A system includes an equipment front end module chamber, alignment pedestals housed within the equipment front end module chamber, and a load/unload robot at least partially housed within the equipment front end module chamber. The alignment pedestals include a first alignment pedestal having a first support surface and a second alignment pedestal having a second support surface, and the first support surface has a vertical offset and an overlap region having at least a partial overlap relative to the second support surface. The load/unload robot includes an arm, and vertically arranged blades attached to the arm. The vertically arranged blades include an upper blade configured to transfer a first substrate to the first alignment pedestal and a lower blade configured to transfer a second substrate to the second alignment pedestal.

A vacuum substrate transport apparatus including a frame, a drive section having a drive axis, at least one arm, having an end effector for holding a substrate, having at least one degree of freedom axis effecting extension and retraction, and a bearing defining a guideway that defines the axis, the bearing including at least one rolling load bearing element disposed in a bearing case, interfacing between a bearing raceway and bearing rail to support arm loads, and effecting sliding of the case along the rail, and at least one rolling, substantially non-load bearing, spacer element disposed in the case, intervening between each of the load bearing elements, wherein the spacer element is a sacrificial buffer material compatible with sustained substantially unrestricted service commensurate with a predetermined service duty of the apparatus in a vacuum environment at temperatures over 260° C. for a specified predetermined service period.

A wafer access assembly, a wafer access device and a wafer carrier are provided. The wafer access device includes a base, a shaft, a plurality of couple plates, a plurality of arms, and a stretchable component. The base includes a groove. The shaft extends into the groove and is capable of sliding into the groove. The plurality of couple plates mounting on the shaft. Each of the plurality of couple plates includes a plate body and a through hole on the plate body for the shaft passing through. Each of the plurality of arms is extended from an end of each of the plurality of couple plates. The stretchable component includes a plurality of connecting side walls connecting adjacent couple plates together. The plurality of stretchable component are capable of changing a distance between adjacent couple plates.

A batch processing oven includes a processing chamber, a magnet, and a rack. The processing chamber includes a gas inlet on a first side and a gas outlet on a second side opposite the first side, the gas inlet is configured to direct a hot gas into the processing chamber and the gas outlet is configured to exhaust the convective energy in parallel with the radiative energy from the walls. The magnet is arranged such that its north pole will be formed on the first side of the processing chamber and its south pole will be formed on the second side of the processing chamber. The rack is configured to be positioned between the first and second ends of the processing chamber and is configured to support a plurality of vertically spaced-apart substrates.

The present disclosure is directed to a wafer container including: a housing configured for transporting a plurality of wafers, wherein the plurality of wafers are stacked on a base of the housing in a first direction; a plurality of wafer separator rings; each of the wafer separator rings configured to encircle a wafer of the plurality of wafers in a second direction that is substantially perpendicular to the first direction, each of the wafer separator rings including a top surface and a bottom surface, defining a thickness there between extending in the first direction, which is about 0.3 mm-1.4 mm; and each of the wafer separator rings including an inner side wall and an outer side wall defined by an inner diameter and an outer diameter, respectively, in the second direction, wherein the inner diameter of the wafer separator ring is greater than 300 mm and configured to be spaced apart from the wafer it is encircling.

The present disclosure relates to a substrate transfer device for sensing deflection of an end-effector and a substrate processing apparatus having the same. The substrate transfer device includes: an end-effector extending in a first direction and supporting a substrate; an end-effector hand connected with one side in the first direction of the end-effector; a horizontal movement unit connected with the end-effector hand and moving the end-effector in the first direction; and a deflection sensing unit including a light emitting part and a light receiving part, which are respectively disposed at both sides of a movement path of the end-effector, and sensing deflection of the end-effector.

A substrate aligning method includes receiving a substrate by moving a substrate support from an outside of an outer periphery toward a central portion of the substrate along the substrate; and aligning the substrate such that the substrate support moves from a position different from a position partially upwardly warped along an outer peripheral edge of the substrate and a position partially downwardly warped along the outer peripheral edge of the substrate toward the central portion of the substrate so as to receive the substrate.

There is provided a technique capable of efficiently transporting a plurality of objects between a storage container configured to store the plurality of objects and a processing apparatus configured to collectively process the plurality of objects. A transport system 1 for transporting a plurality of objects between a storage container 9 configured to store the plurality of objects and a processing apparatus 2 configured to collectively process the plurality of objects held on a tray 8, includes: a mounting part 31 on which the storage container 9 is mounted; a stage 41 on which the plurality of objects are mounted; a tray support part 51 configured to support the tray 8; a first transport device 44 configured to transport the plurality of objects between the storage container 9 mounted on the mounting part 31 and the stage 41; and a second transport device 53 configured to transport the plurality of objects between the stage 41 and the tray 8 supported by the tray support part 51.

A substrate processing system includes: a batch-type processing part that collectively processes a lot including substrates arranged at a first pitch; a single-substrate-type processing part that processes the substrates of the lot one by one; and an interface part that delivers the substrates between the batch-type processing part and the single-substrate-type processing part. The batch-type processing part includes a processing bath that stores a processing solution having a lump shape or a mist shape, a first holder that holds the substrates arranged at the first pitch, and a second holder that receives the substrates arranged at a second pitch from the first holder in the processing solution. The interface part includes a transfer part that transfers the substrates held separately by the first and second holders in the processing solution, from the batch-type processing part to the single-substrate-type processing part.

This mounting apparatus is provided with: a plurality of bonding stations each comprising a bonding apparatus for bonding a semiconductor chip onto a substrate wafer, and a chip supply apparatus for supplying the semiconductor chip to the bonding apparatus; and a single wafer transfer apparatus which transfers the substrate wafer in order to supply the substrate wafer to each of the plurality of bonding stations and to collect the substrate wafer from each of the plurality of bonding stations.