In examples, a semiconductor device comprises a semiconductor die, an opaque mold compound housing covering the semiconductor die, a conductive terminal extending from the mold compound housing, and an insulative coat covering the mold compound housing and at least a portion of the conductive terminal.

A package for power electronics includes a power substrate, a number of power semiconductor die, and a Kelvin connection contact. Each one of the power semiconductor die are on the power substrate and include a first power switching pad, a second power switching pad, a control pad, a semiconductor structure, and a Kelvin connection pad. The semiconductor structure is between the first power switching pad, the second power switching pad, and the control pad, and is configured such that a resistance of a power switching path between the first power switching pad and the second power switching pad is based on a control signal provided at the control pad. The Kelvin connection pad is coupled to the power switching path. The Kelvin connection contact is coupled to the Kelvin connection pad of each one of the power semiconductor die via a Kelvin conductive trace on the power substrate.

In a described example, an apparatus includes: a package substrate having a die pad configured for mounting a semiconductor die, a first lead connected to the die pad, and a second lead spaced from and electrically isolated from the die pad; a spacer dielectric mounted on the die pad; a semiconductor die including a temperature sensor mounted on the spacer dielectric; electrical connections coupling the semiconductor die to the second lead; and mold compound covering the semiconductor die, the die pad, the electrical connections, and a portion of the package substrate, with portions of the first lead and portions of the second lead exposed from the mold compound to form terminals for a packaged temperature sensor device.

Reliability of a semiconductor device is improved. The semiconductor device includes a clip which is electrically connected to a main-transistor source pad via a first silver paste and is connected to a lead via a second silver paste. The clip has a “first part” with which the first silver paste is in contact, a “second part” with which the second silver paste is in contact, and a “third part” positioned between the “first part” and the “second part”. A protruding member is formed on a surface of the main-transistor source pad, and the “first part” is in contact with the protruding member.

In one instance, a semiconductor package includes a lead frame and a semiconductor die mounted to the lead frame via a plurality of bumps that are shaped or tapered. Each of the plurality of bumps includes a first end connected to the semiconductor die and an opposing, second end connected to the lead frame. The first end has an end surface area A1. The second end has an end surface area A2. The end surface area A1 of the first end is less than the end surface area A2 of the second end. Other aspects are disclosed.

A semiconductor device includes a switching element, a control element that controls the switching element, an island lead on which the switching element and the control element are mounted, and a plurality of terminal leads. The switching element includes a first electrode, a second electrode and a third electrode, where the first electrode and the second electrode are offset from the third electrode in a first sense of a thickness direction. The island lead has an obverse surface facing in the first sense of the thickness direction and supporting the switching element and the control element. Each terminal lead is electrically connected to the second electrode or the control element. The island lead is spaced apart from the plurality of terminal leads.

A semiconductor module includes: a plurality of semiconductor switching elements; a resin mold having a side surface and surrounding the plurality of the semiconductor switching elements; a terminal member having a plurality of inner terminals electrically connected to the plurality of the semiconductor switching elements inside the resin mold and a plurality of outer terminals protruding from the side surface of the resin mold; and a support member disposed at a position apart from the side surface of the resin mold, the support member extending in a direction in which the plurality of the outer terminals are arrayed, the support member covering a part of an outer-periphery of each of the plurality of the outer terminals, the support member fixing the plurality of the outer terminals such that the plurality of the outer terminals are spaced from each other.

A semiconductor device includes a semiconductor element, which has a protective film having an opening that exposes a part of a source electrode and disposed/provided to position an end portion thereof on the source electrode. A rewiring layer has wiring that is connected to the source electrode and to a conductive connecting member, and an insulator that covers a part of the source wiring. The insulator includes: an insulating film having (a) an opening for exposing a part of the source wiring, and (b) an end portion of the opening provided in a facing region of the opening; and an insulating film having (c) (i) an opening for exposing a part of the source wiring having a solder arranged therein and (ii) a connecting member arranged therein.

A semiconductor package includes a die pad and leads extending from the die pad. Each lead has a free end with outer surfaces extending at angles from one another. An electrically conductive plating material covers at least portions of the outer surfaces. A die attached to the die pad is electrically connected to the leads. An insulating layer extends over the leads and the die such that the free ends of the leads are exposed.

A charging base lead frame includes a frame body having a receiving slot and a plurality of leads fixed to the frame body. The leads include a first lead for electrical connection to a terminal of a charging base. The first lead includes a lead body fixed to the frame body, a pair of elastic cantilevers connected to the lead body and suspended in the receiving slot for clamping the terminal, and a pair of bridging arms respectively connecting a pair of fixed ends of the pair of elastic cantilevers to the lead body. At least a portion of the fixed ends of each of the elastic cantilevers is wrapped in the frame body.