A film formation apparatus includes a carrying unit circulating and carrying an electronic component in a chamber, a film formation processing unit forming a film on the electronic component, a tray carried by the carrying unit, and including a mount surface, and a mount member which is mounted on the mount surface, and on which the electronic component is placed. The mount member includes a holding sheet having an adhesive surface, and a non-adhesive surface, and a sticking sheet having a first sticking surface with adhesiveness sticking to the non-adhesive surface, and a second sticking surface with adhesiveness sticking to the mount surface of the tray. The adhesive surface includes a pasting region for pasting the electronic components. The first sticking surface sticks across an entire region of the non-adhesive surface corresponding to at least the pasting region.

A mass transfer device with pneumatic needles is disclosed, which is mainly composed of three parts: a pneumatic needle visual system, a crystal film transfer system, and a substrate transfer system; the pneumatic needle visual system comprises a marble platform, a support beam, camera mounting plates, cameras, guide rails of a needle slide component, stators of the needle slide motor, the needle slide component, a pressure regulating valve, a high-frequency piezoelectric ceramic valve, a needle connection plate and an air nozzle thimble; the crystal film transfer system comprises brackets, stators of the linear motors, limit plates, a crystal film transfer frame, a crystal film stage and a crystal film; the substrate transfer system comprises guide rails, a stator of a substrate transfer frame motor, a substrate transfer frame, a fixed plate, and a target substrate.

A package substrate cutting jig table for use in cutting a package substrate is provided. The jig table includes a jig base and a holding member adapted to be detachably mounted on the jig base. The holding member includes a holding surface for holding the package substrate, a plurality of escape grooves formed on the holding surface for preventing the interference of a cutting blade with the holding member, the escape grooves corresponding to a plurality of division lines formed on the package substrate, and a plurality of suction holes formed in a plurality of separate regions defined by the escape grooves on the holding surface. The holding member is formed of a material having a dynamic viscoelastic modulus ranging from 0.16 to 0.41.

A singulation assembly for molded leadframe sheets includes a saw chuck table having a flat upper surface with a plurality of holes therein. A vacuum source is in fluid communication with the plurality of holes. A mechanical clamping assembly operatively associated with the saw chuck table is adapted to be selectively engageable with predetermined portions of a warped molded leadframe sheet supported on the flat upper surface of the saw chuck table.

A collet for pickup a semiconductor chip may include a base and a holder. The base may have a first surface oriented toward the semiconductor chip and a second surface opposite to the first surface. The holder may be arranged at a central portion of the first surface of the base to fix the semiconductor chip using vacuum. An edge portion of the first surface of the base may be exposed. Thus, any structure may not exist in the edge portion of the base corresponding to a peripheral region of the collet so that a peripheral semiconductor chip vertically erected in picking the semiconductor chip from a film may not interfere with the holder. As a result, the vertically erected semiconductor chip may not be stuck in the holder to prevent damages of other semiconductor chip by the vertically erected semiconductor chip.

A method for producing a display device includes locating a substrate, including a plurality of pixels, on a jig including a magnet; locating a plate formed of a magnetic material on the substrate to secure the substrate; and folding back an end portion of the substrate in a state where the substrate is held between the jig and the plate.

A carrier system is provided with a wafer stage which holds a mounted wafer and is also movable along an XY plane, a chuck unit which holds the wafer from above in a non-contact manner above a predetermined position and is vertically movable, and a plurality of vertical movement pins, which can support from below the wafer held by the chuck unit on the wafer stage when the wafer stage is positioned at the predetermined position above and can also move vertically. Then, flatness of the wafer is measured by a Z position detection system, and based on the measurement results, the chuck unit and the vertical movement pins that hold (support) the wafer are independently driven.

A cleaving system and method are described. The system can include a holding apparatus to retain a photovoltaic structure at a center section of a cleaving platform. The system can further include a contact apparatus to make contact with the photovoltaic structure and separate it into a plurality of strips. During operation, the system can activate an actuator to move the contact apparatus against the photovoltaic structure, thereby separating the photovoltaic structure into strips.

A clamping apparatus and method for maintaining a workpiece flatness during processing includes a base having a planar surface for receiving a first workpiece. Two sets of opposing clamping mechanisms are mounted to the base and include a clamp head at a distal end of a rod extending from a housing in removable overlapping relation to the first workpiece. Each set of the clamp heads are in opposing spaced relationship to each other defining a second workpiece area, and the clamp heads are configured to mate with a top surface of the first workpiece. A biasing member is coupled to each of the housings and apply a downward vertical force to the housings, rods, and the clamp heads for applying a downward vertical pressure to the first workpiece. The first workpiece is thereby discouraged from thermally expanding in a vertical direction and is thermally expandable horizontally along the planar surface.

A clamping apparatus and method for maintaining a workpiece flatness during processing includes a base having a planar surface for receiving a first workpiece. Two sets of opposing clamping mechanisms are mounted to the base and include a clamp head at a distal end of a rod extending from a housing in removable overlapping relation to the first workpiece. Each set of the clamp heads are in opposing spaced relationship to each other defining a second workpiece area, and the clamp heads are configured to mate with a top surface of the first workpiece. A biasing member is coupled to each of the housings and apply a downward vertical force to the housings, rods, and the clamp heads for applying a downward vertical pressure to the first workpiece. The first workpiece is thereby discouraged from thermally expanding in a vertical direction and is thermally expandable horizontally along the planar surface.