H01L31/022441

SOLAR CELL MODULE
20230163222 · 2023-05-25 · ·

A solar battery module having high photoelectric conversion efficiency and superior aesthetic appearance. A solar battery module comprises a plate-shaped front-surface protection material having, on an exterior peripheral part, a light-blocking region that blocks light; a plurality of solar battery strings each having a plurality of solar battery cells that are aligned in one line in a first direction and connected, the plurality of solar battery strings being positioned aligned in a second direction that intersects with the first direction on the back side of the front-surface protection material; a plate-shaped or sheet-shaped back-surface protection material positioned on the back side of the plurality of solar battery strings; and a sealing material filled between the front-surface protection material and the back-surface protection material. The solar battery strings are arranged so that a portion of at least one end of the solar battery cells overlaps with the light-blocking region.

LASER STOP LAYER FOR FOIL-BASED METALLIZATION OF SOLAR CELLS

Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. For example, a method of fabricating a solar cell involves forming a plurality of alternating N-type and P-type semiconductor regions in or above a substrate. The method also involves forming a paste between adjacent ones of the alternating N-type and P-type semiconductor regions. The method also involves curing the paste to form non-conductive material regions in alignment with locations between the alternating N-type and P-type semiconductor regions. The method also involves adhering a metal foil to the alternating N-type and P-type semiconductor regions. The method also involves laser ablating through the metal foil in alignment with the locations between the alternating N-type and P-type semiconductor regions to isolate regions of remaining metal foil in alignment with the alternating N-type and P-type semiconductor regions. The non-conductive material regions act as a laser stop during the laser ablating.

TRANSFERABLE ULTRA-THIN SUBSTRATES AND RELATED TECHNIQUES

A device, comprising: a flexible carrier; a release layer that is formed on the flexible carrier; a releasable substrate formed over the release layer; and a semiconductor structure that is formed over the releasable substrate.

Solar cell, solar cell production method, and solar cell module
11621358 · 2023-04-04 · ·

A solar cell in which performance degradation caused by an alkali component is suppressed. A solar cell is a back-contact solar cell that comprises a semiconductor substrate; a p-type semiconductor layer, and a first electrode layer corresponding thereto, layered sequentially on one part of the rear side of the semiconductor substrate; an n-type semiconductor layer, and a second electrode layer corresponding thereto, layered sequentially on another part of the rear side of the semiconductor substrate. One part of the n-type semiconductor layer lies directly atop one part of the adjacent p-type semiconductor layer. The first electrode layer is separate from the n-type semiconductor layer and covers the p-type semiconductor layer. The second electrode layer covers the entirety of an overlapping portion where the n-type semiconductor layer lies atop the p-type semiconductor layer.

WELDING METHOD FOR WELDING STRIP OF BACK-CONTACT SOLAR CELL CHIP

A welding method for a welding strip of a back-contact solar cell chip includes the following steps: firstly, welding small chip assemblies of a back-contact solar cell to be interconnected to form a small cell string through an interconnected bar; then, punching the small cell string into small cell assemblies separated from each other through a cutting or punching process; subsequently, flexibly welding the small cell assemblies by a bus bar to reach a required length of a finished assembly product; and finally, breaking the bus bar through a post cutting or punching process to form cell assemblies with positive and negative electrodes connected in series or in parallel. The method makes the welding surfaces of the solar cell chips be on the same surface through using the back-contact solar cell chips, so that the interconnected bar of the solar cell chips can be welded rapidly and continuously.

Solar cell module including solar cells

The finger electrode is formed by hard-soldered silver paste. The melting point of the first type solder layer provided on the surface of the terminal wiring member is higher than the melting point of the second type solder layer provided on the surface of the wire. The first width, in the first direction, of the second type solder layer in the first portion where the wire is connected to the terminal wiring member is larger than the second width, in the first direction, of the second type solder layer in the second portion where the wire is connected to the finger electrode.

PERC SOLAR CELL SELECTIVE EMITTER, PERC SOLAR CELL AND MANUFACTURING METHOD THEREFOR

A PERC solar cell selective emitter includes a silicon wafer, first and second doped regions and a laser doped region with doped layers. First doped regions are located between the doped regions of each doped layer, and each second doped region is located between two adjacent doped layers. The PERC solar cell includes the selective emitter, a front anti-reflective layer on the surface of a front passivation layer, and a positive electrode. The positive electrode includes first silver paste layers on the surfaces of the laser doped regions and second silver paste layers on the surface of the front anti-reflective layer corresponding to the first doped regions. The second silver paste layers are in electrical contact with the first silver paste layers. Damage of laser to silicon wafers is reduced, compounding in silver paste areas is reduced, an open circuit voltage is increased, and battery efficiency is improved.

BUSBAR-FREE INTERDIGITATED BACK CONTACT SOLAR CELL AND INTERDIGITATED BACK CONTACT SOLAR CELL MODULE
20230144807 · 2023-05-11 ·

Provided is a busbar-free interdigitated back contact (IBC) solar cell and an IBC solar cell module. The IBC solar cell includes a semiconductor substrate, finger electrode lines and conductive lines. The finger electrode lines include first finger electrode lines and second finger electrode lines that are alternately arranged on the semiconductor substrate. The conductive lines include first conductive lines and second conductive lines that are alternately arranged. The first conductive lines are connected to the first finger electrode lines and spaced apart from the second finger electrode lines. The second conductive lines are connected to the second finger electrode lines and spaced apart from the first finger electrode lines.

Laser assisted metallization process for solar cell circuit formation

A method of fabricating solar cell, solar laminate and/or solar module string is provided. The method may include: locating a metal foil over a plurality of semiconductor substrates; exposing the metal foil to laser beam over selected portions of the plurality of semiconductor substrates, wherein exposing the metal foil to the laser beam forms a plurality conductive contact structures having of locally deposited metal portion electrically connecting the metal foil to the semiconductor substrates at the selected portions; and selectively removing portions of the metal foil, wherein remaining portions of the metal foil extend between at least two of the plurality of semiconductor substrates.

Method of making a current collecting grid for solar cells

Method of making a current collecting grid for solar cells, including the steps of a) providing a continuous layer stack (1) on a substrate (8), the layer stack (1) including an upper (2) and a lower (3) conductive layer having a photoactive layer (4) interposed there between; b) selectively removing the upper conductive layer (2) and the photoactive layer (4) for obtaining a first contact hole (10) extending through the upper conductive layer (2) and photoactive layer (4) exposing the lower conductive layer (3); c) printing a front contact body (4) on the upper conductive layer (2) and a back contact body (5) in the first contact hole (10) on the lower conductive layer (3) and forming an electrically insulating first gap surrounding the back contact body (5) between the upper conductive layer (2) and the back contact body (2).