A device for determining the surface topology and associated color of a structure, such as a teeth segment, includes a scanner for providing depth data for points along a two-dimensional array substantially orthogonal to the depth direction, and an image acquisition means for providing color data for each of the points of the array, while the spatial disposition of the device with respect to the structure is maintained substantially unchanged. A processor combines the color data and depth data for each point in the array, thereby providing a three-dimensional color virtual model of the surface of the structure. A corresponding method for determining the surface topology and associate color of a structure is also provided.

A device for determining the surface topology and associated color of a structure, such as a teeth segment, includes a scanner for providing depth data for points along a two-dimensional array substantially orthogonal to the depth direction, and an image acquisition means for providing color data for each of the points of the array, while the spatial disposition of the device with respect to the structure is maintained substantially unchanged. A processor combines the color data and depth data for each point in the array, thereby providing a three-dimensional color virtual model of the surface of the structure. A corresponding method for determining the surface topology and associate color of a structure is also provided.

A device for determining the surface topology and associated color of a structure, such as a teeth segment, includes a scanner for providing depth data for points along a two-dimensional array substantially orthogonal to the depth direction, and an image acquisition means for providing color data for each of the points of the array, while the spatial disposition of the device with respect to the structure is maintained substantially unchanged. A processor combines the color data and depth data for each point in the array, thereby providing a three-dimensional color virtual model of the surface of the structure. A corresponding method for determining the surface topology and associate color of a structure is also provided.

An imaging sensor includes a color filter, and DBPF that has a transmission characteristic in a visible-light band, a blocking characteristic in a first wavelength band adjacent to a long-wavelength side of the visible-light band, and a transmission characteristic in a second wavelength band that is a part of the first wavelength band. A transmission characteristic of DBPF and a transmission characteristic of each filter part of the color filter are set in such a manner that the second wavelength band of DBPF is included in a third wavelength band that is a wavelength band in which transmittance of the filter parts in colors is approximate to each other on a long-wavelength side of the visible-light band and a fourth wavelength band that is a wavelength band in which a filter part for infrared light has a transmission characteristic.

Systems and methods in accordance with embodiments of the invention implement TDI imaging techniques in conjunction with monolithic CCD image sensors having multiple distinct imaging regions, where TDI imaging techniques can be separately implemented with respect to each distinct imaging region. In many embodiments, the distinct imaging regions are defined by color filters or color filter patterns (e.g. a Bayer filter pattern); and data from the distinct imaging regions can be read out concurrently (or else sequentially and/or nearly concurrently). A camera system can include: a CCD image sensor including a plurality of pixels that define at least two distinct imaging regions, where pixels within each imaging region operate in unison to image a scene differently than at least one other distinct imaging region. In addition, the camera system is operable in a time-delay integration mode whereby time delay-integration imaging techniques are imposed with respect to each distinct imaging region.

An imaging sensor includes a color filter, and DBPF that has a transmission characteristic in a visible-light band, a blocking characteristic in a first wavelength band adjacent to a long-wavelength side of the visible-light band, and a transmission characteristic in a second wavelength band that is a part of the first wavelength band. A transmission characteristic of DBPF and a transmission characteristic of each filter part of the color filter are set in such a manner that the second wavelength band of DBPF is included in a third wavelength band that is a wavelength band in which transmittance of the filter parts in colors is approximate to each other on a long-wavelength side of the visible-light band and a fourth wavelength band that is a wavelength band in which a filter part for infrared light has a transmission characteristic.

An imaging system including a sensor wafer and a logic wafer. The sensor wafer includes a plurality of pixels arranged in rows and columns, the plurality of pixels arranged in rows and columns and including at least a first pixel and a second pixel positioned in a first row included in the rows. The sensor wafer includes a first transfer control line associated with the first row, the first transfer control line coupled to both a first transfer gate of the first pixel and a second transfer gate of the second pixel. The logic wafer includes a first storage capacitor associated with the first pixel and a second storage capacitor associated with the second pixel, a first storage control line coupled to a first storage gate associated with the first pixel and a second storage control line coupled to a second storage gate associated with the second pixel.

An image sensor includes a lower substrate including logic circuits and an upper substrate including pixels. Transistors provided on the upper substrate have the same conductivity type. Each of the transistors includes source/drain regions provided in the upper substrate, an upper gate electrode provided on the upper substrate, and a silicon oxide layer disposed between the upper substrate and the upper gate electrode. The silicon oxide layer is in physical contact with the upper substrate and the upper gate electrode.

A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.

An image processing apparatus includes a correction factor calculating unit configured to calculate a correction factor for correcting a difference in pixel values corresponding to a difference between a spectral sensitivity and a preset reference spectral sensitivity in a predetermined wavelength range at a pixel of interest, based on image data generated by an image sensor, the image sensor having a plurality of pixels on which color filters of a plurality of colors with different spectral transmittances are respectively disposed, the color filters forming a predetermined array pattern, the correction factor calculating unit being configured to calculate the correction factor for each of the plurality of pixels on which at least a predetermined color filter of the color filters is disposed.