The present disclosure relates to a photodiode comprising a first part made of silicon and a second part made of doped germanium lying on and in contact with the first part, the first part comprising a stack of a first area and of a second area forming a p-n junction and the doping level of the germanium increasing as the distance from the p-n junction increases.

In one aspect, nanostructured films are described herein comprising controlled architectures on multiple length scales (e.g. 3). As described further herein, the ability to control film properties on multiple length scales enables tailoring structures of the films to specific applications including, but not limited to, optoelectronic, catalytic and photoelectrochemical cell applications. In some embodiments, a nanostructured film comprises a porous inorganic scaffold comprising particles of an electrically insulating inorganic oxide. An electrically conductive metal oxide coating is adhered to the porous inorganic scaffold, wherein the conductive metal oxide coating binds adjacent particles of the insulating inorganic oxide.

Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures are described. The microstructures, such as pillars and/or holes, effectively increase the effective absorption length resulting in a greater absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more.

A display panel and a manufacturing method thereof are provided. The display panel comprises a glass substrate, an insulating layer, a polysilicon layer, a gate insulating layer, a gate layer, an interlayer insulating layer, and a source-drain contacting layer, wherein the polysilicon layer is defined with a first doped region, a second doped region, and a third doped region. The source-drain contacting layer contacts the first doped region and the third doped region. A doping type of the first doped region and a doping type of the third doped region are different so that the first doped region and the third doped region form a PN structure. Doping type of the first doped region and a doping type of the second doped region are same.

A photodetector according to an embodiment includes: a first semiconductor layer; a porous semiconductor layer disposed on the first semiconductor layer; and at least one photo-sensing element including a second semiconductor layer of a first conductivity type disposed in a region of the porous semiconductor layer and a third semiconductor layer of a second conductivity type disposed on the second semiconductor layer.

An image sensor with high quantum efficiency is provided. In some embodiments, a semiconductor substrate includes a non-porous semiconductor layer along a front side of the semiconductor substrate. A periodic structure is along a back side of the semiconductor substrate. A high absorption layer lines the periodic structure on the back side of the semiconductor substrate. The high absorption layer is a semiconductor material with an energy bandgap less than that of the non-porous semiconductor layer. A photodetector is in the semiconductor substrate and the high absorption layer. A method for manufacturing the image sensor is also provided.

Display panels are provided. The display panel includes a substrate and a thin film transistor (TFT) disposed on the substrate. The TFT includes a polysilicon layer, a gate layer, and a source-drain contacting layer. The polysilicon layer includes a first portion corresponding to the gate layer, two second portions disposed on two opposite sides of the first portion, two third portions disposed on two outer sides of the two second portions away from the first portion, and a fourth portion. The fourth portion is disposed on one of the two third portions to define a PN structure therebetween. The source-drain contacting layer is disposed on the gate layer and electrically contacts the fourth portion and the two third portions.

Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures are described. The microstructures, such as pillars and/or holes, effectively increase the effective absorption length resulting in a greater absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more.

The porous silicon nanowire photovoltaic cell includes a first electrode, an n-type silicon layer, and a second electrode, which is formed from a transparent electrode with at least one metal contact. An array of porous silicon nanowires is sandwiched between the second electrode and the n-type silicon layer. Each of the porous silicon nanowires is formed from a porous n-type silicon core coated with a layer of p-type silicon. Empty spaces between the porous silicon nanowires of the array may be filled with indium tin oxide, thus forming a photoactive region formed from the array of porous silicon nanowires embedded in indium tin oxide. An up-conversion layer is sandwiched between the first electrode and the n-type silicon layer. Any suitable type of up-conversion material may be used for the up-conversion layer, such as NaYR.sub.4:ErYb or the like. Alternatively, the up-conversion layer may be replaced by a down-conversion layer.

An image sensor with high quantum efficiency is provided. In some embodiments, a semiconductor substrate includes a non-porous semiconductor layer along a front side of the semiconductor substrate. A periodic structure is along a back side of the semiconductor substrate. A high absorption layer lines the periodic structure on the back side of the semiconductor substrate. The high absorption layer is a semiconductor material with an energy bandgap less than that of the non-porous semiconductor layer. A photodetector is in the semiconductor substrate and the high absorption layer. A method for manufacturing the image sensor is also provided.