This heat dissipation structure includes: a circuit board; an integrated circuit mounted thereon; a first thermal pad disposed on the surface of the integrated circuit; a heat sink having a first surface that applies pressure to the first thermal pad by sandwiching the first thermal pad together with the surface of the integrated circuit and a second surface facing the first surface; a second thermal pad disposed on the second surface; a heat dissipation casing having a surface that applies pressure to the second thermal pad by sandwiching the second thermal pad together with the second surface; and stud components for pulling up the heat sink from the heat dissipation casing side together with the circuit board such that the second thermal pad is sandwiched and pressurized between the heat dissipation casing and the heat sink.

Embodiments of the present disclosure relate to a fixing device for a double-sided heat sink and an associated heat dissipating system. There is exemplarily provided a fixing device for mounting the double-sided heat sink on a carrier. The fixing device comprises: a first holder including a first cylindrically-shaped rod, wherein the first cylindrically-shaped rod can pass through a first cooling portion of the double-sided heat sink and a mounting hole of the carrier to fix the first cooling portion to a first side of the carrier, and the first cylindrically-shaped rod comprises a through-hole extending along a longitudinal direction; and a second holder including a second cylindrically-shaped rod, wherein the second cylindrically-shaped rod can pass through a mounting hole of a second cooling portion of the double-sided heat sink and the through-hole of the first holder, such that the second holder is coupled with the first holder to fix the second cooling portion to a second side of the carrier opposite to the first side.

One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board. A first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip. Different heat conduction surfaces correspond to different chips.

An electric working machine includes: a motor; a semiconductor element that is provided in a current path to the motor and completes or interrupts the current path; a circuit board on which the semiconductor element is mounted, a control circuit that turns on and off the semiconductor element to control energization to the motor being assembled to the circuit board; and a heat sink for dissipating heat from the semiconductor element. The semiconductor element is attached to the heat sink via a metal-based board.

Systems, apparatuses, and methods are described for clamping a heat generating device such as a thyristor in place. The use of spring washers in various configurations is described. A spring washing washer may be used to apply force to a pad which in turn applies the force to a plate above a heat generating device. The plate above the heat generating device may apply downward pressure, which may force the heat generating device against a lower surface. Related systems, apparatuses, and methods are also described.

A heatsink for distributing heatsink load across a processor module with separable input/output (I/O) connectors, comprising: a thermal conductor; and one or more pistons aligned with one or more separable interconnects of the processor module.

The disclosure describes a lidded flip chip package, including a lid with a tray structure, wherein a tray is formed at an upper side of the lid, a heat spreader is mounted in the tray through a sealing ring so as to form a sealed gap between the tray and the heat spreader, another sealing ring is mounted at a lower side of the top piece of the lid so as to form another sealed gap between a flip chip and the lid, through-holes are formed through the tray so as to connect the first sealed gap with the second sealed gap, and a thermal interface material having fluidity is completely filled in the first sealed gap and at least partially filled in the second sealed gap. A lidded flip chip package including a lid with a two-step tray is one preferred embodiment of the present disclosure.

A microprocessor mounting apparatus comprising a microprocessor socket on a printed circuit board (PCB) and a bolster plate surrounding a perimeter of the microprocessor socket. The bolster plate has a first surface adjacent to the PCB, and a second surface opposite the first surface. A heat dissipation device is on the second surface of the bolster plate. The heat dissipation interface is thermally coupled to the microprocessor socket.

A jig for manufacturing a semiconductor package includes a bottom piece and an upper piece. The bottom piece includes a base, a support plate, and at least one elastic connector. The support plate is located in a central region of the base. The at least one elastic connector is interposed between the support plate and the base. The upper piece includes a cap and outer flanges. The cap overlays the support plate when the upper piece is disposed on the bottom piece. The outer flanges are disposed at edges of the cap, connected with the cap. The outer flanges contact the base of the bottom piece when the upper piece is disposed on the bottom piece. The cap includes an opening which is a through hole. When the upper piece is disposed on the bottom piece, a vertical projection of the opening falls entirely on the support plate.

A processing unit disposed within a compute unit, where the compute unit includes a printed circuit board (PCB) that includes an integrated circuit; a first thermal management device, that includes a first vapor chamber thermally conductively coupled to a first side of the integrated circuit; and a first heatsink thermally conductively coupled to the first vapor chamber; and a second thermal management device, that includes a second vapor chamber; and a second heatsink thermally conductively coupled to the second vapor chamber, where the second thermal management device is thermally conductively coupled to the first thermal management device; where the PCB is interposed between the first thermal management device and the second thermal management device.