A carrier apparatus including a base including an outer peripheral surface and an inner support surface, a frame to connect to the outer peripheral surface of the base, and a circumferential flange including an outer circumferential portion and an inner circumferential portion. The outer circumferential portion to be clamped between the frame and the outer peripheral surface of the base, and the inner circumferential portion to extend inward from the frame. The inner circumferential portion including an opening to be spaced a distance from the inner support surface of the base. The carrier apparatus may include an article including a first major surface, a second major surface, a thickness between the first major surface and the second major surface, and an edge extending across the thickness between the first major surface and the second major surface. Methods of processing and assembling the carrier apparatus may also be provided.

A post-baking device and post-baking method for forming a black matrix are disclosed, and the post-baking device includes a housing defining an inner accommodation space therein, a plurality of heating elements provided within the housing, and at least one bracket provided in the inner accommodation space. The at least one bracket is configured to bear the substrate formed with the black matrix, and the bracket is rotatable with respect to the plurality of heating elements.

An apparatus is for plasma dicing a semiconductor substrate of the type forming part of a workpiece, the workpiece further including a carrier sheet on a frame member, where the carrier sheet carries the semiconductor substrate. The apparatus includes a chamber, a plasma production device configured to produce a plasma within the chamber suitable for dicing the semiconductor substrate, a workpiece support located in the chamber for supporting the workpiece through contact with the carrier sheet, and a frame cover element configured to, in use, contact the frame member thereby clamping the carrier sheet against an auxiliary element disposed in the chamber.

A carrier system and method carries a plate-like object to an object mounting member provided with an object mounting section. The system includes an adjustment device that changes a shape of the plate-like object into a predetermined shape before the plate-like object is mounted onto the object mounting section. The plate-like object whose shape is changed into the predetermined shape is mounted onto the object mounting section.

A spin dry etching process includes loading an object into a dry etching system. A dry etching process is performed to the object, and the object is spun while the dry etching process is being performed. The spin dry etching process is performed using a semiconductor fabrication system. The semiconductor fabrication system includes a dry etching chamber in which a dry etching process is performed. A holder apparatus has a horizontally-facing slot that is configured for horizontal insertion of an etchable object therein. The etchable object includes either a photomask or a wafer. A controller is communicatively coupled to the holder apparatus and configured to spin the holder apparatus in a clockwise or counterclockwise direction while the dry etching process is being performed. An insertion of the etchable object into the horizontally-facing slot of the holder apparatus restricts a movement of the object as the dry etching process is performed.

According to one embodiment, a chip transfer member includes a light-transmitting portion and a metal portion. The light-transmitting portion has a light incident surface, a light-emitting surface, and a side surface. The metal portion is provided at the side surface of the light-transmitting portion.

Semiconductor device packages may include a support structure having electrical connections therein. Semiconductor device modules may be located on a surface of the support structure. A molding material may at least partially surround each semiconductor module on the surface of the support structure. A thermal management device may be operatively connected to the semiconductor device modules on a side of the semiconductor device modules opposite the support structure. At least some of the semiconductor device modules may include a stack of semiconductor dice, at least two semiconductor dice in the stack being secured to one another by diffusion of electrically conductive material of electrically conductive elements into one another.

Apparatus for extending substrate queue time for hybrid bonding by preserving plasma activation. In some embodiments, the apparatus may include an environmentally controllable space with a support for holding a die or a substrate, a gas velocity accelerator that recirculates one or more gases laterally across the support, a filter, a humidifier apparatus that is fluidly connected to the environmentally controllable space, wherein the humidifier apparatus enables controllable humidity levels within the environmentally controllable space, a pressurizing apparatus fluidly connected to the humidifier apparatus on an output and fluidly connected to at least one gas supply on an input, a relative humidity (RH) sensor positioned within the environmentally controllable space, and an environment controller in communication with at least the humidifier apparatus and the RH sensor, wherein the environment controller is configured to maintain an RH level of approximately 80% to approximately 95%.

A transfer device including a first electrode set, a second electrode set, a shielding element, a driving circuit and an elastomer is provided. The first electrode set includes a first electrode configured to receive a first voltage and a second electrode configured to receive a second voltage and structurally separated from the first electrode, wherein a voltage difference exists between the first voltage and the second voltage. The second electrode set disposed adjacent to the first electrode set includes a third electrode configured to receive a third voltage and a fourth electrode configured to receive a fourth voltage and structurally separated from the third electrode, wherein a voltage difference exists between the third voltage and the fourth voltage. The shielding element is disposed on a substrate and located between the first electrode set and the second electrode set. The driving circuit is electrically connected to the first electrode set and the second electrode set. The elastomer covers the first electrode set and the second electrode set, wherein the elastomer has a transfer surface.

A substrate supporting and transferring apparatus and associated methods, the apparatus including a shuttle configured to move in a x-direction and a y-direction, the y-direction being perpendicular to the x-direction; a lower wedge block on the shuttle, the lower wedge block including a lower surface that is parallel with an upper surface of the shuttle and an upper surface that is inclined with respect to the lower surface of the lower wedge block; an upper wedge block on the lower wedge block, the upper wedge block including a lower surface that is parallel with the upper surface of the lower wedge block and an upper surface that is parallel with the upper surface of the shuttle; and a chuck on the upper wedge block, the chuck being configured to support a substrate.