An adapter plate is provided. The adapter plate is used in a manufacturing process of a Micro-LED display to realize a mass transfer of LEDs. The adapter plate includes a substrate and a bonding adhesive layer laminated on the substrate and is used to bind and transfer the LEDs, where the bonding adhesive layer is made of organic silicone or acrylic acid. The bonding adhesive layer has a thickness H satisfying: 10 um≤H≤25 um, and has porosity P satisfying: 20%≤P≤40%, to make the bonding adhesive layer have a first adhesive force F1 in an environment at a first temperature T1 and have a second adhesive force F2 in an environment at a second temperature T2 higher than the first temperature T1. The first adhesive force F1 is greater than the second adhesive force F2.

The present disclosure provides a method for producing a boron nitride nanotube by heating a boron precursor, and an apparatus therefor. According to an embodiment, a method of producing a boron nitride nanotube includes: inserting several reaction modules each accommodating a holding rod disposed through at least one precursor block into a supply chamber disposed at a front end of a reaction chamber; conveying N reaction modules of the several reaction modules inserted in the supply chamber to a reaction zone of the reaction chamber; growing a boron nitride nanotube in the precursor block by operating the reaction zone for a predetermined time, in the reaction chamber; and conveying the N reaction modules from the reaction chamber to a discharge chamber disposed at a rear end of the reaction chamber after the predetermined time passes. Accordingly, it is possible to maximize the yield and productivity of BNNTs.

A resin molding apparatus and a cleaning method of a workpiece which can prevent a workpiece from being carried into a mold die in a state where particles (dust) are adhered to the workpiece, and can prevent deterioration of molding quality. A resin molding apparatus according to the present invention, in which a workpiece with an electronic component mounted on a carrier and a mold resin are carried into a mold die, includes: a press part having the mold die for clamping and resin-sealing the workpiece and the mold resin; and a cleaning apparatus for cleaning a back surface of the workpiece conveyed to the press part, wherein the electronic component is not mounted on the back surface. The cleaning apparatus is arranged at a position overlapping a conveyance path of the workpiece on the upstream side of the press part.

A method for executing a direct transfer of semiconductor device die from a first substrate to transfer locations on a second substrate. The method includes determining a position of impact wires disposed on a transfer head, semiconductor device die, and transfer locations; determining whether there are at least two positions that an impact wire, a semiconductor device die, and a transfer locations are aligned within a threshold tolerance; and transferring, by the impact wires, the semiconductor device die such that the semiconductor device die detaches from the first substrate and attaches to transfer locations on the second substrate. The transferring being completed based at least in part on determining that the impact wire, the semiconductor device die, and the circuit trace are aligned within the threshold tolerance.

The present invention relates to a temperature control system, a temperature control method and an image sensor-testing apparatus having the system. The temperature control method mainly comprises the steps of regulating the temperatures of a plurality of devices under test (DUTs) to a specific temperature in a temperature control zone; transferring the plurality of devices under test to a test plate and placing them into a plurality of test slots respectively; and measuring the temperatures of the device under test by the temperature-sensing elements in the test slots, wherein when at least one temperature-sensing element of the temperature-sensing elements detects that the device under test in the test slot corresponding to said at least one temperature-sensing element fails to meet the specific temperature, a temperature control element corresponding to the test slot regulates the temperature of the device under test.

The present invention relates to an electronic device testing apparatus and a testing method thereof. When the test is completed, a pressing head picks up a tested electronic device from a test socket and places the tested electronic device on an output carrier, the output carrier moves out of a test zone, and an input carrier follows immediately after the output carrier and successively moves into the test zone at the same speed; after the pressing head picks up an electronic device to be tested from the input carrier, the input carrier moves out of the test zone, and the pressing head places the electronic device to be tested in the test socket. Accordingly, in the present invention, the operation of the pressing head is simplified, and the overall test efficiency is improved.

The present invention relates to a quick release assembly for a pressing head and an electronic device testing apparatus having the same. The quick release assembly comprises an upper base, an actuator and a lower base. When the lower base is to be mounted on the upper base, the actuator drives a movable head to a first position; the movable head passes through an open slot of the lower base; then, the actuator drives the movable head to a second position so that the lower base is retained by the movable head. The open slot of the lower base is firstly fitted on the movable head of the actuator located on the upper base. At this time, the actuator is controlled to drive the movable head to the second position from the first position.

The present invention relates to an electronic device pick-and-place system and an electronic device testing apparatus having the same, comprising a plurality of pick-and-place heads, a plurality of negative pressure generators and an air pressure regulating valve. Each pick-and-place head has a pick-and-place port; the plurality of negative pressure generators are communicated with the plurality of pick-and-place ports of the plurality of pick-and-place heads respectively; an inlet end of the air pressure regulating valve is communicated with an air pressure source, and an outlet end of the air pressure regulating valve is communicated with the plurality of negative pressure generators; the air pressure regulating valve can be used to adjust the suction forces of the pick-and-place ports of the pick-and-place heads in a batch. Accordingly, the suction forces and blowing forces of the pick-and-place ports of the pick-and-place heads can be adjusted in a batch.

A high-electron mobility transistor includes a substrate; a channel layer on the substrate; a AlGaN layer on the channel layer; and a P—GaN gate on the AlGaN layer. The AlGaN layer comprises a first region and a second region. The first region has a composition that is different from that of the second region.

A LED display fabrication tool includes first and second dispensing chambers to deliver first and second color conversion precursors onto a workpiece for fabrication of a light emitting diode (LED) displays, first and second curing stations to cure the workpiece to form first and second color conversion layers over a first and second set of LEDs on the workpiece, and first and second washing/drying chambers to remove uncured portions of the first and second color conversion precursors from the workpiece and then dry the workpiece. Each of the chambers is independently sealable. A controller controls a workpiece transport system to move the workpiece sequentially between the chambers.