A semiconductor device includes: a wiring board including an insulating board and a wiring layer, the insulating board having an element mounting surface, which is a first main surface, and a back surface, which is a second main surface on the opposite side of the element mounting surface, the wiring layer being formed on the back surface and including a wiring portion and a heat dissipation portion; a power element that is a semiconductor element, is mounted on the element mounting surface of the wiring board, and is connected to the wiring portion; a spacer that is interposed between the power element and the element mounting surface of the wiring board and is connected to the back-surface-side heat dissipation portion; and a heatsink that sandwiches, together with the spacer, the power element and is secured to the spacer.

A heat transfer cooling module is described. One embodiment of the module has a plate attached to a bracket. A tower is affixed the plate. One end of the tower can be in contact with the heat source. The opposite end of the tower has a radiator attached which dissipates the heat that travels from the first end of the tower to the opposite end of the tower. Both the tower and the radiator are made from efficient materials for the transfer of heat. Another embodiment of the heat transfer cooling module is shown where the device is in two pieces, the first a fin module affixed to a bracket. The heat source is in contact with a base of the fin module where the heat travels through the base, to the fins where it dissipates to ambient.

A heat radiation structure includes a heat spreader provided on a heating component mounted on a substrate, a heat sink disposed at a position facing the heat spreader, a heat transfer member disposed between the heat spreader and the heat sink, and transmitting heat from the heat spreader to the heat sink, and a conductive member electrically connecting the heat spreader and the heat sink.

Embodiments described herein may include apparatus, system and/or processes to provide an adjustable thermal coupling between cold plate coupled to a first heat source and a liquid-cooled cold plate cooling a second heat source. In embodiments, the adjustable thermal coupling may provide a degree of freedom along an access in accommodating a dimension requirement of the second heat source. Other embodiments may be described and/or claimed.

A circuit board assembly is applied to the field of electronic communications technologies to resolve a prior-art heat dissipation problem of a circuit board. The circuit board assembly combines, on a second circuit board, low-speed signals transmitted between a plurality of I/O modules and an IC chip, and then transmits the combined low-speed signals to the IC chip by using a low-speed cable. A low-speed signal sent by the IC chip to the plurality of I/O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I/O modules. This may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.

The DMD assembly in present disclosure includes a base mounted on a first side of a driver board; a chip substrate; a DMD chip mounted on the chip substrate; and a fixing frame fixed with driver board on the first side; a second side of the base includes a mounting groove configured to mount the chip substrate; the fixing frame includes an insertion hole, and the base is received in the insertion hole; an elastic protrusion is positioned beside the inserting hole, and the elastic protrusion comprises a fixing portion and a pressing portion, the fixing portion is connected to the fixing frame on a side of the fixing frame facing away from the driver board, the pressing portion is positioned on the fixing portion; a surface of the pressing portion facing the chip substrate contacts the chip substrate to clamp the chip substrate against the base.

Devices, systems, and methods for dissipating heat generated from an electrical current carrying device are provided herein. The disclosed concept provides a dielectric heat path device that assists in heat dissipation of an electrical current carrying device by transferring heat from one end of the device to another. The disclosed concept also provides systems that communicate heat generated by an electrical device to a thermally grounded secondary device through a dielectric heat path device to dissipate heat.

A heat sink includes a heat sink base/riser, a first fin, and a second fin. The spacing between the base/riser and the first fin and the second fin, restively, may be adjusted by rotating a threaded rod. The threaded rod includes a first threaded knurl that is engaged with the first fin and a second threaded knurl that is engaged with the second fin. The thread pitch of the first threaded knurl and the second threaded knurl may differ. For example, the pitch of the first threaded knurl may be smaller than the pitch of the second threaded knurl if the first fin is located nearest the heat sink base/riser relative to the second fin. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.

The present disclosure relates to the field of optical and projecting technology, and particularly to a DMD assembly, DLP optical engine and DLP projection device. The DMD assembly includes a base, a driver board, a chip substrate with a DMD chip and a fixing frame, where a first side of the base is provided with a mounting groove for mounting the chip substrate, a second side of the base is attached to the driver board, and the first side is opposite to the second side; a conductive spring leaf on the base extends through a bottom of the mounting groove and is beyond the second side, so that the chip substrate is electrically connected to the driver board through the conductive spring leaf; the driver board is provided with a first through hole, and the fixing frame is provided with a second through hole; position of the first hole corresponds to position of the second hole, and the driver board and the fixing frame are fixed by a fastener extending through the first through hole and the second through hole; and the fixing frame is provided with an inserting hole, into which the base is inserted.

A heat exchanger for cooling a plurality of heat-generating components with flat surfaces arranged in spaced parallel relation to one another has at least three flat, fluid-carrying panels, including a first end panel, a second end panel, and at least one middle panel. The middle panels have both of their opposed surfaces in thermal contact with a surface of a heat generating component. The end panels each have one surface in thermal contact with a surface of a heat-generating component. Inlet and outlet manifolds of the heat exchanger are in communication with the inlet and outlet openings of the middle panels. The inlet manifold communicates with the inlet opening of the first end panel, the outlet manifold communicates with the outlet opening of the second end panel, and the outlet opening of the first end panel communicates with the inlet opening of the second end panel.