The present disclosure provides a power module, a power module assembly and an assembling method thereof. The power module assembly includes a housing, a resilient bracket, a circuit board, a power device and a fastening unit. The housing includes a first heat-dissipation surface. The resilient bracket is pre-fastened on the housing. The resilient bracket is located near the first heat-dissipation surface and configured with the first heat-dissipation surface to form an accommodating space. The circuit board is configured to assemble on the housing. The power device is plugged in the circuit board and accommodated in the accommodating space. The fastening unit is pre-fastened on the housing and pressing the resilient bracket. While the resilient bracket pushes against the power device, the power device is attached to the first heat-dissipation surface.

A stacked heat exchanger includes: passage tubes stacked with each other to support a heat exchange object, a passage being defined in the passage tube for a heat medium to exchange heat with the heat exchange object; and a pipe connected to one of the passage tubes located at one end in a stacking direction of the plurality of passage tubes. Each of the passage tubes has a protruding pipe portion protruding in the stacking direction and communicating with the adjacent passage tube in the stacking direction. The one of the passage tubes located at the one end in the stacking direction is an in/out passage tube. The pipe has a surface at one end in a longitudinal direction of the pipe, and the surface intersects the longitudinal direction of the pipe and is joined to the in/out passage tube.

A cable socket connector assembly for an electronic system includes a socket assembly having a socket substrate including socket substrate conductors. The socket assembly has socket contacts extending between terminating ends and mating ends with the terminating ends terminated to corresponding socket substrate conductors and the mating ends configured to be terminated to corresponding package contacts of an electronic package of the electronic system. The cable socket connector assembly includes a cable assembly terminated to the socket assembly having an array of cables each having a cable conductor terminated to a corresponding socket substrate conductor. The socket contacts and the corresponding socket substrate conductors define electrical paths between the cable conductors of the cables and the package conductors of the electronic package.

Electronic equipment includes a plurality of heat generating elements, a single heat sink, and a single cover. The heat generating elements are arranged adjacent to one another in a one-dimensional array in a predetermined alignment direction. The faces of the heat generating elements on one side are fixed directly or indirectly to the heat sink. The faces of the heat generating elements on the other side are in direct or indirect contact with the cover. The cover is fixedly screwed to the heat sink at opposite ends in the alignment direction on the outer side of the heat generating elements. The heat generating elements are sandwiched and held between the heat sink and the cover. This allows heat generated by the heat generating elements to be efficiently radiated via the heat sink and allows the heat generating elements to be easily connected to the heat sink.

A socket connector includes a socket assembly having a socket frame, a socket substrate coupled to the socket frame and socket contacts terminated to the socket substrate. The socket substrate has first and second upper mating areas including first and second socket substrate conductors for mating with an electronic package and an electrical component, respectively. The socket contacts define an interface with the electronic package. The socket assembly is configured to electrically connect the electronic package with both a host circuit board and the electrical component.

In one general aspect, an apparatus can include a substrate, a semiconductor die coupled with a first surface of the substrate, and a metal layer disposed on a second surface of the substrate. The second surface can be opposite the first surface. The apparatus can also include a plurality of metal fins coupled with the metal layer, and a metal ring coupled with the metal layer. The metal ring can surround the plurality of metal fins.

In one general aspect, an apparatus can include a module including a semiconductor die. The apparatus can include a heatsink coupled to the module and including a substrate, and a plurality of protrusions. The apparatus includes a cover defining a channel where the channel is outside of the module and the plurality of protrusions of the heatsink are disposed within the channel, and a sealing mechanism is disposed between the cover and the module is in contact with the module.

An electronic module includes a semiconductor package, and a clip connected to the semiconductor package. The clip is connected to or includes at least one fastening element which is configured to make a connection to an external heat sink.

The present disclosure concerns a mounting device for semiconductor packages, and a heat dissipation assembly with such a mounting device. The mounting device includes a bottom side comprising one or more cavities to house semiconductor packages, and a top side comprising a plurality of holes extending from the bottom side to the top side for accommodating contact pins of the semiconductor packages. A fixation mechanism fixes the mounting device to a heat dissipation structure.

An object of the present invention is to provide a semiconductor device in which the effect of dimensional tolerance can be reduced, and a method for manufacturing the same. The semiconductor device according to the present invention includes: a plurality of cooling plates each having a coolant passage inside; spacers disposed to stack the cooling plates with spaces; at least one semiconductor package disposed on at least one principal surface of at least one of the cooling plates; and a spring plate disposed between adjacent ones of the cooling plates, the spring plate biasing the at least one semiconductor package toward the cooling plates.