A method for forming an interconnect structure is provided. The method for forming the interconnect structure includes forming a first dielectric layer over a substrate, forming a first conductive feature through the first dielectric layer, etching the first conductive feature to form a recess over the first conductive feature, forming a second dielectric layer over the first dielectric layer and filling the recess, etching the second dielectric layer to form an opening exposing an upper surface of the first conductive feature, and forming a second conductive feature in the opening.

A semiconductor device includes channel region, first and second two-dimensional metallic contacts, a gate structure, and first and second metal contacts. The channel region includes a two-dimensional semiconductor material. The first two-dimensional metallic contact is disposed at a side of the channel region and includes a two-dimensional metallic material. The second two-dimensional metallic contact is disposed at an opposite side of the channel region and includes the two-dimensional metallic material. The gate structure is disposed on the channel region in between the first and second two-dimensional metallic contacts. The first metal contact is disposed at an opposite side of the first two-dimensional metallic contact with respect to the channel region. The second metal contact is disposed at an opposite side of the second two-dimensional metallic contact with respect to the channel region. The first and second two-dimensional metallic contacts contact sideways the channel region to form lateral semiconductor-metallic junctions.

A semiconductor device includes a first source/drain structure including a first semiconductor region and a first electrode in electrical contact with the first semiconductor region; a second source/drain structure including a second semiconductor region and a second electrode in electrical contact with the second semiconductor region; a channel between the first semiconductor region and the second semiconductor region; and a gate structure including a gate insulating film covering the channel and a gate electrode covering the gate insulating film. The first source/drain structure further includes a silicide film between the first semiconductor region and the first electrode and a conductive barrier between the silicide film and the first electrode. The conductive barrier includes a conductive two-dimensional material.

An active matrix substrate includes: a first oxide semiconductor layer including a first channel region; a first gate electrode disposed on the substrate side of the first oxide semiconductor layer; a channel protection layer disposed on a side of the first oxide semiconductor layer opposite to the substrate and covering the first channel region; a first TFT having a first source electrode and a first drain electrode in an upper layer of the channel protection layer; a second oxide semiconductor layer; a second gate electrode disposed on a side of the second oxide semiconductor layer opposite to the substrate; and the second TFT having a second source electrode and a second drain electrode disposed on an interlayer insulating layer that covers the second gate electrode, wherein the first oxide semiconductor layer and the second oxide semiconductor layer are formed of the same layered oxide semiconductor film, the layered oxide semiconductor film has a layered structure including a high mobility oxide semiconductor film and a low mobility oxide semiconductor film disposed on the substrate side of the high mobility oxide semiconductor film and having a lower mobility than a mobility of the high mobility oxide semiconductor film, and the channel protection layer of the first TFT and the gate insulating layer of the second TFT are formed of the same insulating film.

A thin film transistor includes an active layer including an oxide semiconductor layer, a metal layer disposed on the active layer and overlapping with at least a portion of the active layer, a gate electrode spaced apart from the active layer, and overlapping with at least a portion of the active layer, and a gate insulating film between the active layer and the gate electrode, wherein the active layer includes a channel portion, a first connection portion contacting one side of the channel portion, and a second connection portion contacting the other side of the channel portion, and wherein the metal layer includes a first metal layer contacting an upper surface of the first connection portion, and a second metal layer contacting an upper surface of the second connection portion, a fabrication method of the thin film transistor, and a display apparatus comprising the same.

A thin film transistor substrate and a display device comprising the same are provided, in which the thin film transistor substrate comprises a first thin film transistor on a base substrate, and a second thin film transistor on the first thin film transistor, wherein the first thin film transistor includes a first active layer on the base substrate, a first gate electrode spaced apart from the first active layer, and a first source electrode and a first drain electrode, which are spaced apart from each other and connected to the first active layer, the second thin film transistor includes a second active layer on the base substrate, a second gate electrode spaced apart from the second active layer, and a second source electrode and a second drain electrode, which are spaced apart from each other and connected to the second active layer, and one of the first source electrode and the first drain electrode is connected to one of the second source electrode and the second drain electrode.

A thin film transistor and a display device comprising the same are provided, in which the thin film transistor includes an active layer, a metal oxide layer on the active layer, a gate insulating layer on the metal oxide layer, and a gate electrode on the gate insulating layer, wherein the metal oxide layer is disposed between the active layer and the gate insulating layer to contact the active layer and the gate insulating layer.

A thin film transistor, a fabricating method of the thin film transistor and a display device comprising the thin film transistor are provided. The thin film transistor can include a source electrode and a drain electrode disposed on a substrate and spaced apart from each other with a gap area formed therebetween, a first active layer disposed in the gap area between the source electrode and the drain electrode, and a gate insulating layer covering the source electrode, the first active layer and the drain electrode. The thin film transistor can further include a gate electrode disposed on the gate insulating layer and overlapping the first active layer. The first active layer can be in contact with a side of the source electrode and a side of the drain electrode.

A buried power rail contact structure is provided that wraps around a source/drain region of a first field effect transistor (FET), contacts a surface of a buried power rail, and has a reduced height as compared to a height of a neighboring source/drain contact structure that contacts a surface of a source/drain region of a second FET. Both the buried power rail contact structure and the source/drain contact structure have a negative taper, i.e., each of the buried power rail contact structure and the source/drain contact structure has outermost sidewalls that slope outward from a topmost surface of the contact structure to a bottommost surface of the contact structure. Such contact structures reduce the parasitic capacitance between a functional gate structure and the contact structure.

A semiconductor device includes an active pattern on a substrate, source/drain patterns on the active pattern, a plurality of channel layers stacked on the active pattern to be vertically spaced apart from each other and connecting the source/drain patterns with each other, a gate electrode between the source/drain patterns to cross the active pattern and to surround the channel layers, and active contacts at opposite sides of the gate electrode to cover top surfaces of the source/drain patterns. A width of each of the active contacts is smaller than or equal to the largest width of each of the source/drain patterns. Each of the top surfaces of the source/drain patterns has an inclined surface that is inclined relative to a top surface of the substrate, and each of the active contacts includes a protruding portion that protrudes toward the inclined surface.