H01L31/0322

METHODS AND APPARATUS FOR IMAGE SENSOR SEMICONDUCTORS
20200006412 · 2020-01-02 ·

Methods and apparatus form an image sensor pixel circuit on flexible and non-flexible substrates. At least one indium-gallium-zinc-oxide (IGZO) thin film transistor (TFT) is formed at a process temperature of approximately 400 degrees Celsius or less and at least one photodiode is formed on at least one of the at least one IGZO TFT. The at least one photodiode having an absorption layer formed, at least in part, by depositing a copper-indium-gallium-selenium (CIGS) material with a gallium mole fraction of approximately 35% to approximately 70% at a process temperature of less than or equal to approximately 400 degrees Celsius and doping the CIGS material with antimony at a process temperature of less than or equal to approximately 400 degrees Celsius.

SOLAR CELL, MULTI-JUNCTION SOLAR CELL, SOLAR CELL MODULE, AND SOLAR POWER GENERATION SYSTEM

A solar cell of an embodiment includes: a substrate; an n-electrode; an n-type layer; a p-type light absorption layer which is a semiconductor of a Cu-based oxide; and a p-electrode. The n-electrode is disposed between the substrate and the n-type layer. The n-type layer is disposed between the n-electrode and the p-type light absorption layer. The p-type light absorption layer is disposed between the n-type layer and the p-electrode. The n-type layer is disposed closer to a light incident side than the p-type light absorption layer. The substrate is a single substrate included in the solar cell.

PHOTOELECTRIC CONVERSION DEVICE, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE
20200006413 · 2020-01-02 · ·

A photoelectric conversion device includes: a photoelectric conversion section containing an oxide semiconductor; and a transistor provided corresponding to the photoelectric conversion section, wherein a semiconductor layer of the transistor is made of the same material as that of the oxide semiconductor.

METHODS AND APPARATUS FOR PRODUCING COPPER-INDIUM-GALLIUM-SELENIUM (CIGS) FILM
20200006581 · 2020-01-02 ·

Methods and apparatus form a photon absorber layer of a photodiode with characteristics conducive to applications such as, but not limited to, image sensors and the like. The absorber layer uses a copper-indium-gallium-selenium (CIGS) material with a gallium mole fraction of approximately 35% to approximately 70% to control the absorbed wavelengths while reducing dark current. Deposition temperatures of the absorber layer are controlled to less than approximately 400 degrees Celsius to produce sub-micron grain sizes. The absorber layer is doped with antimony at a temperature of less than approximately 400 degrees Celsius to increase the absorption.

Copolymer including ultraviolet light-absorbing group and compositions including the same

A copolymer that includes first divalent units having a pendent ultraviolet absorbing group, second divalent units represented by formula (I):, and third divalent units represented by formula (II):. Each R.sup.1 is independently hydrogen or methyl; R.sup.2 is a straight-chain or branched alkyl having from 1 to 20 carbon atoms; V is O or NH; W is alkylene having from 1 to 10 carbon atoms; and each R is independently alkyl having from 1 to 6 carbon atoms. Compositions including the copolymer, for example, pressure sensitive adhesive compositions are disclosed. Articles including the compositions are disclosed. For example, an assembly including a barrier film and the pressure sensitive adhesive composition is also disclosed. ##STR00001##

Absorber surface modification

The present disclosure provides systems and methods for depositing an alkaline metal layer on an absorber to generate a copper-poor region at a surface of the absorber. The copper-poor region provides an increased efficiency over non-treated absorbers having copper-rich surfaces. The alkaline metal layer may be deposited by any suitable deposition method, such as, for example, a wet deposition method. After the alkaline metal layer is deposited, the absorber is annealed, causing the alkaline metal layer to interact with the absorber to reduce the copper-profile of the absorber at the interface between the alkaline metal layer and the absorber.

Multilayered luminescent solar concentrators based on engineered quantum dots
11929443 · 2024-03-12 ·

Luminescent solar concentrators (LSCs) based on engineered quantum dots (QDs) are disclosed that include at least one lower band-gap energy LSC layer and at least one higher band-gap energy LSC layer. The higher band-gap energy LSC layer has a higher internal quantum efficiency (IQE) than the lower band-gap energy LSC layer. The lower band-gap energy LSC layer may broadly absorb the remainder of the solar spectrum that is not absorbed by previous layers. An external optical efficiency (EQE) of at least 6%, and in some cases, more than 10%, may be achieved by such LSCs.

IMAGING DEVICE AND ELECTRONIC DEVICE
20240048868 · 2024-02-08 ·

An imaging device that facilitates pooling processing. A pixel region includes a plurality of pooling modules and an output circuit, the pooling module includes a pooling circuit and a comparison module, the pooling circuit includes a plurality of pixels and an arithmetic circuit, and the comparison module includes a plurality of comparison circuits and a determination circuit. The pixel can obtain a first signal through photoelectric conversion, and can multiply the first signal by a given scaling factor to generate a second signal. The pooling circuit adds a plurality of second signals in the arithmetic circuit to generate a third signal, the comparison module compares a plurality of third signals and outputs the largest third signal to the determination circuit, and the determination circuit determines the largest third signal and binarizes it to generate a fourth signal. In the imaging device, the pooling module performs pooling processing in accordance with the number of pixels and outputs data obtained by the pooling processing.

Photoelectric chip, manufacturing method and installation method

Provided are a photoelectric chip, a manufacturing method and an installation method, which relate to the field of optical communication and transmission technologies. The chip is provided with a light-splitting groove (3), and the light-splitting groove (3) runs through an absorption layer (2) of the chip; the back of the chip is a light-entering side; the light-splitting groove (3) is configured to transmit and split out part (151) of incident light (15), and the other part (152) of the incident light (15) enters the absorption layer (2) for photovoltaic conversion. The photoelectric chip can split light and monitor optical power of the incident light.

FABRICATING THIN-FILM OPTOELECTRONIC DEVICES WITH MODIFIED SURFACE

A method (200) for fabricating thin-film optoelectronic devices (100), the method comprising: providing a substrate (110), forming a back-contact layer (120); forming at least one absorber layer (130) made of an ABC chalcogenide material, adding at least one alkali metal (235), and forming at least one cavity (236, 610, 612, 613) at the surface of the absorber layer wherein forming of said at least one cavity is by dissolving away from said surface of the absorber layer at least one crystal aggregate comprising at least one alkali crystal comprising at least one alkali metal. The method (200) is advantageous for more environmentally-friendly production of photovoltaic devices (100) on flexible substrates with high photovoltaic conversion efficiency and faster production rate.