A LED display fabrication tool includes a plurality of chambers including an initial chamber, a final chamber, and a plurality of intermediate chambers, and the plurality of chambers are arranged to form a transfer line from the initial chamber to the final chamber with each intermediate chamber coupled by a first sealable port to a prior chamber in the transfer line and by a second sealable port to a subsequent chamber in the transfer line. The plurality of chambers include first and second dispensing chambers to deliver first and second color conversion precursors onto a workpiece for fabrication of a light emitting diode (LED) displays, and first and second washing/drying chambers to remove uncured portions of the first and second color conversion precursors. First and second curing stations cure the precursors.

An LED display fabrication tool includes a plurality of process chambers and a plurality of transfer chambers. The plurality of process chambers include first and second dispensing chambers to deliver first and second color conversion precursors onto a workpiece for fabrication of a light emitting diode (LED) displays, and first and second washing/drying chambers to remove uncured portions of the first and second color conversion precursors from the workpiece and then dries the workpiece. The plurality of transfer chambers are coupled to two process chambers by two respective sealable ports. First and second curing stations cure the precursors to form the first and second color conversion layers over a first set of LEDs on the workpiece.

A cleaning system and method use an ultrasound probe, a coupling mechanism, and a controller to clean equipment of a vehicle system. The ultrasound probe enters into an engine. The ultrasound probe emits ultrasound pulses and the coupling mechanism provides an ultrasound coupling medium between the ultrasound probe and one or more components of the engine. The controller drives the ultrasound probe to deliver the ultrasound pulse through the coupling medium to a surface of the one or more components of the engine. The ultrasound probe delivers the ultrasound pulse to remove deposits from the one or more components of the engine.

A high-electron mobility transistor includes a substrate; a channel layer on the substrate; a AlGaN layer on the channel layer; and a P—GaN gate on the AlGaN layer. The AlGaN layer comprises a first region and a second region. The first region has a composition that is different from that of the second region.

There is provided a technique that includes a substrate processing apparatus, comprising a process chamber having a cylindrical space configured to accommodate a substrate; and a plurality of nozzles communicating with a gas supply pipe and discharging processing gas in the process chamber, the process chamber includes a cylindrical reaction tube; a cylindrical manifold; and a lid, the lid includes a protection plate; and an introduction hole, the manifold includes a protection liner on an inner face of the manifold such that a second gap is formed between the manifold and the protection liner, the first gap being formed to allow the purge gas flowing toward the manifold to be deflected by the inner face of the manifold and to flow into the second gap.

A substrate processing system comprises: a plating device including a first conveying unit for conveying a first substrate and configured to convey the first substrate by the first conveying unit after a plating process is applied to a surface of the first substrate in a stationary state; and a pre-stage device including a second conveying unit for conveying a second substrate and configured to convey the second substrate as the first substrate to the plating device by the second conveying unit in response to unloading of the first substrate by the first conveying unit. In the system, a timing at which the second conveying unit conveys the second substrate to the plating device being controlled according to a plating process time.

A method of placing light emitting diodes (LEDs) includes embedding an array of LEDs in a polymer layer on a substrate. The method includes detaching at least one LED in the array of LEDs from the substrate by dry-etching the polymer layer in which at least one LED is embedded. A pick-up-tool (PUT) is brought into contact with at least one surface of at least one LED facing away from the substrate, responsive to dry-etching the polymer layer. The PUT is lifted with the at least one LED attached to the PUT.

A method for executing a direct transfer of semiconductor device die from a first substrate to transfer locations on a second substrate. The method includes determining a position of impact wires disposed on a transfer head, semiconductor device die, and transfer locations; determining whether there are at least two positions that an impact wire, a semiconductor device die, and a transfer locations are aligned within a threshold tolerance; and transferring, by the impact wires, the semiconductor device die such that the semiconductor device die detaches from the first substrate and attaches to transfer locations on the second substrate. The transferring being completed based at least in part on determining that the impact wire, the semiconductor device die, and the circuit trace are aligned within the threshold tolerance.

Devices and methods related to packaging of radio-frequency (RF) devices on ceramic substrates. In some embodiments, a packaged electronic device can include a ceramic substrate configured to receive one or more components. The ceramic substrate can include a conductive layer in electrical contact with a ground plane. The packaged electronic device can further include a die having an integrated circuit and mounted on a surface of the ceramic substrate. The packaged electronic device can further include a conformal conductive coating implemented over the die to provide shielding functionality. The packaged electronic device can further include an electrical connection between the conformal conductive coating and the conductive layer.

A board-level architecture is provided. The board-level architecture includes: a first circuit board, a system-in-a-package module, at least one conductive terminal, and at least one first component. The system-in-a-package module is fastened on an upper surface of the first circuit board. The conductive terminal is located between a lower surface of the system-in-a-package module and the upper surface of the first circuit board, and the conductive terminal is separately electrically connected to the system-in-a-package module and the first circuit board. The first component is fastened on the upper surface of the first circuit board, and the first component is located in a region between the lower surface of the system-in-a-package module and the upper surface of the first circuit board.