A dispensing system includes a dispense material supply that contains a dispense material and a dispensing pump connected downstream from the dispense material supply. The dispensing pump includes a body made of a first electrically conductive material, one or more first electrical contacts that are disposed on the body of the dispensing pump, and one or more first connection wires that are coupled between each one of the one or more first electrical contacts and ground. The dispensing system also includes a dispensing nozzle connected downstream from the dispensing pump and includes a tube made of a second electrically conductive material, one or more second electrical contacts that are disposed on an outer surface of the tube, and one or more second connection wires that are coupled between each one of the one or more second electrical contacts and the ground.

Provided is a system for stabilizing a flow of gas introduced into a sensor, wherein, in connection with manufacturing equipment comprising a process chamber, a process chamber vacuum pump installed to remove internal gas of the process chamber, and a sensor device configured to be able to receive the internal gas of the process chamber through a sensor connecting pipe and to detect components thereof, the system comprises a sensor connecting pipe and a bypass pipe branching off from the sensor connecting pipe such that a part of the gas can be directly discharged to the outside without being introduced into the sensor, and the system is accordingly configured to stably provide the sensor device with a part of the internal gas within a predetermined range per time, regardless of a change in the pressure state of the process chamber.

A discharge method includes discharging discharge products including a first discharge gas and solid by-products from a process chamber, in which a substrate processing process is performed in a vacuum state, into an inside of a collection device, collecting the solid by-products in the collection device, introducing a portion of a second discharge gas discharged from a load lock chamber into the collection device, and vaporizing the solid by-products in the collection device and discharging vaporized solid by-products to an outside of the collection device.

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing a treating space; and a fluid supply unit supplying a treating fluid to the chamber, and wherein the fluid supply unit includes: a supply tank storing the treating fluid; a supply line connecting the supply tank and the chamber; and a plurality of valves installed at the supply line, and wherein any one valve among the plurality of valves is provided as a safety valve, and wherein the safety valve is opened after confirming that the chamber has been switched to a closed state when supplying the treating fluid from a tank to the chamber.

A supercritical fluid processing apparatus including a supercritical fluid supply module including a gas liquefier to liquefy a gas transferred from a gas supply and provide a liquefied fluid, a storage tank to change the liquefied fluid to a supercritical state and store a supercritical fluid, and an internal pipe connecting the gas liquefier to the storage tank; an exhaust fluid supply module including an exhaust fluid liquefier including a regeneration storage tank to collect a first exhaust fluid from the storage tank, and a refrigerant pipe to liquefy the first exhaust fluid in the regeneration storage tank and maintain the liquefied first exhaust fluid at a predetermined temperature/pressure; a first exhaust pipe to transfer the first exhaust fluid from the storage tank to the exhaust fluid liquefier; and a resupply pipe to resupply the first exhaust fluid collected and liquefied in the exhaust fluid liquefier to the storage tank.

Ampoules for a semiconductor manufacturing precursors and methods of use are described. The ampoules include a container with an inlet port and an outlet port. The ampoules comprise an inlet plenum located between the inlet port and the cavity and an outlet plenum located between the outlet port and the cavity. A flow path is defined by a plurality of tubular walls and an ingress openings of the ampoule, through which a carrier gas flows in contact with the precursor.

A gas processing apparatus includes: a mounting part; a gas supply part located above the mounting part and having a plurality of first gas supply holes; a gas supply path forming part configured to form a supply path of a processing gas, the gas supply path forming part including a flat opposing surface which faces the gas supply part from above and defines a first diffusion space for diffusing the processing gas in a lateral direction; a recess surrounding a central portion of the opposing surface; and a plurality of gas dispersion portions located in the recess surrounding the central portion of the opposing surface without protruding from the opposing surface, each of the plurality of gas dispersion portions having a plurality of gas discharge holes extending along a circumferential direction so as to laterally disperse the processing gas supplied from the supply path in the first diffusion space.

There is provided a processing apparatus including: a processing part including a plurality of process modules connected to each other in a first room, and a loader module provided in the first room and accommodating a carrier which receives a substrate processed by each of the plurality of process modules; and a plurality of pump units corresponding to the plurality of process modules, respectively, and arranged in a second room adjacent to the first room, wherein an installation area of the plurality of pump units is equal to or smaller than that of the processing part.

A storage apparatus for storing an object includes a load port unit that a receptacle is loaded onto or unloaded from, in which the receptacle accommodates the object in a storage space formed by a body and a cover that covers the body, and a controller. The load port unit includes a housing having an interior space, a stage member that is provided on the housing and that opens the storage space by moving the body, the receptacle being seated on the stage member, and an exhaust tube that evacuates a spacing space between the body and the cover spaced apart from each other. One end of the exhaust tube faces toward the spacing space, and an opposite end of the exhaust tube faces toward the interior space.

A heat treatment apparatus includes: a processing container configured to accommodate and process a plurality of substrates in multiple tiers under a reduced-pressure environment; a first heater configured to heat the plurality of substrates accommodated in the processing container; a plurality of gas supply pipes configured to supply a gas to positions having different heights in the processing container; and a second heater provided on a gas supply pipe that supplies a gas to a lowermost position among the plurality of gas supply pipes, and configured to heat the gas in the gas supply pipe.