Patent classifications
H01L29/225
RESISTIVE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME AND ELECTRONIC DEVICE
A resistive memory device including a first electrode and a second electrode facing each other and a variable resistance layer disposed between the first electrode and the second electrode, wherein the variable resistance layer includes Cd-free quantum dots (Cd-free quantum dots) and at least a portion of the Cd-free quantum dots include a Cd-free quantum dot including a halide anion on a surface of the Cd-free quantum dot, a method of manufacturing the same and an electronic device.
Coated semiconductor nanocrystals and products including same
A coated quantum dot is provided wherein the quantum dot is characterized by having a solid state photoluminescence external quantum efficiency at a temperature of 90 C. or above that is at least 95% of the solid state photoluminescence external quantum efficiency of the semiconductor nanocrystal at 25 C. Products including quantum dots described herein are also disclosed.
Coated semiconductor nanocrystals and products including same
A coated quantum dot is provided wherein the quantum dot is characterized by having a solid state photoluminescence external quantum efficiency at a temperature of 90 C. or above that is at least 95% of the solid state photoluminescence external quantum efficiency of the semiconductor nanocrystal at 25 C. Products including quantum dots described herein are also disclosed.
GALLIUM NITRIDE MATERIALS AND METHODS
The invention provides semiconductor materials including a gallium nitride material layer formed on a silicon substrate and methods to form the semiconductor materials. The semiconductor materials include a transition layer formed between the silicon substrate and the gallium nitride material layer. The transition layer is compositionally-graded to lower stresses in the gallium nitride material layer which can result from differences in thermal expansion rates between the gallium nitride material and the substrate. The lowering of stresses in the gallium nitride material layer reduces the tendency of cracks to form. Thus, the invention enables the production of semiconductor materials including gallium nitride material layers having few or no cracks. The semiconductor materials may be used in a number of microelectronic and optical applications.
GALLIUM NITRIDE MATERIALS AND METHODS
The invention provides semiconductor materials including a gallium nitride material layer formed on a silicon substrate and methods to form the semiconductor materials. The semiconductor materials include a transition layer formed between the silicon substrate and the gallium nitride material layer. The transition layer is compositionally-graded to lower stresses in the gallium nitride material layer which can result from differences in thermal expansion rates between the gallium nitride material and the substrate. The lowering of stresses in the gallium nitride material layer reduces the tendency of cracks to form. Thus, the invention enables the production of semiconductor materials including gallium nitride material layers having few or no cracks. The semiconductor materials may be used in a number of microelectronic and optical applications.
Vertical fin type bipolar junction transistor (BJT) device with a self-aligned base contact
A method of forming a silicon-germanium heterojunction bipolar transistor (hbt) device is provided. The method includes forming a stack of four doped semiconductor layers on a semiconductor substrate. The method further includes forming a dummy emitter contact and contact spacers on a fourth doped semiconductor layer of the stack of four doped semiconductor layers, and removing portions of the second, third, and fourth semiconductor layers to form a vertical fin. The method further includes recessing the second and fourth doped semiconductor layers, and depositing a condensation layer on the second, third, and fourth doped semiconductor layers. The method further includes reacting the condensation layer with the third doped semiconductor layer to form a protective segment on a condensed protruding portion.
SEMICONDUCTOR NANOPARTICLE, SEMICONDUCTOR NANOPARTICLE-CONTAINING DISPERSION LIQUID, AND FILM
An object of the present invention is to provide a semiconductor nanoparticle exhibiting excellent air durability, a semiconductor nanoparticle-containing dispersion liquid containing the semiconductor nanoparticle, and a film containing the semiconductor nanoparticle. In the semiconductor nanoparticle of the present invention, zinc, sulfur, and indium are detected by energy dispersive X-ray analysis, and a molar ratio Zn/In of zinc to indium which is acquired by the energy dispersive X-ray analysis satisfies Expression (1a).
7Zn/In15(1a)
SEMICONDUCTOR NANOPARTICLE, SEMICONDUCTOR NANOPARTICLE-CONTAINING DISPERSION LIQUID, AND FILM
An object of the present invention is to provide a semiconductor nanoparticle exhibiting excellent air durability, a semiconductor nanoparticle-containing dispersion liquid containing the semiconductor nanoparticle, and a film containing the semiconductor nanoparticle. In the semiconductor nanoparticle of the present invention, zinc, sulfur, and indium are detected by energy dispersive X-ray analysis, and a molar ratio Zn/In of zinc to indium which is acquired by the energy dispersive X-ray analysis satisfies Expression (1a).
7Zn/In15(1a)
Light-activated compositions and methods using the same
The invention includes light-activated compositions and methods that are useful for promoting cell death or growth. In certain embodiments, the compositions comprise quantum dots (QD).
Heterostructure of an Electronic Circuit Having a Semiconductor Device
An electronic circuit having a semiconductor device is provided that includes a heterostructure, the heterostructure including a first layer of a compound semiconductor to which a second layer of a compound semiconductor adjoins in order to form a channel for a 2-dimensional electron gas (2DEG), wherein the 2-dimensional electron gas is not present. In aspects, an electronic circuit having a semiconductor device is provided that includes a III-V heterostructure, the III-V heterostructure including a first layer including GaN to which a second layer adjoins in order to form a channel for a 2-dimensional electron gas (2DEG), and having a purity such that the 2-dimensional electron gas is not present. It is therefore advantageous for the present electronic circuit to be enclosed such that, in operation, no light of wavelengths of less than 400 nm may reach the III-V heterostructure and free charge carriers may be generated by these wavelengths.