A method includes forming a leadframe assembly to have a pair of opposing sides, and having semiconductor die receiving portions extending between the opposing sides. The method also includes placing semiconductor dies on the leadframe assembly in the die receiving portions. Each die has a row of leads on each of two opposing sides of the die and a longitudinal axis parallel to the rows of leads. The longitudinal axis of each die is orthogonal to the opposing sides of the leadframe assembly. The method further includes applying mold compound to the semiconductor dies. The method includes punching through the leadframe assembly between the opposing sides using a first tool having a first tool longitudinal axis parallel to longitudinal axes of the dies.

According to the present disclosure, a method of manufacturing a semiconductor device includes the steps of (a) preparing a lead frame including a switching element die pad, a control element die pad, and a third-side side rail portion, (b) mounting a switching element and a diode element on the switching element die pad and mounting a control element configured to control the switching element on the control element die pad, (c) sealing the switching element, the diode element, and the control element with a mold resin such that the power side terminal, the control side terminal, and a part of the third-side side rail portion protrude outward, and (d) forming a third-side side rail terminal by cutting the third-side side rail portion, the third-side side rail terminal extending from a part of the third-side side rail portion.

A semiconductor device includes: a package having a top surface and a bottom surface; a semiconductor element arranged in the package; and a base which is arranged in the package and on which the semiconductor element is mounted. A top surface of the base is exposed to the top surface of the package, and a bottom surface of the base is exposed to the bottom surface of the package.

A lead frame includes a lead frame body processed in a predetermined shape, and including a notched part provided at an end of the lead frame body, the notched part being used as a starting point of tape-removing, a resin leakproof tape stuck on a back surface of the lead frame body, and a region of a periphery of the notched part in the back surface of the lead frame body, the region being reduced in a strength of bonding between the resin leakproof tape and the lead frame body is reduced relative to other region.

A semiconductor device has a substrate and leads formed on two or more sides of the substrate. An electrical component is disposed over the substrate and electrically connected to the lead with bumps or bond wires. The electrical component is encapsulated. A portion of the substrate is removed to form a wettable flank on at least three sides of the lead. The substrate has a molding compound and the lead is disposed within or adjacent to the molding compound. A portion of the molding compound can remain at corners of the substrate. The lead has a first surface or recessed surface on a first side of the lead, a second surface or recessed surface on a second side of the lead, and a third surface or recessed surface on a third side of the lead. A portion of a surface of the lead is plated.

A chip-on-film (COF) package includes a film, a driver integrated circuit (IC) chip disposed on the film, an electrode pad disposed on an edge of the film, and a first deformation-preventing member disposed on the film, between the driver IC chip and the electrode pad.

A lead frame assembly includes a lead frame body, an encapsulant unit, and dicing positioning units. The lead frame body includes lead frame units, an outer frame portion extending around the lead frame units, and through holes formed on the outer frame portion. The encapsulant unit includes a lower encapsulating portion, and an upper encapsulating portion formed on the lower encapsulating portion. The dicing positioning units are respectively located at the through holes, and each includes an adhesive layer which partially fills a corresponding one of the through holes and which is formed with at least one dicing positioning hole. The dicing positioning units define at least one first dicing positioning line and at least one second dicing positioning line.

Embodiments of the present disclosure are directed to flat no-lead packages with wettable sidewalls or flanks. In particular, wettable conductive layers are formed on the package over lateral portions of the leads and on portions of the package body, which may be encapsulation material. The wettable conductive layers may also be formed on bottom surfaces of the package body and the leads. The wettable conductive layers provide a wettable flank for solder to wick up when the package is mounted to a substrate, such as a PCB, using SMT. In particular, solder that is used to join the PCB and the package wicks up the side of the wettable conductive layers along a side surface of the package. In that regard, the solder is exposed and coupled to the side surface of the package at the wettable conductive layers, thereby allowing for a visual inspection of the solder joints. The wettable conductive layers are formed on the package after the package body has been formed. In one embodiment, the wettable conductive layers are printed on the package body and the leads by Aerosol Jet® technology.

A method includes attaching semiconductor dies to die attach pads of first and second columns of the lead frame; enclosing the semiconductor dies of the respective columns in respective first and second package structures; trimming the lead frame to separate respective first and second lead portions of adjacent ones of the first and second columns of the lead frame; moving the first columns along a column direction relative to the second columns; and separating individual packaged electronic devices of the respective first and second columns from one another.

A lead frame strip with corrugated saw street metal where the corrugated saw street metal is comprised of a partial thickness of the lead frame strip metal. A lead frame strip with corrugated saw street metal where the corrugated saw street metal is comprised of a half thickness of the lead frame strip metal.