Particular embodiments described herein provide for an electronic device that can be configured to enable a segmented heatsink. The electronic device can include a printed circuit board, a substrate, where the substrate is over the printed circuit board, at least two heat sources over the substrate, and a segmented heatsink secured to the printed circuit board, where the segmented heatsink has at least two independent heatsink segments, where each heatsink segment corresponds to at least one heat source and is configured to draw heat from the corresponding heat source. In an example, the heat sources are at a different height.

A retainer for detachably coupling a heat absorbing/dissipating device to a heat source is disclosed. The retainer can include one or more cooling fins to enable the retainer to dissipate heat along with the heat dissipating device. The cooling fins on the retainer can be wedge-shaped or airfoil-shaped, among other things, to increase, direct, and smooth airflow over the retainer, the heat source, and the heat dissipating device. The heat dissipating device can include a heat sink with multiple cooling fins. The cooling fins on the retainer can have substantially the same geometric pattern as the cooling fins on the heat sink.

A heatsink for distributing heatsink load across a processor module with separable input/output (I/O) connectors, comprising: a thermal conductor; and one or more pistons aligned with one or more separable interconnects of the processor module.

Various heatsink arrangements, and methods for implementing and using such are discussed.

A module. In some embodiments, the module includes a substrate; a plurality of electronic components, secured to an upper surface of the substrate; a thermally conductive heat spreader, on the electronic components and in thermal contact with an electronic component of the plurality of electronic components; a standoff, between the substrate and the heat spreader; an alignment element, extending into the substrate; a hard stop, under the substrate; and a plurality of compressible interconnects, under the substrate, and extending through the hard stop. The electronic components may be within a sight area of the substrate. The module may be configured to transmit a compressive load from an upper surface of the standoff to a lower surface of the substrate through a load path not including any of the electronic components.

A molded ceramic layer of a multilayer cooling assembly back plate is described. The molded ceramic layer has an opening on a side of the molded ceramic layer that is to face a back side of a circuit board. The opening is aligned with a location of a back side component on the back side of the circuit board.

An apparatus is described. The apparatus includes a back plate. The apparatus includes a bolster plate that is secured to the back plate with a back bolt. The bolster plate has a window. The apparatus includes a circuit board between the back plate and the bolster plate. A semiconductor chip package is electro-mechanically coupled to the circuit board within the window. The apparatus includes a load stud that emanates from a face of the bolster plate. The back bolt emanates from an opposite face of the bolster plate. The load stud and back bolt are oriented along a same axis that is orthogonal to the face and the opposite face. The apparatus includes a heat sink. The apparatus includes a loading plate. The heat sink is mounted to the loading plate. The loading plate has a fixturing element that is secured to the load stud to secure the loading plate to the bolster plate.

The load force bolster assembly includes a metallic stiffener. A carrier associated with a CPU (Central Processing Unit) is located upon the load force bolster assembly and positioned upon the electrical connector. A heat sink is located upon both the carrier and the load force bolster assembly wherein a torsioned wire of the bolster assembly provides a downward force upon an up-and-down movable stud which is secured to a screw of the heat sink so as to downwardly push the heat sink, thus enhancing the normal forces among the heat sink, the CPU and the contacts of the electrical connector. To efficiently hold the torsioned wire in position around a bottom corner of the stiffener, a retention groove is formed around the top portion of the restricting pole, and a pressing ring is downwardly snapped into the retention groove so as to restrain the torsioned wire in position.

It is an object to provide a technique allowing for suppression of the height of a protrusion from the surface of a semiconductor module. A semiconductor device includes: a semiconductor module having a first groove; a Belleville washer having a recess in an outer surface and a protrusion on an inner surface; and a screw passing through the hole of the Belleville washer and the first groove of the semiconductor module to fasten the semiconductor module and an attached body. A head of the screw is accommodated in the recess of the Belleville washer, and at least portion of the protrusion of the Belleville washer is accommodated in the first groove of the semiconductor module.

A semiconductor device according to the present invention includes a cooler, a semiconductor package provided on an upper surface of the cooler, a metal plate having a main section provided on an upper surface of the semiconductor package, a spring that is provided above the main section and presses the main section toward the upper surface of the semiconductor package with an elastic force and a fixture that fixes the spring to an upper surface of the main section with the spring exerting the elastic force, wherein a surface, which faces the upper surface of the semiconductor package, of the main section is flat.