A cleaving system is described. The system can include a holding apparatus to retain a photovoltaic structure at a center section of a cleaving platform. The system can further include a contact apparatus to make contact with the photovoltaic structure and separate it into a plurality of strips. During operation, the system can activate an actuator to move the contact apparatus against the photovoltaic structure, thereby separating the photovoltaic structure into strips.

An apparatus is for plasma dicing a semiconductor substrate of the type forming part of a workpiece, the workpiece further including a carrier sheet on a frame member, where the carrier sheet carries the semiconductor substrate. The apparatus includes a chamber, a plasma production device configured to produce a plasma within the chamber suitable for dicing the semiconductor substrate, a workpiece support located in the chamber for supporting the workpiece through contact with the carrier sheet, and a frame cover element configured to, in use, contact the frame member thereby clamping the carrier sheet against an auxiliary element disposed in the chamber.

The present invention provides a substrate cleaning apparatus for a substrate related to a photomask, including a holder for holding only an end face of the substrate, a rotation mechanism for rotating the holder, and a nozzle for supplying liquid at least to the front surface of the substrate rotating with the holder by the rotation mechanism; wherein at least one of the holder has a conductive surface and is earthed. The present invention also provides a method for cleaning a substrate related to a photomask. These inventions can prevent adhesion of contaminants to the substrate when performing a cleaning treatment.

A wafer-holding apparatus for electroplating of a solar cell wafer is provided. The wafer has chamfered corners and comprises a plurality of busbar areas, wherein at least one busbar area is near an edge of the wafer. The wafer-holding apparatus includes a plurality of wafer-holding mechanisms for maintaining contact with a wafer. One of the plurality of wafer-holding mechanisms can be longer than at least one other wafer-holding mechanism, thereby facilitating secure contact with the busbar area near the edge of the wafer, which is shorter than other busbar areas on the wafer due to the chamfered corners.

Disclosed is an apparatus for handling electronic components and a method of adjusting the position of at least one handling device of an apparatus for handling electronic components. The apparatus comprises a rotary device; an imaging device located on the rotary device which is positionable by the rotary device; a plurality of pick heads arranged circumferentially around the rotary device, each pick head being operable to hold an electronic component; a fiducial mark located at a fixed position relative to the rotary device such that the rotary device is rotatable relative to the fiducial mark, the fixed position of the fiducial mark being indicative of an arrangement of an electronic component which is held by a respective pick head; and at least one handling device for handling the electronic components, the position of the at least one handling device being adjustable for aligning the at least one handling device with the arrangement of the electronic component held by the pick head; wherein the imaging device is operative to capture at least one image comprising the fiducial mark and the at least one handling device for deriving an offset between the at least one handling device and the arrangement of the electronic component as indicated by the fixed position of the fiducial mark.

A semiconductor package bonding tool includes a bonding plate and bonding blocks disposed on a bottom surface of the bonding plate. The bonding plate include first vacuum holes that vertically penetrate the bonding plate. The first vacuum holes connect a top surface of the bonding plate to the bottom surface of the bonding plate. Each of the bonding blocks includes a bonding stage disposed below a respective first vacuum hole of the first vacuum holes. The bonding stage includes a trench hole upwardly recessed from a bottom surface of the bonding stage, and a connection hole connecting a top surface of the bonding stage to the trench hole. A length in a horizontal direction of the trench hole is greater than that of the connection hole.

A chip ejector apparatus includes a holder located below a chip and defining a plurality of holes extending in a vertical direction, a pin support located below the holder, a support rod coupled to a lower surface of the pin support and configured to be driven in the vertical direction, a first vertical pin extending lengthwise in the vertical direction and disposed on the upper surface of the pin support, wherein the first vertical pin is inserted into a first hole of the plurality of holes, and wherein a lengthwise direction of the first vertical pin is parallel to the vertical direction, and a horizontal bar extending lengthwise in a first horizontal direction and coupled to an upper surface of the first vertical pin, wherein a lengthwise direction of the horizontal bar is parallel to the first horizontal direction.

An electronic package and a method for forming the same are provided. The method comprises: providing a substrate having a front surface and a back surface, wherein at least one electronic component is attached onto the front surface of the substrate, and the substrate comprises at least a non-polar material; forming a mold cap on the front surface of the substrate to encapsulate the at least one electronic component; loading the substrate onto a susceptor, wherein the susceptor comprises at least a polar material; and applying microwave radiation to the mold cap and the susceptor to cure the mold cap at least partially through the susceptor.