of lid stacks may at least partially define a plurality of processing regions vertically offset from the transfer region. The systems may include a second lid plate coupled with the plurality of lid stacks. The plurality of lid stacks may be positioned between the first lid plate and the second lid plate. A component of each lid stack of the plurality of lid stacks may be coupled with the second lid plate.

A fluid supply apparatus includes a container supply holder configured to supply a container to a cap separator using a loading box, the container including a detachable nozzle cap, and configured to store a process fluid, a cap separator configured to receive the container from the loading box and separate the nozzle cap from a container body of the container using a cap clamper and a rotation actuator, the cap clamper configured to clamp and hold the nozzle cap, and the rotation actuator configured to rotate the container body, a fluid supplier configured to supply the process fluid contained in the container body through a fluid supply line, and a controller configured to control the container supply holder, the cap separator, and the fluid supplier.

A nozzle assembly for use in liquid-dispensing system, the nozzle assembly including: a body configured to receive a pipe; and the pipe, an end of the pipe being mounted on the body. The pipe includes multiple lumens correspondingly terminated in multiple orifices such that a liquid is escapable from each lumen through the corresponding orifice and is thereby dispensable from the nozzle assembly. The pipe has a first flow-capacity to supply a first volume of the liquid at a first flow-rate and at a first pressure. Each orifice and corresponding lumen has a second flow-capacity to supply a second volume of the liquid at a second flow-rate and at a second pressure.

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support unit configured to support and rotate a substrate at a treating space; a liquid supply unit configured to supply a liquid to the substrate supported at the support unit; a housing having an installation space; a laser unit configured to include a laser irradiation unit positioned in the installation space which irradiates a laser light, and an irradiation end having an end positioned to protrude from the housing and which irradiates the laser light irradiated from the laser irradiation unit to a substrate supported on the support unit; and a cover having an inner space and positioned so an end of the irradiation end protruding from the housing is positioned in the inner space, and wherein an opening is formed at a bottom end of the cover to overlap the laser light irradiated from the irradiation end when seen from above.

A manufacturing process of wafer thinning includes a step of wafer-grinding to grind a surface of a wafer to a first predetermined thickness, and a step of wafer-etching to etch the grinded face of the wafer with the first predetermined thickness to a second predetermined thickness.

An apparatus for processing a substrate may include a chemical liquid discharging part configured to discharge a chemical liquid having a first specific gravity onto a substrate, a chemical liquid supplying part configured to provide the chemical liquid to the chemical liquid discharging part, a fluid supplying part configured to provide a fluid having a second specific gravity different from the first specific gravity, a chemical liquid supplying part configured to provide a chemical liquid having a second specific gravity different from the first specific gravity, and a monitoring port including a trapping part configured to trap the fluid flowing into the chemical liquid supplying part and a sensing part configured to sense an inflow of the fluid. A heat transfer may be generated between the fluid and the chemical liquid such that the chemical liquid has a desired temperature. The fluid may be trapped at a top portion or a bottom portion of the trapping part in accordance with a difference between the first specific gravity and the second specific gravity.

The present invention provides a substrate treating apparatus including: a support unit supporting and rotating the substrate in a treatment space; a liquid supply unit supplying a liquid to the substrate supported by the support unit; and an irradiating module irradiating light to the substrate supported by the support unit, in which the irradiating module includes: a housing having an accommodation space; a laser unit located in the accommodation space, and including a laser irradiation unit irradiating laser light, and an irradiation end having one end protruding from the housing and irradiating the laser light irradiated from the laser irradiation unit to the substrate supported by the support unit; and a cooling unit located in the accommodation space and cooling the laser irradiation unit.

Embodiments provide a filter with a generally rectangular, non-cylindrical profile. The filter may have multiple pleat packs positioned between pleat covers that define regions and flow channels in a cavity of the filter body. The pleat covers have openings that allow a fluid to flow through the multiple pleat packs via parallel flows or series flows. End caps bonded to the body define flow passages for directing the fluid from an inlet to an outlet via the pleat packs for series or parallel filtration. The pleat packs may be made of the same or different materials and may be configured with the same or different heights based on flow requirements. A cage or a separator may be positioned between the pleat packs. The pleat packs may be made of a continuous pleated membrane with bridges defining a space between the pleat packs to accommodate the cage or separator.