A substrate processing technology including: transferring a substrate to a process chamber and mounting the substrate on a substrate holder; heating the substrate with a heating device to perform predetermined substrate processing; determining the number of times of the predetermined substrate processing that has been performed that the predetermined substrate processing has been performed a preset number of times or more, determining whether it is necessary to adjust a mounting position at which the substrate is mounted on the substrate holder; and when it is determined that a mounting position adjustment is necessary, determining the mounting position by comparing the substrate temperature measured at the performing the predetermined substrate processing with a premeasured temperature of the substrate which corresponds to the mounting position and is stored in a memory.

An illustrative embodiment disclosed herein is an apparatus including a first loading tray configured to couple to a first wafer holding device holding a plurality of wafers. The first wafer holding device includes a first opening. The apparatus includes a second loading tray configured to couple to a second wafer holding device. The second wafer holding device includes a second opening. The apparatus includes a first motor coupled to the first loading tray and configured to rotate the first wafer holding device until the first opening faces the second opening to allow transfer of the plurality of wafers from the first wafer holding device to the second wafer holding device.

There is provided a substrate processing apparatus, including: a mounting part on which a carrier having a plurality of slots capable of accommodating a plurality of substrates is mounted; a transfer part configured to load and unload the substrates to and from the plurality of slots based on a reference accommodation position set in the mounting part; a detection part configured to detect a position of each of the plurality of substrates accommodated in the plurality of slots; and a correction part configured to correct the reference accommodation position based on port accumulation information in which detection results obtained by the detection part from a plurality of carriers which has been mounted on the mounting part in the past are accumulated.

A method of a handling semiconductor wafers in a space of a semiconductor wafer processing facility includes: loading a cassette containing at least one semiconductor wafer into a storage buffer of a load port; measuring, from within the storage buffer, a position of a selected at least one semiconductor wafer being retrieve from the cassette residing in the storage buffer; and determining, at least in part based on said measuring, a variation of the position of the selected semiconductor wafer from a nominal position.

A transport system includes a robot, sensors (an aligner sensor, a protrusion detecting sensor) and a controller. The robot having a hand which supports a wafer and transports the wafer to an aligner apparatus. The sensor detects the position of the wafer before the robot delivers the wafer to the aligner apparatus while supporting the wafer on the hand. The controller determines the positional deviation of the wafer based on a detection value of the sensor.

An information processing apparatus for controlling a conveying apparatus to convey a substrate to be processed by a substrate processing apparatus includes a processor that performs operations including controlling the conveying apparatus, according to teaching data, to perform a first movement operation including putting the substrate into a container configured to carry the substrate and a second movement operation including getting the substrate from the container, acquiring image data including an image of a placement position for the substrate in the container during the first movement operation and the second movement operation, performing image processing on the image data to quantify a relationship between a position of the container and a position of the substrate, determining the quantified relationship to yield a determination result, and outputting correction data for correcting the conveying apparatus with respect to the first movement operation and the second movement operation, based on the determination result.

A substrate conveying robot has a robot arm including an end effector having a substrate holding unit holding a substrate, arm drive unit for driving the robot arm, an elevating drive unit for elevatingly driving the end effector, a robot control unit controlling the arm drive unit, the elevating drive unit, and the substrate holding unit, and a substrate detection unit having a substrate detection unit which detects a vertical position of the substrate and elevates coordinately with an elevating operation of the end effector. By this configuration, a vertical position of a substrate to be conveyed is detected with high accuracy so that a robot operation can be controlled based on the detection result.

An information processing apparatus of a substrate processing apparatus including a transport device includes an image data acquisition unit that acquires image data of a disposing position of a processing target substrate, a first image processing unit that digitizes a positional relationship among the transport source object, the transport device, and the substrate, a second image processing unit that digitizes a positional relationship among the transport destination object, the transport device, and the substrate, a first transfer teaching unit that outputs first correction data of the moving operation of the transport device of receiving the substrate from the transport source object, and a second transfer teaching unit that outputs second correction data of the moving operation of the transport device of disposing the substrate in the transport destination object.

A system includes a factory interface, a load port connected to the factory interface, a container connected to the load port, and a controller connected to a robot arm of the factory interface. The controller determines that the container is configured to store replacement parts for a process chamber of the system and causes the robot arm to move according to a first mapping pattern to identify, using a detection system at a distal end of an end effector of the robot arm, positions in the container. Regions of the container that do not contain replacement parts are determined and the robot arm is moved according to a second mapping pattern to identify a position in the container of a wafer and/or an empty carrier for a replacement part. A mapping of positions of replacement parts and positions of the wafer and/or empty carrier is recorded in a storage medium.

The present disclosure provides an apparatus and a method for transferring a wafer, and an apparatus for controlling transferring a wafer. The apparatus for transferring a wafer includes a transfer chamber, at least one process chamber, a first detection unit, and a control unit, wherein the transfer chamber is provided therein with a transfer unit; the at least one process chamber is in connect with the transfer chamber, and a chamber door is provided at a connect position; the first detection unit includes a first transmit end and a first receive end, the first transmit end is provided on one of the transfer unit and the chamber door, and the first transmit end is provided on the other one of the transfer unit and the chamber door.