Provided with a semiconductor apparatus which is able to be miniaturized and is provided with a Peltier element. The semiconductor apparatus is provided with a semiconductor substrate and the Peltier element which is disposed facing the semiconductor substrate. The Peltier element has a first substrate and a thermoelectric semiconductor which is disposed between the first substrate and the semiconductor substrate. The semiconductor substrate has a first electrode provided on a surface side facing the first substrate. The first substrate has a second electrode provided on a surface side facing the semiconductor substrate. The first electrodes and the second electrodes are each connected to the thermoelectric semiconductor.

Provided is an imaging device capable of efficiently dissipating heat from an imaging element. An imaging device 100 includes: an imaging element substrate 4 on which an insulating layer 51 and a conductor layer 52 are stacked and an imaging element 41 is mounted; and a housing 1 that accommodates the imaging element substrate 4. The surface of the imaging element substrate 4 has a mounting region 45 on which an electronic component 43 including the imaging element 41 is mounted, a covered region 46 in which the conductor layer 52 is covered with the insulating layer 51, and an exposed region 47 in which the conductor layer 52 is exposed from the insulating layer 51, and the exposed region 47 is connected to the housing 1.

A camera module includes an optical lens, a light-sensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.

An imaging apparatus is disclosed. The imaging apparatus includes an image sensor including includes a photosensitive region and an anti-shake module including a base, a carrier, a flexible connection member, and an actuator set. The base includes a cavity, a depth of the cavity is greater than or equal to a thickness of the image sensor, the carrier and the image sensor are disposed in the cavity, and the base provides support for the carrier by using the flexible connection member. The carrier includes a through hole, a size of the through hole is greater than or equal to that of the photosensitive region, the carrier is separately electrically connected to the image sensor and the base, and a bottom surface of the carrier is fastened to a top surface of the image sensor. Each actuator in the actuator set includes a fastened end and a movable end.

An image sensor package includes a substrate connected to an image sensor by a bonding wire; a sub-housing disposed adjacent to an upper surface of the substrate so as to surround the bonding wire; and a support member disposed at least partially in a space between the sub-housing and the substrate to limit elastic deformation of the sub-housing, and a portion of the bonding wire is disposed inside the support member.

[Object] Provided is an electronic apparatus capable of Preventing image Quality deterioration of an image captured by a camera while reducing a bezel width.

[Solving Means] An electronic apparatus according to the present disclosure includes a display unit disposed on a first surface, a first imaging unit disposed on the side opposite to a display surface of the display unit, and a second imaging unit disposed on a second surface on the side opposite to the first surface. Sensitivity of the first imaging unit to a first wavelength band that includes blue light is higher than sensitivity of the second imaging unit to the first wavelength band. In addition, a ratio of blue light detection pixels in a pixel array of the first imaging unit may be higher than a ratio of blue light detection pixels in a pixel array of the second imaging unit.

A sensor package structure is provided and includes a substrate, a sensor chip, a ring-shaped supporting layer, and a light-permeable sheet. The sensor chip is disposed on and electrically coupled to the substrate. The ring-shaped supporting layer is disposed on the sensor chip and surrounds a sensing region of the sensor chip. The light-permeable sheet has a ring-shaped notch recessed in a peripheral edge of an inner surface of the light-permeable sheet, and a depth of the ring-shaped notch with respect to the inner surface is at least 10 tim. The light-permeable sheet is disposed on the ring-shaped supporting layer through the ring-shaped notch, and the inner surface is not in contact with the ring-shaped supporting layer, so that the inner surface of the light-permeable sheet, an inner side of the ring-shaped supporting layer, and the top surface of the sensor chip jointly define an enclosed space.

A chip package is provided. The chip package includes a first semiconductor chip, a second semiconductor chip, a first encapsulating layer, a second encapsulating layer, a first through-via, and a second through-via. The second semiconductor chip is stacked on the first semiconductor chip, and the first encapsulating layer and the second encapsulating layer surround the first semiconductor chip and the second semiconductor chip, respectively. In addition, the first through-via and the second through-via penetrate the first encapsulating layer and the second encapsulating layer, respectively, and the second through-via is electrically connected between the second semiconductor chip and the first through-via. A method for forming the chip package are also provided.

A sensor device according to the present disclosure includes: a Peltier element; a sensor element thermally connected to a cooling surface of the Peltier element; and a package substrate that is thermally connected to a heat dissipation surface of the Peltier element and accommodates the Peltier element and the sensor element. In addition, the package substrate has a heat dissipation member, made of a material having a higher thermal conductivity than a material of the package substrate, on at least a part of a surface facing the heat dissipation surface of the Peltier element.

A damping device is provided. The damping device includes a damper including a mechanical deflector. The damping device includes a post coupled to the mechanical deflector. The damping device includes a case in which the damper is disposed.